EPM240ZM68I8N - 240-Logic Element MAX II CPLD | Intel
Référence : EPM240ZM68I8N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.85 | $14,85 |
| 10 | $13.2 | $132,00 |
| 100 | $11.45 | $1 145,00 |
| 500 | $10.1 | $5 050,00 |
| 1 000 | $8.95 | $8 950,00 |
EPM240ZM68I8N Présentation
A CPLD (Complex Programmable Logic Device) is a non-volatile, instant-on programmable logic device that sits between discrete glue logic and FPGAs in the system hierarchy: discrete logic -> CPLD -> FPGA -> ASIC. Unlike SRAM-based FPGAs, MAX II CPLDs retain configuration in on-chip flash, eliminating boot time and external configuration memory, making them ideal for bus bridging, I/O expansion, power sequencing, and configuration glue logic in cost-sensitive embedded designs.
Key features include 240 logic elements (192 typical, 240 maximum), 8 Kbits of embedded user flash memory, 4 global clock networks, JTAG/IEEE 1149.1 boundary-scan support, and a MultiVolt I/O interface supporting 1.5 V, 1.8 V, 2.5 V, and 3.3 V standards. The I/O pins feature Schmitt trigger inputs with 66-MHz 32-bit PCI compliance, and hot-socketing support allows live insertion into backplanes without damage.
The EPM240ZM68I8N uses a low-power zero-standby architecture that consumes microamps of standby current, making it well-suited for battery-powered and energy-harvesting applications. The flash-based configuration also supports live in-system updates via JTAG without external programming voltage. Built on a 180-nm process with embedded flash, the device offers robust field-upgrade capability over its industrial temperature range of -40 °C to +100 °C.
Typical applications include I/O expansion and voltage translation in embedded processor boards, bus bridging between legacy peripherals and modern processors, power-supply sequencing in multi-rail systems, and glue-logic replacement in industrial controllers. The compact BGA package and low power make it attractive for handheld and portable medical or test equipment.
When designing with this device, allocate sufficient PCB area for the 68-ball MBGA footprint and use 4-layer routing with dedicated power planes. JTAG chain design must follow IEEE 1149.1 boundary-scan guidelines, with TCK, TMS, TDI, TDO pulled to known states. The internal flash requires no external programming voltage, simplifying the BOM versus older CPLD families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes that go beyond the manufacturer datasheet.
Alternatives de remplacement direct pour EPM240ZM68I8N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec EPM240ZM68I8N (même facteur de forme et même empreinte) — différant par Configuration Memory, Family, Package, Mounting Type, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
EPM240ZM68C7N
✅ Remplacement direct✓ En stock
$4.2 / unité
Voir la fiche technique →EPM240ZM68C6N
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →EPM240ZM68I8N Valeurs maximales et caractéristiques électriques
| Series | MAX II |
| Family | MAX II Z (Zero Power) |
| Logic Elements | 240 |
| Macrocells | 192 |
| User Flash Memory | 8 Kbits |
| Global Clock Networks | 4 |
| Core Voltage | 1.8 V |
| I/O Standards Supported | LVTTL, LVCMOS, PCI 66 MHz 32-bit, SSTL-2 |
| Température de fonctionnement | -40 °C to +100 °C (Industrial) |
| Boîtier | 68-ball MBGA (Z) |
| Type de montage | Surface Mount |
| Niveau MSL | 3 |
| Configuration Memory | On-chip flash (non-volatile) |
| In-System Programming | Yes (JTAG, IEEE 1149.1) |
| Hot Socketing | Yes |
| Statut RoHS | Compliant |
Configuration des broches de EPM240ZM68I8N
| Broche A1 | I/O — User I/O bank 1 |
| Broche A2 | I/O — User I/O bank 1 |
| Broche A3 | VCCIO1 — I/O bank 1 supply (1.5/1.8/2.5/3.3 V) |
| Broche A4 | I/O — User I/O bank 1 |
| Broche A5 | GND — Ground |
| Broche A6 | I/O — User I/O bank 1 |
| Broche A7 | I/O — User I/O bank 1 |
| Broche A8 | VCCIO1 — I/O bank 1 supply |
| Broche B1 | I/O — User I/O bank 2 |
| Broche B2 | I/O — User I/O bank 2 |
| Broche B3 | I/O — User I/O bank 2 |
| Broche B4 | I/O — User I/O bank 2 |
| Broche B5 | VCCIO2 — I/O bank 2 supply |
| Broche B6 | I/O — User I/O bank 2 |
| Broche B7 | I/O — User I/O bank 2 |
| Broche B8 | I/O — User I/O bank 2 |
| Broche C1 | I/O — User I/O bank 3 |
| Broche C2 | I/O — User I/O bank 3 |
| Broche C3 | I/O — User I/O bank 3 |
| Broche C4 | TDI — JTAG Test Data In |
| Broche C5 | TCK — JTAG Test Clock |
