EPM240ZM68I8N - 240-Logic Element MAX II CPLD | Intel
料号： EPM240ZM68I8N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.85 | $14.85 |
| 10 | $13.2 | $132.00 |
| 100 | $11.45 | $1,145.00 |
| 500 | $10.1 | $5,050.00 |
| 1,000 | $8.95 | $8,950.00 |
EPM240ZM68I8N 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device that sits between discrete glue logic and FPGAs in the system hierarchy: discrete logic -> CPLD -> FPGA -> ASIC. Unlike SRAM-based FPGAs, MAX II CPLDs retain configuration in on-chip flash, eliminating boot time and external configuration memory, making them ideal for bus bridging, I/O expansion, power sequencing, and configuration glue logic in cost-sensitive embedded designs.
Key features include 240 logic elements (192 typical, 240 maximum), 8 Kbits of embedded user flash memory, 4 global clock networks, JTAG/IEEE 1149.1 boundary-scan support, and a MultiVolt I/O interface supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards. The I/O pins feature Schmitt trigger inputs with 66-MHz 32-bit PCI compliance, and hot-socketing support allows live insertion into backplanes without damage.
The EPM240ZM68I8N uses a low-power zero-standby architecture that consumes microamps of standby current, making it well-suited for battery-powered and energy-harvesting applications. The flash-based configuration also supports live in-system updates via JTAG without external programming voltage. Built on a 180-nm process with embedded flash, the device offers robust field-upgrade capability over its industrial temperature range of -40 °C to +100 °C.
Typical applications include I/O expansion and voltage translation in embedded processor boards, bus bridging between legacy peripherals and modern processors, power-supply sequencing in multi-rail systems, and glue-logic replacement in industrial controllers. The compact BGA package and low power make it attractive for handheld and portable medical or test equipment.
When designing with this device, allocate sufficient PCB area for the 68-ball MBGA footprint and use 4-layer routing with dedicated power planes. JTAG chain design must follow IEEE 1149.1 boundary-scan guidelines, with TCK, TMS, TDI, TDO pulled to known states. The internal flash requires no external programming voltage, simplifying the BOM versus older CPLD families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
直接替换替代料： EPM240ZM68I8N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM240ZM68I8N （相同外形与封装尺寸） ——差异在于 Configuration Memory, Family, Package, Mounting Type, MSL Level.
快速对比工具——选择替代料号进行并排对比：
EPM240ZM68C7N
✅ 直接替换✓ 有现货
$4.2 / 个
查看数据手册 →EPM240ZM68C6N
✅ 直接替换✓ 有现货
$5.1 / 个
查看数据手册 →EPM240ZM68I8N 最大额定值与电气特性
| Series | MAX II |
| Family | MAX II Z (Zero Power) |
| Logic Elements | 240 |
| Macrocells | 192 |
| User Flash Memory | 8 Kbits |
| Global Clock Networks | 4 |
| Core Voltage | 1.8 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI 66 MHz 32-bit, SSTL-2 |
| 工作温度 | -40 °C to +100 °C (Industrial) |
| 封装 | 68-ball MBGA (Z) |
| 安装类型 | Surface Mount |
| MSL 等级 | 3 |
| Configuration Memory | On-chip flash (non-volatile) |
| In-System Programming | Yes (JTAG, IEEE 1149.1) |
| Hot Socketing | Yes |
| RoHS 状态 | Compliant |
EPM240ZM68I8N 引脚配置
| 引脚 A1 | I/O — User I/O bank 1 |
| 引脚 A2 | I/O — User I/O bank 1 |
| 引脚 A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| 引脚 A4 | I/O — User I/O bank 1 |
| 引脚 A5 | GND — Ground |
| 引脚 A6 | I/O — User I/O bank 1 |
| 引脚 A7 | I/O — User I/O bank 1 |
| 引脚 A8 | VCCIO1 — I/O bank 1 supply |
| 引脚 B1 | I/O — User I/O bank 2 |
| 引脚 B2 | I/O — User I/O bank 2 |
| 引脚 B3 | I/O — User I/O bank 2 |
| 引脚 B4 | I/O — User I/O bank 2 |
| 引脚 B5 | VCCIO2 — I/O bank 2 supply |
| 引脚 B6 | I/O — User I/O bank 2 |
| 引脚 B7 | I/O — User I/O bank 2 |
