EPF10K200EGC599-1 vs EPF10K250EGC599-1 对比

详细并排对比 EPF10K200EGC599-1 出自 Intel 和 EPF10K250EGC599-1 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

Intel
EPF10K200EGC599-1 EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

EPF10K200EGC599-1 - FLEX 10KE 200K Gates FPGA 599-CPGA | Intel / Altera

EPF10K200EGC599-1 ⚠ 最后一次采购

规格对比

参数 EPF10K200EGC599-1 EPF10K250EGC599-1
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 最后采购期 不推荐新设计
库存状态 有库存 有库存
单价(USD) $880.00 $162.00
Family FLEX 10KE —
Logic Elements (LEs) 9,984 —
Typical Gates 200,000 —
Embedded Array Blocks (EABs) 470 —
Total RAM Bits 98,304 —
Core Supply Voltage 2.375 V to 2.625 V —
I/O Voltage Tolerance 5.0 V tolerant —
引脚数量 599 599
Package Type 599-BCPGA (Ceramic Pin Grid Array) —
Package Dimensions 62.48 x 62.48 mm —
安装类型 Through-Hole (Socket or Solder) Through-Hole (PGA)
工作温度 0C to +70C (Commercial) 0C to +70C (Commercial)
Programming Interface JTAG (IEEE 1149.1) JTAG (IEEE 1149.1), passive serial
PLLs 4 —
RoHS 状态 [DATA_NEEDED: RoHS status of ceramic CPGA variant] unknown (ceramic HIPGA package historically non-RoHS)
Product Type — FPGA (Field-Programmable Gate Array)
Series — FLEX 10K
Logic Elements — 40,960
Equivalent Gates — 250,000
Flip-Flops — 12,160
User I/O Pins — 470
Embedded Array Blocks (EAB) — 20 (2 Kbit each)
封装 — 599-BPGA / HIPGA-599 (Ceramic Pin Grid Array)
Configuration — SRAM (volatile), serial/parallel EPROM
Process Node — 0.42 µm CMOS
I/O Standard Support — 5.0 V PCI, LVTTL, LVCMOS
MSL 等级 — [DATA_NEEDED: moisture sensitivity level]

数据手册与资源

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