| Broche C6 | TMS — JTAG Test Mode Select |
| Broche C7 | I/O — User I/O bank 3 |
| Broche C8 | I/O — User I/O bank 3 |
| Broche D1 | GND — Ground |
| Broche D2 | I/O — User I/O bank 3 |
| Broche D3 | I/O — User I/O bank 3 |
| Broche D4 | TDO — JTAG Test Data Out |
| Broche D5 | GND — Ground |
| Broche D6 | I/O — User I/O bank 4 |
| Broche D7 | I/O — User I/O bank 4 |
| Broche D8 | VCCIO4 — I/O bank 4 supply |
| Broche E1 | I/O — User I/O bank 3 |
| Broche E2 | VCCINT — Core 1.8 V supply |
| Broche E3 | I/O — User I/O bank 3 |
| Broche E4 | I/O — User I/O bank 4 |
| Broche E5 | I/O — User I/O bank 4 |
| Broche E6 | I/O — User I/O bank 4 |
| Broche E7 | VCCINT — Core 1.8 V supply |
| Broche E8 | I/O — User I/O bank 4 |
| Broche F1 | I/O — User I/O bank 3 |
| Broche F2 | I/O — User I/O bank 3 |
| Broche F3 | GND — Ground |
| Broche F4 | I/O — User I/O bank 4 |
| Broche F5 | I/O — User I/O bank 4 |
| Broche F6 | VCCIO3 — I/O bank 3 supply |
| Broche F7 | I/O — User I/O bank 4 |
| Broche F8 | I/O — User I/O bank 4 |
| Broche G1 | I/O — User I/O bank 1 |
| Broche G2 | I/O — User I/O bank 1 |
| Broche G3 | I/O — User I/O bank 1 |
| Broche G4 | GND — Ground |
| Broche G5 | I/O — User I/O bank 2 |
| Broche G6 | I/O — User I/O bank 2 |
| Broche G7 | I/O — User I/O bank 2 |
| Broche G8 | I/O — User I/O bank 2 |
| Broche H1 | I/O — User I/O bank 1 |
| Broche H2 | VCCIO1 — I/O bank 1 supply |
| Broche H3 | I/O — User I/O bank 1 |
| Broche H4 | I/O — User I/O bank 1 |
| Broche H5 | I/O — User I/O bank 2 |
| Broche H6 | I/O — User I/O bank 2 |
| Broche H7 | VCCIO2 — I/O bank 2 supply |
| Broche H8 | I/O — User I/O bank 2 |
Applications typiques
EPM240ZM68I8N convient pour 7 applications: I/O Expansion for Embedded Processors, Bus Bridging (Legacy to Modern Processors), Power Supply Sequencing, Industrial Control and Factory Automation, Portable and Battery-Powered Devices, Glue Logic Replacement, Medical Device Interface Boards.
I/O Expansion for Embedded Processors
The EPM240ZM68I8N is widely used as a low-density I/O expander on STM32, NXP i.MX, and Microchip PIC32 boards where the host MCU lacks GPIO, UART, SPI, or PWM peripherals. Its 240 logic elements and MultiVolt I/O banks for 1.5 V to 3.3 V allow direct interface to 3.3 V MCUs while running a 1.8 V core, eliminating level shifters. The non-volatile flash configuration means instant-on at power-up with zero boot latency, and the 68-ball MBGA keeps the footprint smaller than a TQFP CPLD alternative, which is critical in handheld designs.
Recommandé
Bus Bridging (Legacy to Modern Processors)
The EPM240ZM68I8N excels at bridging legacy 8-bit or 16-bit peripheral buses (e.g., PC/104, ISA, 8051-style multiplexed buses) to modern 32-bit ARM Cortex processors. Its 4 global clock networks and 192 macrocells are sufficient to implement glue logic, address-latch demultiplexing, and chip-select decoders, while the 8 Kbits of user flash can hold board-identity or revision metadata. Hot-socketing allows live insertion into backplane systems without disturbing adjacent cards, making it well-suited for modular industrial PCs and PXI chassis.
Recommandé
Power Supply Sequencing
Multi-rail systems powering FPGAs, ASICs, or processors need strict rail-on and rail-off sequencing to avoid latch-up. The EPM240ZM68I8N's instant-on flash configuration boots in microseconds without boot ROM, allowing it to drive discrete MOSFET gates or enable pins of downstream POL regulators immediately at VCC_INT ramp-up. Four global clock pins can also be repurposed as general-purpose output enables, and the 240 logic elements comfortably handle sequencing for 4-6 rails with PG (power-good) feedback. The industrial -40 °C to +100 °C temperature grade fits outdoor telecom and industrial racks.
Recommandé
Industrial Control and Factory Automation
Factory automation controllers, PLCs, and motor-control boards benefit from the EPM240ZM68I8N's industrial -40 °C to +100 °C operating range and zero-standby-power flash CPLD architecture. It implements encoder decoding, PWM generation, fault-logic aggregation, and isolated fieldbus glue (Modbus, RS-485, CAN interfaces). The JTAG boundary-scan support accelerates production test, while the hot-socketing capability supports live insertion into DIN-rail backplanes. Compared to a discrete 74HC logic implementation, the CPLD reduces board area and BOM cost substantially.