| 引脚 B8 | I/O — User I/O bank 2 |
| 引脚 C1 | I/O — User I/O bank 3 |
| 引脚 C2 | I/O — User I/O bank 3 |
| 引脚 C3 | I/O — User I/O bank 3 |
| 引脚 C4 | TDI — JTAG Test Data In |
| 引脚 C5 | TCK — JTAG Test Clock |
| 引脚 C6 | TMS — JTAG Test Mode Select |
| 引脚 C7 | I/O — User I/O bank 3 |
| 引脚 C8 | I/O — User I/O bank 3 |
| 引脚 D1 | GND — Ground |
| 引脚 D2 | I/O — User I/O bank 3 |
| 引脚 D3 | I/O — User I/O bank 3 |
| 引脚 D4 | TDO — JTAG Test Data Out |
| 引脚 D5 | GND — Ground |
| 引脚 D6 | I/O — User I/O bank 4 |
| 引脚 D7 | I/O — User I/O bank 4 |
| 引脚 D8 | VCCIO4 — I/O bank 4 supply |
| 引脚 E1 | I/O — User I/O bank 3 |
| 引脚 E2 | VCCINT — Core 1.8 V supply |
| 引脚 E3 | I/O — User I/O bank 3 |
| 引脚 E4 | I/O — User I/O bank 4 |
| 引脚 E5 | I/O — User I/O bank 4 |
| 引脚 E6 | I/O — User I/O bank 4 |
| 引脚 E7 | VCCINT — Core 1.8 V supply |
| 引脚 E8 | I/O — User I/O bank 4 |
| 引脚 F1 | I/O — User I/O bank 3 |
| 引脚 F2 | I/O — User I/O bank 3 |
| 引脚 F3 | GND — Ground |
| 引脚 F4 | I/O — User I/O bank 4 |
| 引脚 F5 | I/O — User I/O bank 4 |
| 引脚 F6 | VCCIO3 — I/O bank 3 supply |
| 引脚 F7 | I/O — User I/O bank 4 |
| 引脚 F8 | I/O — User I/O bank 4 |
| 引脚 G1 | I/O — User I/O bank 1 |
| 引脚 G2 | I/O — User I/O bank 1 |
| 引脚 G3 | I/O — User I/O bank 1 |
| 引脚 G4 | GND — Ground |
| 引脚 G5 | I/O — User I/O bank 2 |
| 引脚 G6 | I/O — User I/O bank 2 |
| 引脚 G7 | I/O — User I/O bank 2 |
| 引脚 G8 | I/O — User I/O bank 2 |
| 引脚 H1 | I/O — User I/O bank 1 |
| 引脚 H2 | VCCIO1 — I/O bank 1 supply |
| 引脚 H3 | I/O — User I/O bank 1 |
| 引脚 H4 | I/O — User I/O bank 1 |
| 引脚 H5 | I/O — User I/O bank 2 |
| 引脚 H6 | I/O — User I/O bank 2 |
| 引脚 H7 | VCCIO2 — I/O bank 2 supply |
| 引脚 H8 | I/O — User I/O bank 2 |
典型应用
EPM240ZM68I8N 适用于 7 应用s: I/O Expansion for Embedded Processors, Bus Bridging (Legacy to Modern Processors), Power Supply Sequencing, Industrial Control and Factory Automation, Portable and Battery-Powered Devices, Glue Logic Replacement, Medical Device Interface Boards.
I/O Expansion for Embedded Processors
The EPM240ZM68I8N is widely used as a low-density I/O expander on STM32, NXP i.MX, and Microchip PIC32 boards where the host MCU lacks GPIO, UART, SPI, or PWM peripherals. Its 240 logic elements and MultiVolt I/O banks for 1.5 V to 3.3 V allow direct interface to 3.3 V MCUs while running a 1.8 V core, eliminating level shifters. The non-volatile flash configuration means instant-on at power-up with zero boot latency, and the 68-ball MBGA keeps the footprint smaller than a TQFP CPLD alternative, which is critical in handheld designs.
推荐
Bus Bridging (Legacy to Modern Processors)
The EPM240ZM68I8N excels at bridging legacy 8-bit or 16-bit peripheral buses (e.g., PC/104, ISA, 8051-style multiplexed buses) to modern 32-bit ARM Cortex processors. Its 4 global clock networks and 192 macrocells are sufficient to implement glue logic, address-latch demultiplexing, and chip-select decoders, while the 8 Kbits of user flash can hold board-identity or revision metadata. Hot-socketing allows live insertion into backplane systems without disturbing adjacent cards, making it well-suited for modular industrial PCs and PXI chassis.
推荐
Power Supply Sequencing
Multi-rail systems powering FPGAs, ASICs, or processors need strict rail-on and rail-off sequencing to avoid latch-up. The EPM240ZM68I8N's instant-on flash configuration boots in microseconds without boot ROM, allowing it to drive discrete MOSFET gates or enable pins of downstream POL regulators immediately at VCC_INT ramp-up. Four global clock pins can also be repurposed as general-purpose output enables, and the 240 logic elements comfortably handle sequencing for 4-6 rails with PG (power-good) feedback. The industrial -40 °C to +100 °C temperature grade fits outdoor telecom and industrial racks.
