EPF10K20RC240-4 - FLEX 10K FPGA 20K Gates 240-BFQFP | Intel
부품 번호: EPF10K20RC240-4 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $104.66 | $104.66 |
| 10 | $95.2 | $952.00 |
| 100 | $82.4 | $8,240.00 |
| 500 | $74.1 | $37,050.00 |
| 1,000 | $67.85 | $67,850.00 |
EPF10K20RC240-4 개요
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit hierarchically below ASICs and above standard logic in flexibility-vs-cost, and the FLEX 10K family specifically pioneered embedded array blocks (EABs) for on-chip SRAM/ROM, enabling system-on-chip integration of logic plus memory in one device.
Key features of the EPF10K20RC240-4 include 12,288 typical gates, 1,152 logic elements (cells), 144 LABs, 189 user I/Os, 5 V core operation, and a 240-pin BFQFP exposed-pad package for improved thermal dissipation. The -4 speed grade corresponds to a slower timing bin than -3 but offers cost advantages for designs that do not require maximum clock rates. The exposed-pad (EP) construction provides a low thermal-resistance path to PCB copper for reliable operation up to the rated junction temperature.
Typical applications include glue logic and bus interfacing in industrial control systems, legacy telecom infrastructure, prototyping platforms for ASICs, and educational hardware where the FLEX 10K family remains widely supported by the legacy Altera MAX+PLUS II / Quartus tool flow. The 189 I/O count is well matched to peripheral-rich embedded designs.
When designing with this device, ensure adequate decoupling on all VCCINT/VCCIO pins and follow Altera's BFQFP land-pattern recommendations to avoid solder-joint fatigue. The -4 speed grade is the slowest of the FLEX 10K20 family - verify timing closure before substituting -3 or unmarked parts.
This page synthesizes distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not aggregated in any single manufacturer datasheet.
드롭인 대체품: EPF10K20RC240-4 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: EPF10K20RC240-4 (동일 폼 팩터 및 풋프린트) — 차이점: Package, RoHS Status, Family, Mounting Type, Logic Array Blocks (LABs).
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
EPF10K20RC240-3
✅ 드롭인✓ 재고 있음
$21.2 / 개
데이터시트 보기 →EPF10K20RC240-3N
✅ 드롭인✓ 재고 있음
$23.1 / 개
데이터시트 보기 →EPF10K20RC240-4N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
EPF10K20RC208-4
✅ 드롭인✓ 재고 있음
$19.85 / 개
데이터시트 보기 →EPF10K20RC240-4 최대 정격 & 전기적 특성
| Family | FLEX 10K |
| Typical Gates | 20,000 |
| Logic Elements / Cells | 1,152 |
| Logic Array Blocks (LABs) | 144 |
| User I/Os | 189 |
| 패키지 | 240-BFQFP Exposed Pad (RQFP) |
| 핀 수 | 240 |
| 공급 전압 | 5 V |
| Process Technology | 0.42 µm CMOS |
| 동작 온도 | 0 °C to 70 °C |
| Speed Grade | -4 |
| Propagation Delay | 0.4 ns (per DigChip) |
| 실장 유형 | Surface Mount |
| RoHS 상태 | non_compliant (legacy BFQFP, SnPb finish) |
| Embedded Memory | EAB (Embedded Array Block) SRAM/ROM |
EPF10K20RC240-4 240-bfqfp exposed pad (rqfp) 핀 구성 가이드
EPF10K20RC240-4(240-bfqfp exposed pad (rqfp) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: EPF10K20RC240-4.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
EPF10K20RC240-4 적합 용도: 6 애플리케이션s: Industrial Glue Logic and Bus Interfacing, Legacy Telecom Infrastructure, ASIC Prototyping Platform, Educational Hardware and FPGA Training, Test and Measurement Equipment Backplanes, Military and Aerospace Legacy Avionics.
Industrial Glue Logic and Bus Interfacing
The EPF10K20RC240-4 excels as glue logic between legacy microcontrollers, memory, and peripheral buses in industrial control systems. Its 189 user I/Os handle address/data multiplexing, chip-select decoding, and timing-protocol bridging in a single device, replacing dozens of 74-series logic gates. The 5 V tolerant I/Os and 0.70 C operating range align with factory-floor temperature profiles, while 1,152 logic elements provide ample headroom for state-machine-rich protocol converters (e.g., ISA-to-PCI, VME bridge logic).
추천
Legacy Telecom Infrastructure
In telecom central-office equipment of the 1990s-2000s era, the EPF10K20RC240-4 implemented framing, line-card control, and backplane arbitration functions. Its embedded array blocks (EABs) provide on-chip dual-port SRAM for small FIFO buffers between TDM time slots, eliminating external RAM and reducing board area. The 240-BFQFP exposed-pad package is robust against the vibration and thermal cycling of telecom racks, and Altera's mature configuration bitstream toolchain (MAX+PLUS II) ensures bitstream reproducibility for decades-long field support.
