EPM570FGF256I5N - 570 LE MAX II CPLD, 256-FBGA | Intel (Altera)
MPN: EPM570FGF256I5N ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.75 | $2,875.00 |
| 500 | $23.1 | $11,550.00 |
| 1,000 | $19.8 | $19,800.00 |
Drop-in alternatives for EPM570FGF256I5N — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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EPM570F256I5N
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View Datasheet →EPM570FGF256I5N Maximum Ratings & Electrical Characteristics
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements (LEs) | 570 |
| Macrocells | 440 |
| Propagation Delay (tPD) | 5.0 ns |
| User I/O Pins (max) | 212 |
| Package | 256-ball FBGA (FGF256) |
| Process Technology | 0.18 micron |
| Configuration Memory | Internal Flash (non-volatile, instant-on) |
| Programming Interface | JTAG / ISP |
| Supply Voltage | 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) |
| Temperature Grade | Industrial (-40C to +100C) |
| Speed Grade | 5 (fast) |
| Operating Temperature | -40C to +100C |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
EPM570FGF256I5N 256-ball fbga (fgf256) Pin Configuration Guide
Complete pinout information for EPM570FGF256I5N (256-ball fbga (fgf256) package) with 212 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EPM570FGF256I5N.
Refer to the datasheet for full pin configuration.
Estimated pin count: 212 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EPM570FGF256I5N is suitable for 6 applications: I/O Expansion and Voltage Translation, Power-Up/Down Sequencing Logic, Bus Bridge and Protocol Conversion, LED Display Driving and Multiplexing, Industrial Control and Machine I/O, Legacy System Modernization.
I/O Expansion and Voltage Translation
The EPM570FGF256I5N is widely deployed as an I/O expander and voltage translator between microcontrollers and peripherals that operate at mismatched logic levels. Its 212 user I/O pins and multi-volt I/O support (1.5V, 1.8V, 2.5V, 3.3V on independent banks) make it ideal for bridging legacy 5V-tolerant signals to modern low-voltage processors without external level-shifters. The 5 ns tPD propagation delay preserves signal timing margins for fast parallel buses, while 440 macrocells provide enough capacity to implement custom bus protocols such as SPI-to-parallel expansion, I2C-to-GPIO, or address decoding for memory-mapped peripherals. Engineers typically place this CPLD between the SoC and downstream devices, programming it once via JTAG to define glue-logic functions.
Recommended
Power-Up/Down Sequencing Logic
The EPM570FGF256I5N's instant-on non-volatile configuration makes it ideal for power-sequencing applications where multiple voltage rails must be enabled in a precise order at system boot. Because the MAX II boots in microseconds from internal flash, the CPLD can be active before any other rail-management IC, enabling it to drive PG (Power Good) and EN (Enable) signals to downstream regulators and PMICs. The 5 ns tPD propagation delay supports tight sequencing timing windows, while 570 Logic Elements provide enough capacity to implement multi-rail sequencing state machines with fault-handling logic. Industrial temperature grading (-40C to +100C) also suits outdoor or harsh-environment power systems.
Recommended
Bus Bridge and Protocol Conversion
The EPM570FGF256I5N is well-suited to bus bridging between legacy microcontrollers and modern peripherals, especially when protocol gaps cannot be closed by software alone. With 570 LEs and 440 macrocells, designers can implement custom state machines that translate between protocols such as SPI, I2C, UART, and parallel busses, or add parity/ECC generation to legacy memory interfaces. The 5 ns tPD propagation delay enables glue logic in 50-100 MHz buses without timing closure issues, while JTAG-based ISP allows firmware revision updates in the field. Industrial temperature grading ensures reliable operation in factory-automation and outdoor installations.
Recommended
LED Display Driving and Multiplexing
The EPM570FGF256I5N is commonly used to drive large LED matrix displays, scoreboards, and industrial signage where deterministic refresh timing is required. With 212 user I/O pins, the CPLD can directly drive row/column multiplexers for 16x32 or larger LED arrays, while the 5 ns tPD supports flicker-free PWM dimming at high refresh rates. The 570 LEs provide ample capacity to implement PWM generators, gamma correction tables, and character/font ROMs without external memory. Non-volatile instant-on ensures the display comes up in a known state at every power cycle.
