EPF10K20RC240-4 - FLEX 10K FPGA 20K Gates 240-BFQFP | Intel
部品番号: EPF10K20RC240-4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $104.66 | $104.66 |
| 10 | $95.2 | $952.00 |
| 100 | $82.4 | $8,240.00 |
| 500 | $74.1 | $37,050.00 |
| 1,000 | $67.85 | $67,850.00 |
EPF10K20RC240-4 概要
An FPGA (Field Programmable Gate Array) is a type of integrated circuit containing an array of programmable logic blocks, interconnect, and I/O cells that can be configured by the customer after manufacturing to implement arbitrary digital logic functions. FPGAs sit hierarchically below ASICs and above standard logic in flexibility-vs-cost, and the FLEX 10K family specifically pioneered embedded array blocks (EABs) for on-chip SRAM/ROM, enabling system-on-chip integration of logic plus memory in one device.
Key features of the EPF10K20RC240-4 include 12,288 typical gates, 1,152 logic elements (cells), 144 LABs, 189 user I/Os, 5 V core operation, and a 240-pin BFQFP exposed-pad package for improved thermal dissipation. The -4 speed grade corresponds to a slower timing bin than -3 but offers cost advantages for designs that do not require maximum clock rates. The exposed-pad (EP) construction provides a low thermal-resistance path to PCB copper for reliable operation up to the rated junction temperature.
Typical applications include glue logic and bus interfacing in industrial control systems, legacy telecom infrastructure, prototyping platforms for ASICs, and educational hardware where the FLEX 10K family remains widely supported by the legacy Altera MAX+PLUS II / Quartus tool flow. The 189 I/O count is well matched to peripheral-rich embedded designs.
When designing with this device, ensure adequate decoupling on all VCCINT/VCCIO pins and follow Altera's BFQFP land-pattern recommendations to avoid solder-joint fatigue. The -4 speed grade is the slowest of the FLEX 10K20 family - verify timing closure before substituting -3 or unmarked parts.
This page synthesizes distributor pricing, drop-in alternatives within the FLEX 10K family, and practical design notes not aggregated in any single manufacturer datasheet.
ドロップイン代替品: EPF10K20RC240-4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: EPF10K20RC240-4 （同一形状・フットプリント） — 相違点: Package, RoHS Status, Family, Mounting Type, Logic Array Blocks (LABs).
クイック比較ツール — 並列比較する代替部品を選択:
EPF10K20RC240-3
✅ ドロップイン✓ 在庫あり
$21.2 / 個
データシートを見る →EPF10K20RC240-3N
✅ ドロップイン✓ 在庫あり
$23.1 / 個
データシートを見る →EPF10K20RC240-4N
✅ ドロップイン ⚠️ 仕様未検証📋 参考代替品（カタログ未掲載）
EPF10K20RC208-4
✅ ドロップイン✓ 在庫あり
$19.85 / 個
データシートを見る →EPF10K20RC240-4 最大定格＆電気的特性
| Family | FLEX 10K |
| Typical Gates | 20,000 |
| Logic Elements / Cells | 1,152 |
| Logic Array Blocks (LABs) | 144 |
| User I/Os | 189 |
| パッケージ | 240-BFQFP Exposed Pad (RQFP) |
| ピン数 | 240 |
| 電源電圧 | 5 V |
| Process Technology | 0.42 µm CMOS |
| 動作温度 | 0 °C to 70 °C |
| Speed Grade | -4 |
| Propagation Delay | 0.4 ns (per DigChip) |
| 実装タイプ | Surface Mount |
| RoHS ステータス | non_compliant (legacy BFQFP, SnPb finish) |
| Embedded Memory | EAB (Embedded Array Block) SRAM/ROM |
EPF10K20RC240-4 240-bfqfp exposed pad (rqfp) ピン配置ガイド
EPF10K20RC240-4 (240-bfqfp exposed pad (rqfp) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: EPF10K20RC240-4.
詳細は データシート をご参照ください。
主な用途
EPF10K20RC240-4 の用途: 6 件s: Industrial Glue Logic and Bus Interfacing, Legacy Telecom Infrastructure, ASIC Prototyping Platform, Educational Hardware and FPGA Training, Test and Measurement Equipment Backplanes, Military and Aerospace Legacy Avionics.
Industrial Glue Logic and Bus Interfacing
The EPF10K20RC240-4 excels as glue logic between legacy microcontrollers, memory, and peripheral buses in industrial control systems. Its 189 user I/Os handle address/data multiplexing, chip-select decoding, and timing-protocol bridging in a single device, replacing dozens of 74-series logic gates. The 5 V tolerant I/Os and 0.70 C operating range align with factory-floor temperature profiles, while 1,152 logic elements provide ample headroom for state-machine-rich protocol converters (e.g., ISA-to-PCI, VME bridge logic).
おすすめ
Legacy Telecom Infrastructure
In telecom central-office equipment of the 1990s-2000s era, the EPF10K20RC240-4 implemented framing, line-card control, and backplane arbitration functions. Its embedded array blocks (EABs) provide on-chip dual-port SRAM for small FIFO buffers between TDM time slots, eliminating external RAM and reducing board area. The 240-BFQFP exposed-pad package is robust against the vibration and thermal cycling of telecom racks, and Altera's mature configuration bitstream toolchain (MAX+PLUS II) ensures bitstream reproducibility for decades-long field support.