추천
ASIC Prototyping Platform
Designers used the EPF10K20RC240-4 as an FPGA prototype before committing an ASIC to fab, validating RTL logic at near-ASIC clock rates thanks to the -3 and -4 speed grades. The 1,152 logic elements plus EAB SRAM map cleanly to standard-cell ASIC gate libraries, and Quartus II synthesis reports correlate well with ASIC synthesis timing. For digital-signal-processing or bus-protocol prototypes that will eventually migrate to a 0.18 µm ASIC, the 240-BFQFP exposed pad provides the thermal margin needed for sustained burn-in testing.
추천
Educational Hardware and FPGA Training
University digital-design labs adopted the EPF10K20RC240-4 on Altera UP2 and similar education boards because the FLEX 10K family balances logic density, JTAG-friendly configuration, and student-friendly MAX+PLUS II GUI. The 189 I/Os expose students to buses, LEDs, seven-segment displays, and VGA/PS2 interfaces simultaneously, and the EAB SRAM teaches embedded-memory concepts. The device remains in active use at universities worldwide, and the legacy toolchain is freely downloadable for educational purposes.
추천
Test and Measurement Equipment Backplanes
Instruments such as logic analyzers, protocol testers, and modular ATE systems used the EPF10K20RC240-4 as a backplane arbiter between instrument cards. Its 189 I/Os accommodate multi-drop test buses, trigger distribution, and high-speed pattern generation, while the embedded EABs implement deep pattern-capture FIFOs. The exposed-pad 240-BFQFP package ensures reliable operation across the 0 °C to 70 °C commercial-industrial range typical of laboratory environments.
추천
Military and Aerospace Legacy Avionics
Avionics LRUs (line-replaceable units) from the late 1990s incorporate the EPF10K20RC240-4 for MIL-STD-1553 bus termination, ARINC 429 decoding, and discrete I/O aggregation. Although not formally MIL-PRF-38535 qualified, the plastic BFQFP package has demonstrated decades-long field reliability in commercial-derivative military systems. Because avionics programs demand 20+ year sustainment, the EPF10K20RC240-4 remains in active procurement through brokers and franchised inventory for these long-life platforms.
추천
추천 제품 요약
엔지니어링 참조 데이터: EPF10K20RC240-4 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | EPF10K20RC240-3 | EPF10K20RC240-3N | EPF10K20RC240-4N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same |
| Family | FLEX 10K | FLEX 10K - same | FLEX 10K - same | FLEX 10K - same |
| Logic Elements / Cells | 1,152 | 1,152 | 1,152 | 1,152 |
| Typical Gates | 20,000 | 20,000 | 20,000 | 20,000 |
| User I/Os | 189 | 189 | 189 | 189 |
| Speed Grade | -4 (slowest) | -3 (one bin faster) | -3 (one bin faster) | -4 (same speed grade) |
| RoHS / Pb-Free | SnPb finish (non-RoHS) | SnPb (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
주요 차별점
- Original baseline FLEX 10K20 with -4 speed grade (vs EPF10K20RC240-3)
- SnPb finish for legacy assembly lines (vs EPF10K20RC240-4N)
- 189 user I/Os in a single 240-BFQFP package (vs EPF10K20RC208-4)
설계 노트
The 240-BFQFP exposed-pad package requires the central thermal pad to be soldered to a PCB copper pour of at least 1 square inch for rated operation. Estimated: at 5 V VCCINT and typical 200 mA active current, junction-to-ambient thermal resistance is roughly 25 C/W with a 1 in² 4-layer copper pour, supporting 0 °C to 70 °C operation at moderate toggle rates. Without the EP soldered, internal junction temperatures may exceed 100 °C during continuous operation.
Place 0.1 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair, plus bulk 10 µF tantalum capacitors at each supply rail entry point. The 240-BFQFP package has 1.27 mm pitch - route signals on inner layers to avoid crosstalk on long outer-layer traces. Follow Altera's recommended 4-layer stack-up with continuous ground plane beneath the device to control return-path impedance for the JTAG configuration signals (TCK, TMS, TDI, TDO).
Critical pitfalls when migrating between FLEX 10K20 speed grades: (1) verify that the -3 part's improved timing margin is genuine for your specific design paths, not just nominal; (2) the 'N' suffix denotes Pb-free finish and is electrically identical but may have different reflow-profile requirements (peak 260 °C vs 220 °C); (3) configuration bitstreams are speed-grade-dependent - do not use a -3 bitstream on a -4 device without resynthesis; (4) JTAG chain order matters when programming multiple devices via ByteBlaster.
규정 준수 정보
Original EPF10K20RC240-4 is non-RoHS (SnPb finish). The EPF10K20RC240-4N variant is Pb-free/RoHS-compliant. Not AEC-Q100 qualified; FLEX 10K is a commercial/industrial family not automotive-grade.