Recommandé
Portable and Battery-Powered Devices
The MAX II Z Zero-Power architecture of the EPM240ZM68I8N draws microamps of standby current, making it ideal for handheld test equipment, portable medical instruments, and energy-harvesting IoT edge nodes. The non-volatile flash configuration eliminates the always-on boot-PROM current typical of SRAM-based FPGAs, extending battery life by 5-10% versus an FPGA doing the same glue-logic function. The 68-ball MBGA 1.27 mm pitch package supports miniaturized PCB layouts where every square millimeter counts.
Recommandé
Glue Logic Replacement
Replacing discrete 74HC/74LVC logic gates, latches, and decoders with a single EPM240ZM68I8N reduces board area by 50-70% and eliminates dozens of traces. Engineers commonly migrate 74LS138 decoders, 74HC245 transceivers, 74HC151 multiplexers, and D-type flip-flop arrays into a MAX II Z CPLD. The Quartus schematic capture and HDL flow make porting straightforward, and the JTAG ISP allows post-assembly design changes without re-spinning boards - ideal for prototypes and low-volume production where respins are prohibitively expensive.
Recommandé
Medical Device Interface Boards
Medical device front-ends with patient-isolation barriers, sensor multiplexing, and LCD/LED drivers benefit from the EPM240ZM68I8N's deterministic propagation delay and zero-standby flash configuration. The device aggregates multiple low-speed analog front-end signals, generates timing for optocouplers, and provides fail-safe defaults at power-up without configuration latency. The industrial temperature grade supports clinical equipment operating in controlled but variable-temperature environments. Combined with the small 68-ball MBGA footprint, the EPM240Z is well-suited for compact patient monitors and portable diagnostic tools.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour EPM240ZM68I8N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | EPM240ZM68C7N | EPM240ZM68C6N | EPM240ZM100I8N |
|---|---|---|---|---|
| Package | 68-ball MBGA (Z) | 68-ball MBGA (Z) - same | 68-ball MBGA (Z) - same | 100-ball MBGA - NOT same |
| Brand | Intel | Intel - same | Intel - same | Intel - same |
| Logic Elements | 240 | 240 | 240 | 240 |
| Operating Temperature | -40 °C to +100 °C (Industrial) | 0 °C to +70 °C (Commercial) | 0 °C to +70 °C (Commercial) | -40 °C to +100 °C (Industrial) |
| Speed Grade | I8 (fastest industrial) | C7 | C6 (slower) | I8 |
| User Flash | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Core Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Pin Compatibility | 68-ball MBGA (reference) | Yes - drop-in | Yes - drop-in | No - different 100-ball package |
Principaux différenciateurs
- Zero-standby-power flash configuration vs SRAM FPGAs (vs Xilinx XC2C64A (CoolRunner-II))
- Instant-on with on-chip memory vs external boot PROM (vs Lattice ispMACH 4032ZE)
- MultiVolt I/O bank support for mixed-voltage designs (vs Older 5 V-only CPLDs)
Notes de conception
The 68-ball MBGA package uses a 1.27 mm ball pitch array. Use 4-layer PCB with continuous GND and VCC_INT planes directly under the BGA to provide low-impedance return paths. Place 0.1 µF decoupling caps within 100 mils of each VCCIO bank pin, with a single 10 µF bulk capacitor near the device. Avoid routing signal traces under the BGA balls; escape through the inner rows to top-layer microvia-in-pad if manufacturing capability allows.
Decoupling strategy: place 0.1 µF X7R 0402 caps on every VCCINT and VCCIO ball, plus a 4.7 µF bulk capacitor near the device. Keep JTAG traces short (< 50 mm) and away from switching converters. For hot-socketing reliability, add 10 kΩ pull-ups on JTAG pins (TCK, TMS, TDI) and a 10 kΩ pull-down on TDO to ensure defined states during board insertion into a live backplane.
Common pitfalls: (1) Forgetting to set unused I/O pins as inputs with weak pull-ups - this draws extra current and risks oscillation. (2) Driving JTAG signals with logic that does not support MultiVolt levels - ensure your JTAG programmer is 3.3 V tolerant. (3) Mixing VCCIO bank voltages without proper sequencing - ramp all bank supplies together to avoid I/O latch-up. (4) Using the wrong Quartus fitter settings for the MBGA package - specify the 68-ball MBGA explicitly in the pin assignment dialog.
Informations de conformité
RoHS and REACH compliant per Intel product page. Lead-free and halogen-free per MAX II device handbook. Not AEC-Q100 qualified - this is a commercial/industrial part; for automotive applications consult Intel's MAX V or MAX 10 automotive-grade CPLDs. Conflict-minerals compliant per Intel supplier declarations.
