EPM570FGF256I5N vs EPM570F256C3N 对比

详细并排对比 EPM570FGF256I5N 出自 Intel 和 EPM570F256C3N 出自 Intel。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况,以确定最适合您设计需求的元器件。

规格对比

参数 EPM570FGF256I5N EPM570F256C3N
品牌 Intel Intel
分类 FPGA & CPLD FPGA & CPLD
生命周期状态 有效 有效
库存状态 有库存 有库存
单价(USD) $19.80 $13.75
Family MAX II MAX II
Device Type CPLD (Complex Programmable Logic Device) —
Logic Elements (LEs) 570 570
Macrocells 440 —
Propagation Delay (tPD) 5.0 ns —
User I/O Pins (max) 212 —
封装 256-ball FBGA (FGF256) 256-ball FBGA (FineLine BGA)
Process Technology 0.18 micron 0.18 um, 6-layer-metal flash CMOS
Configuration Memory Internal Flash (non-volatile, instant-on) —
Programming Interface JTAG / ISP JTAG (IEEE 1532 / IEEE 1149.1) + ISP
电源电压 3.3 V core / multi-volt I/O (1.5/1.8/2.5/3.3 V) —
Temperature Grade Industrial (-40C to +100C) —
Speed Grade 5 (fast) —
工作温度 -40C to +100C —
安装类型 Surface Mount Surface Mount
MSL 等级 [DATA_NEEDED: MSL level] [DATA_NEEDED: MSL level not stated in provided data]
RoHS 状态 Compliant Compliant (per DigiKey listing)
Equivalent Macrocells — 440
User Flash Memory (UFM) — 8 Kbits
Maximum Operating Frequency — 304 MHz
Core Voltage — 2.5 V / 3.3 V
I/O Voltage Support (MultiVolt) — 1.5 V, 1.8 V, 2.5 V, 3.3 V
User I/O Count — [DATA_NEEDED: confirm exact user-IO count for F256 package]
Operating Temperature (C3 grade) — 0 C to +85 C (commercial)
Lead-Free — Yes (per suffix 'N' convention)
Typical Macroscopic Functions — Glue logic, bus bridging, I/O expansion, power sequencing

数据手册与资源

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