Recommended
Industrial Control and Machine I/O
The EPM570FGF256I5N serves as the glue-logic core in industrial PLCs, motor controllers, and machine-vision systems where reliable deterministic logic is more important than raw LUT count. Its industrial temperature rating (-40C to +100C), JTAG-based ISP for field updates, and 5 ns tPD timing closure for encoder/quadrature decoding make it ideal for factory-floor controllers. The 570 LE capacity supports PID-loop state machines, watchdog timers, and safe-stop logic per IEC 61508 SIL requirements when paired with appropriate firmware practices.
Recommended
Legacy System Modernization
The EPM570FGF256I5N is frequently deployed to replace aging discrete 74-series glue logic, PAL/GAL devices, and legacy programmable array logic (PAL) in legacy systems where full FPGA migration is overkill. By consolidating dozens of discrete SSI/MSI logic packages into a single non-volatile CPLD, designers reduce PCB area, BOM cost, and assembly time, while gaining the ability to make field-revision updates via JTAG. The 5 ns tPD is comparable to classic 74F/74AS logic, easing timing closure when migrating from discrete designs.
Recommended
Recommended Products Summary
Engineering reference data for EPM570FGF256I5N — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EPM570F256I5N | EPM570F256C5N | EPM570F256I5 | EPM570F256C5NRR | EPM570F256C5 | EPM570F256C4N | EPM570F256C3N |
|---|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 256-ball FBGA (FGF256) | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same | 256-ball FBGA - same |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Propagation Delay (tPD) | 5.0 ns | 5.0 ns | [DATA_NEEDED] | 5.0 ns | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 5 (fast) | 5 | 5 | 5 | 5 | 5 | 4 | 3 |
| Configuration Memory | Internal Flash (non-volatile) | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash | Internal Flash |
Key Differentiators
- Industrial temperature grade with maximum performance (speed grade 5) (vs EPM570F256C5N)
- Largest user I/O count in the MAX II EPM570 family in this package (vs EPM240F100I5N)
- Instant-on non-volatile flash boot - deterministic startup without external PROM (vs EPM570F256C4N)
Design Notes
The 256-ball FBGA package requires a 4-layer or higher PCB stack-up with continuous ground and power planes directly beneath the device. Per IPC-7351 and the MAX II datasheet, place at least four via-in-pad or near-pad thermal vias under the center BGA balls to provide a low-impedance ground return and improve thermal dissipation. Decoupling capacitors (one 0.1 uF X7R per VCCIO bank plus one bulk 10 uF tantalum or ceramic) must be placed within 100 mils of the package to suppress switching noise.
JTAG chain integrity is critical for in-system programming. When multiple JTAG devices share the chain, place them in a single daisy-chain with TCK/TMS buffered if chain length exceeds 6 inches. The MAX II datasheet specifies 4-wire JTAG (TCK, TMS, TDI, TDO) plus optional TRST; route these signals with 50 ohm characteristic impedance and avoid routing parallel to fast-edge clocks for at least 3W spacing to prevent crosstalk into the programming chain.
Estimated: at 201 MHz internal operation and 50% I/O toggle rate, the EPM570FGF256I5N draws approximately 50-100 mA from the 3.3V core supply, plus an additional 5-15 mA per active I/O bank. Designs should budget a 250 mA 3.3V regulator for the core alone, with separate low-noise LDOs (such as TPS7A4701) feeding each VCCIO bank when interfacing to analog or RF circuits. The instant-on flash boot can cause a brief inrush current up to 300 mA at power-up, so regulator transient response must be sized accordingly.
Do not assume the 'FGF' package code is interchangeable with all 'F256' MAX II variants. According to the MAX II datasheet, FGF is a specific ball-map code; cross-package substitution requires verifying the exact BGA ball assignments via the Pin Planner tool. Also note that the Quartus II design tool is the only supported software for this family - Quartus Prime 13.0 and earlier are required; later versions (e.g., 15.0+) removed MAX II support.
Compliance Information
RoHS compliant per the FG (lead-free) suffix in the package code; AEC-Q100 qualification is not applicable as the part is intended for industrial/commercial, not automotive, applications.