推荐
Industrial Control and Factory Automation
Factory automation controllers, PLCs, and motor-control boards benefit from the EPM240ZM68I8N's industrial -40 °C to +100 °C operating range and zero-standby-power flash CPLD architecture. It implements encoder decoding, PWM generation, fault-logic aggregation, and isolated fieldbus glue (Modbus, RS-485, CAN interfaces). The JTAG boundary-scan support accelerates production test, while the hot-socketing capability supports live insertion into DIN-rail backplanes. Compared to a discrete 74HC logic implementation, the CPLD reduces board area and BOM cost substantially.
推荐
Portable and Battery-Powered Devices
The MAX II Z Zero-Power architecture of the EPM240ZM68I8N draws microamps of standby current, making it ideal for handheld test equipment, portable medical instruments, and energy-harvesting IoT edge nodes. The non-volatile flash configuration eliminates the always-on boot-PROM current typical of SRAM-based FPGAs, extending battery life by 5-10% versus an FPGA doing the same glue-logic function. The 68-ball MBGA 1.27 mm pitch package supports miniaturized PCB layouts where every square millimeter counts.
推荐
Glue Logic Replacement
Replacing discrete 74HC/74LVC logic gates, latches, and decoders with a single EPM240ZM68I8N reduces board area by 50-70% and eliminates dozens of traces. Engineers commonly migrate 74LS138 decoders, 74HC245 transceivers, 74HC151 multiplexers, and D-type flip-flop arrays into a MAX II Z CPLD. The Quartus schematic capture and HDL flow make porting straightforward, and the JTAG ISP allows post-assembly design changes without re-spinning boards - ideal for prototypes and low-volume production where respins are prohibitively expensive.
推荐
Medical Device Interface Boards
Medical device front-ends with patient-isolation barriers, sensor multiplexing, and LCD/LED drivers benefit from the EPM240ZM68I8N's deterministic propagation delay and zero-standby flash configuration. The device aggregates multiple low-speed analog front-end signals, generates timing for optocouplers, and provides fail-safe defaults at power-up without configuration latency. The industrial temperature grade supports clinical equipment operating in controlled but variable-temperature environments. Combined with the small 68-ball MBGA footprint, the EPM240Z is well-suited for compact patient monitors and portable diagnostic tools.
推荐
推荐产品汇总
工程参考数据： EPM240ZM68I8N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM240ZM68C7N | EPM240ZM68C6N | EPM240ZM100I8N |
|---|---|---|---|---|
| Package | 68-ball MBGA (Z) | 68-ball MBGA (Z) - same | 68-ball MBGA (Z) - same | 100-ball MBGA - NOT same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +100 °C (Industrial) |
| Speed Grade | I8 (fastest industrial) | C7 | C6 (slower) | I8 |
| User Flash | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Pin Compatibility | 68-ball MBGA (reference) | Yes - drop-in | Yes - drop-in | No - different 100-ball package |
关键差异点
- Zero-standby-power flash configuration vs SRAM FPGAs （对比 Xilinx XC2C64A (CoolRunner-II))
- Instant-on with on-chip memory vs external boot PROM （对比 Lattice ispMACH 4032ZE)
- MultiVolt I/O bank support for mixed-voltage designs （对比 Older 5 V-only CPLDs)
设计说明
The 68-ball MBGA package uses a 1.27 mm ball pitch array. Use 4-layer PCB with continuous GND and VCC_INT planes directly under the BGA to provide low-impedance return paths. Place 0.1 µF decoupling caps within 100 mils of each VCCIO bank pin, with a single 10 µF bulk capacitor near the device. Avoid routing signal traces under the BGA balls; escape through the inner rows to top-layer microvia-in-pad if manufacturing capability allows.
Decoupling strategy: place 0.1 µF X7R 0402 caps on every VCCINT and VCCIO ball, plus a 4.7 µF bulk capacitor near the device. Keep JTAG traces short (< 50 mm) and away from switching converters. For hot-socketing reliability, add 10 kΩ pull-ups on JTAG pins (TCK, TMS, TDI) and a 10 kΩ pull-down on TDO to ensure defined states during board insertion into a live backplane.
Common pitfalls: (1) Forgetting to set unused I/O pins as inputs with weak pull-ups - this draws extra current and risks oscillation. (2) Driving JTAG signals with logic that does not support MultiVolt levels - ensure your JTAG programmer is 3.3 V tolerant. (3) Mixing VCCIO bank voltages without proper sequencing - ramp all bank supplies together to avoid I/O latch-up. (4) Using the wrong Quartus fitter settings for the MBGA package - specify the 68-ball MBGA explicitly in the pin assignment dialog.
合规信息
RoHS and REACH compliant per Intel product page. Lead-free and halogen-free per MAX II device handbook. Not AEC-Q100 qualified - this is a commercial/industrial part; for automotive applications consult Intel's MAX V or MAX 10 automotive-grade CPLDs. Conflict-minerals compliant per Intel supplier declarations.
