EPM570FGF256I5N - 570 LE MAX II CPLD, 256-FBGA | Intel (Altera)
料号： EPM570FGF256I5N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $19.8 | $19,800.00 |
EPM570FGF256I5N 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic IC that sits between discrete glue logic and FPGAs in the logic hierarchy. Compared to discrete 74-series logic, a CPLD integrates dozens to hundreds of gates, flip-flops, and product terms on a single chip; compared to an FPGA, a CPLD typically offers lower logic density but provides instant-on behavior, deterministic timing, and superior robustness for control-plane tasks such as bus interfacing, power sequencing, and I/O expansion.
Key features include 570 Logic Elements, 440 macrocells, up to 212 user I/O pins, an internal flash configuration block, JTAG and in-system programmability (ISP), and multi-volt I/O support (1.5V, 1.8V, 2.5V, 3.3V). The 256-ball FBGA package supports high I/O count in a compact footprint, while the 0.18-micron process keeps standby current low. The instant-on architecture boots in microseconds, which is critical for power-up sequencing and bootstrap logic.
The MAX II architecture combines a Look-Up Table (LUT) and product-term fabric with an embedded Flash Configuration Block, giving the designer a non-volatile, JTAG-programmable device with high Pin-to-Pin (tPD) speed. The I5N speed/temperature grade (industrial, -40C to +100C junction, fast 5 ns) is the most widely specified variant for commercial and industrial products.
Typical applications include I/O expansion and voltage translation between mismatched logic domains, power-up sequencing for multi-rail systems, bus bridges for legacy microcontrollers and peripheral glue, and LED-driving or display-control logic in industrial controls.
When designing with this device, ensure PCB layout provides clean power and ground planes under the FBGA, observe JTAG chain order if multiple devices share the chain, and verify that the Quartus II/Altera design tool targets the EPM570 device family to obtain correct place-and-route results.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： EPM570FGF256I5N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM570FGF256I5N （相同外形与封装尺寸） ——差异在于 Package, Process Technology, Operating Temperature, Programming Interface, RoHS Status.
快速对比工具——选择替代料号进行并排对比：
EPM570F256I5N
✅ 直接替换✓ 有现货
$19.85 / 个
查看数据手册 →EPM570F256C5N
✅ 直接替换✓ 有现货
$17.03 / 个
查看数据手册 →EPM570F256I5
✅ 直接替换✓ 有现货
$12.6 / 个
查看数据手册 →EPM570F256C5NRR
✅ 直接替换✓ 有现货
$10.9 / 个
查看数据手册 →EPM570F256C5
✅ 直接替换✓ 有现货
$7.1 / 个
查看数据手册 →EPM570F256C4N
✅ 直接替换✓ 有现货
$26.85 / 个
查看数据手册 →EPM570F256C3N
✅ 直接替换✓ 有现货
$13.75 / 个
查看数据手册 →EPM570FGF256I5N 最大额定值与电气特性
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| Propagation Delay (tPD) | 5.0 ns |
| User I/O Pins (max) | 212 |
| 封装 | 256-ball FBGA (FGF256) |
| Process Technology | 0.18 micron |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| Programming Interface | JTAG / ISP |
| 电源电压 | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 5 (fast) |
| 工作温度 | -40C to +100C |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
EPM570FGF256I5N 256-ball fbga (fgf256) 引脚配置指南
EPM570FGF256I5N（256-ball fbga (fgf256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： EPM570FGF256I5N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
EPM570FGF256I5N 适用于 6 应用s: I/O Expansion and Voltage Translation, Power-Up/Down Sequencing Logic, Bus Bridge and Protocol Conversion, LED Display Driving and Multiplexing, Industrial Control and Machine I/O, Legacy System Modernization.
I/O Expansion and Voltage Translation
The EPM570FGF256I5N is widely deployed as an I/O expander and voltage translator between microcontrollers and peripherals that operate at mismatched logic levels. Its 212 user I/O pins and multi-volt I/O support (1.5V, 1.8V, 2.5V, 3.3V on independent banks) make it ideal for bridging legacy 5V-tolerant signals to modern low-voltage processors without external level-shifters. The 5 ns tPD propagation delay preserves signal timing margins for fast parallel buses, while 440 macrocells provide enough capacity to implement custom bus protocols such as SPI-to-parallel expansion, I2C-to-GPIO, or address decoding for memory-mapped peripherals. Engineers typically place this CPLD between the SoC and downstream devices, programming it once via JTAG to define glue-logic functions.
推荐
Power-Up/Down Sequencing Logic
The EPM570FGF256I5N's instant-on non-volatile configuration makes it ideal for power-sequencing applications where multiple voltage rails must be enabled in a precise order at system boot. Because the MAX II boots in microseconds from internal flash, the CPLD can be active before any other rail-management IC, enabling it to drive PG (Power Good) and EN (Enable) signals to downstream regulators and PMICs. The 5 ns tPD propagation delay supports tight sequencing timing windows, while 570 Logic Elements provide enough capacity to implement multi-rail sequencing state machines with fault-handling logic. Industrial temperature grading (-40C to +100C) also suits outdoor or harsh-environment power systems.