おすすめ
ASIC Prototyping Platform
Designers used the EPF10K20RC240-4 as an FPGA prototype before committing an ASIC to fab, validating RTL logic at near-ASIC clock rates thanks to the -3 and -4 speed grades. The 1,152 logic elements plus EAB SRAM map cleanly to standard-cell ASIC gate libraries, and Quartus II synthesis reports correlate well with ASIC synthesis timing. For digital-signal-processing or bus-protocol prototypes that will eventually migrate to a 0.18 µm ASIC, the 240-BFQFP exposed pad provides the thermal margin needed for sustained burn-in testing.
おすすめ
Educational Hardware and FPGA Training
University digital-design labs adopted the EPF10K20RC240-4 on Altera UP2 and similar education boards because the FLEX 10K family balances logic density, JTAG-friendly configuration, and student-friendly MAX+PLUS II GUI. The 189 I/Os expose students to buses, LEDs, seven-segment displays, and VGA/PS2 interfaces simultaneously, and the EAB SRAM teaches embedded-memory concepts. The device remains in active use at universities worldwide, and the legacy toolchain is freely downloadable for educational purposes.
おすすめ
Test and Measurement Equipment Backplanes
Instruments such as logic analyzers, protocol testers, and modular ATE systems used the EPF10K20RC240-4 as a backplane arbiter between instrument cards. Its 189 I/Os accommodate multi-drop test buses, trigger distribution, and high-speed pattern generation, while the embedded EABs implement deep pattern-capture FIFOs. The exposed-pad 240-BFQFP package ensures reliable operation across the 0 °C to 70 °C commercial-industrial range typical of laboratory environments.
おすすめ
Military and Aerospace Legacy Avionics
Avionics LRUs (line-replaceable units) from the late 1990s incorporate the EPF10K20RC240-4 for MIL-STD-1553 bus termination, ARINC 429 decoding, and discrete I/O aggregation. Although not formally MIL-PRF-38535 qualified, the plastic BFQFP package has demonstrated decades-long field reliability in commercial-derivative military systems. Because avionics programs demand 20+ year sustainment, the EPF10K20RC240-4 remains in active procurement through brokers and franchised inventory for these long-life platforms.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: EPF10K20RC240-4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | EPF10K20RC240-3 | EPF10K20RC240-3N | EPF10K20RC240-4N |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 240-BFQFP Exposed Pad | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same | 240-BFQFP Exposed Pad - same |
| Family | FLEX 10K | FLEX 10K - same | FLEX 10K - same | FLEX 10K - same |
| Logic Elements / Cells | 1,152 | 1,152 | 1,152 | 1,152 |
| Typical Gates | 20,000 | 20,000 | 20,000 | 20,000 |
| User I/Os | 189 | 189 | 189 | 189 |
| Speed Grade | -4 (slowest) | -3 (one bin faster) | -3 (one bin faster) | -4 (same speed grade) |
| RoHS / Pb-Free | SnPb finish (non-RoHS) | SnPb (non-RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
| Supply Voltage | 5 V | 5 V | 5 V | 5 V |
主な差別化要因
- Original baseline FLEX 10K20 with -4 speed grade （vs EPF10K20RC240-3)
- SnPb finish for legacy assembly lines （vs EPF10K20RC240-4N)
- 189 user I/Os in a single 240-BFQFP package （vs EPF10K20RC208-4)
設計ノート
The 240-BFQFP exposed-pad package requires the central thermal pad to be soldered to a PCB copper pour of at least 1 square inch for rated operation. Estimated: at 5 V VCCINT and typical 200 mA active current, junction-to-ambient thermal resistance is roughly 25 C/W with a 1 in² 4-layer copper pour, supporting 0 °C to 70 °C operation at moderate toggle rates. Without the EP soldered, internal junction temperatures may exceed 100 °C during continuous operation.
Place 0.1 µF decoupling capacitors within 5 mm of every VCCINT and VCCIO pin pair, plus bulk 10 µF tantalum capacitors at each supply rail entry point. The 240-BFQFP package has 1.27 mm pitch - route signals on inner layers to avoid crosstalk on long outer-layer traces. Follow Altera's recommended 4-layer stack-up with continuous ground plane beneath the device to control return-path impedance for the JTAG configuration signals (TCK, TMS, TDI, TDO).
Critical pitfalls when migrating between FLEX 10K20 speed grades: (1) verify that the -3 part's improved timing margin is genuine for your specific design paths, not just nominal; (2) the 'N' suffix denotes Pb-free finish and is electrically identical but may have different reflow-profile requirements (peak 260 °C vs 220 °C); (3) configuration bitstreams are speed-grade-dependent - do not use a -3 bitstream on a -4 device without resynthesis; (4) JTAG chain order matters when programming multiple devices via ByteBlaster.
コンプライアンス情報
Original EPF10K20RC240-4 is non-RoHS (SnPb finish). The EPF10K20RC240-4N variant is Pb-free/RoHS-compliant. Not AEC-Q100 qualified; FLEX 10K is a commercial/industrial family not automotive-grade.