推荐
Bus Bridge and Protocol Conversion
The EPM570FGF256I5N is well-suited to bus bridging between legacy microcontrollers and modern peripherals, especially when protocol gaps cannot be closed by software alone. With 570 LEs and 440 macrocells, designers can implement custom state machines that translate between protocols such as SPI, I2C, UART, and parallel busses, or add parity/ECC generation to legacy memory interfaces. The 5 ns tPD propagation delay enables glue logic in 50-100 MHz buses without timing closure issues, while JTAG-based ISP allows firmware revision updates in the field. Industrial temperature grading ensures reliable operation in factory-automation and outdoor installations.
推荐
LED Display Driving and Multiplexing
The EPM570FGF256I5N is commonly used to drive large LED matrix displays, scoreboards, and industrial signage where deterministic refresh timing is required. With 212 user I/O pins, the CPLD can directly drive row/column multiplexers for 16x32 or larger LED arrays, while the 5 ns tPD supports flicker-free PWM dimming at high refresh rates. The 570 LEs provide ample capacity to implement PWM generators, gamma correction tables, and character/font ROMs without external memory. Non-volatile instant-on ensures the display comes up in a known state at every power cycle.
推荐
Industrial Control and Machine I/O
The EPM570FGF256I5N serves as the glue-logic core in industrial PLCs, motor controllers, and machine-vision systems where reliable deterministic logic is more important than raw LUT count. Its industrial temperature rating (-40C to +100C), JTAG-based ISP for field updates, and 5 ns tPD timing closure for encoder/quadrature decoding make it ideal for factory-floor controllers. The 570 LE capacity supports PID-loop state machines, watchdog timers, and safe-stop logic per IEC 61508 SIL requirements when paired with appropriate firmware practices.
推荐
Legacy System Modernization
The EPM570FGF256I5N is frequently deployed to replace aging discrete 74-series glue logic, PAL/GAL devices, and legacy programmable array logic (PAL) in legacy systems where full FPGA migration is overkill. By consolidating dozens of discrete SSI/MSI logic packages into a single non-volatile CPLD, designers reduce PCB area, BOM cost, and assembly time, while gaining the ability to make field-revision updates via JTAG. The 5 ns tPD is comparable to classic 74F/74AS logic, easing timing closure when migrating from discrete designs.
推荐
推荐产品汇总
工程参考数据： EPM570FGF256I5N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM570F256I5N | EPM570F256C5N | EPM570F256I5 | EPM570F256C5NRR | EPM570F256C5 | EPM570F256C4N | EPM570F256C3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA (FGF256) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 5 (fast) | 5 | 5 | 5 | 5 | 5 | 4 | 3 |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash |
关键差异点
- Industrial temperature grade with maximum performance (speed grade 5) （对比 EPM570F256C5N)
- Largest user I/O count in the MAX II EPM570 family in this package （对比 EPM240F100I5N)
- Instant-on non-volatile flash boot - deterministic startup without external PROM （对比 EPM570F256C4N)
设计说明
The 256-ball FBGA package requires a 4-layer or higher PCB stack-up with continuous ground and power planes directly beneath the device. Per IPC-7351 and the MAX II datasheet, place at least four via-in-pad or near-pad thermal vias under the center BGA balls to provide a low-impedance ground return and improve thermal dissipation. Decoupling capacitors (one 0.1 uF X7R per VCCIO bank plus one bulk 10 uF tantalum or ceramic) must be placed within 100 mils of the package to suppress switching noise.
JTAG chain integrity is critical for in-system programming. When multiple JTAG devices share the chain, place them in a single daisy-chain with TCK/TMS buffered if chain length exceeds 6 inches. The MAX II datasheet specifies 4-wire JTAG (TCK, TMS, TDI, TDO) plus optional TRST; route these signals with 50 ohm characteristic impedance and avoid routing parallel to fast-edge clocks for at least 3W spacing to prevent crosstalk into the programming chain.
Estimated: at 201 MHz internal operation and 50% I/O toggle rate, the EPM570FGF256I5N draws approximately 50-100 mA from the 3.3V core supply, plus an additional 5-15 mA per active I/O bank. Designs should budget a 250 mA 3.3V regulator for the core alone, with separate low-noise LDOs (such as TPS7A4701) feeding each VCCIO bank when interfacing to analog or RF circuits. The instant-on flash boot can cause a brief inrush current up to 300 mA at power-up, so regulator transient response must be sized accordingly.
Do not assume the 'FGF' package code is interchangeable with all 'F256' MAX II variants. According to the MAX II datasheet, FGF is a specific ball-map code; cross-package substitution requires verifying the exact BGA ball assignments via the Pin Planner tool. Also note that the Quartus II design tool is the only supported software for this family - Quartus Prime 13.0 and earlier are required; later versions (e.g., 15.0+) removed MAX II support.
合规信息
RoHS compliant per the FG (lead-free) suffix in the package code; AEC-Q100 qualification is not applicable as the part is intended for industrial/commercial, not automotive, applications.
