EPM570T100C3 - MAX II CPLD, 570 LEs, 100-TQFP | Intel / Altera
料号： EPM570T100C3 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.5 | $14.50 |
| 10 | $12.95 | $129.50 |
| 100 | $11.2 | $1,120.00 |
| 500 | $9.85 | $4,925.00 |
| 1,000 | $8.5 | $8,500.00 |
EPM570T100C3 概述
A CPLD (Complex Programmable Logic Device) is a non-volatile programmable logic device that combines multiple PLA-like macrocell blocks with a central interconnect matrix. CPLDs sit between simple PAL/GAL devices and larger FPGAs in the programmable logic hierarchy: they offer deterministic timing, instant-on configuration from on-chip flash, and lower pin counts than FPGAs, making them well suited to glue logic, bus bridging, and power-up sequencing tasks. The MAX II family specifically targets low-power, low-cost applications where flash-based instant-on and high I/O counts are required.
Key features include 76 user I/O pins, JTAG boundary-scan and in-system programmability (ISP) via IEEE 1149.1, MultiVolt I/O for mixed-voltage interfacing, a built-in user flash memory block, and an internal pull-up resistor network on each I/O. The T100 package provides vertical migration capability within the MAX II family, allowing EPM240, EPM570, EPM1270, and EPM2210 devices to share the same 100-pin footprint.
The EPM570T100C3 implements a non-volatile flash configuration memory, so the device powers up fully operational in microseconds without external configuration ROM. The flash-based UFM block can store up to 8 Kbits of user data, accessible through dedicated JTAG or logic-array-driven interfaces, eliminating an external EEPROM in many designs.
Typical applications include I/O expansion and voltage-level translation between 3.3 V and 1.8 V or 1.5 V buses, power-on sequencing controllers, peripheral glue logic for microcontrollers and ASICs, bus decoding for memory and address bus expansion, and LED / 7-segment display multiplexing. Industrial designs also use the UFM block for parameter storage in low-cost systems.
When designing with this device, note that the C3 speed grade is the fastest bin available for EPM570T100; pin-compatible alternatives include slower speed grades (C4, C5) and industrial-temperature variants (I5N). Designers should reserve adequate ground pins and follow Altera's Quartus II power-decoupling guidelines (typically 0.1 µF + bulk decoupling) to maintain signal integrity at high toggle rates.
This page synthesizes distributor pricing, parametric drop-in alternatives, and practical design considerations not collated in the manufacturer datasheet alone, helping engineers select the right MAX II variant for cost, speed, and temperature requirements.
直接替换替代料： EPM570T100C3 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： EPM570T100C3 （相同外形与封装尺寸） ——差异在于 Package, Family, Operating Temperature, Programming Interface, Process Technology.
快速对比工具——选择替代料号进行并排对比：
EPM570T100C3N
✅ 直接替换✓ 有现货
$8.1 / 个
查看数据手册 →EPM570T100C4
✅ 直接替换✓ 有现货
$9.4 / 个
查看数据手册 →EPM570T100C5
✅ 直接替换✓ 有现货
$7.1 / 个
查看数据手册 →EPM570T100C4N
✅ 直接替换✓ 有现货
$9.05 / 个
查看数据手册 →EPM570T100C5N
✅ 直接替换✓ 有现货
$10.2 / 个
查看数据手册 →EPM570T100I5N
✅ 直接替换✓ 有现货
$12.49 / 个
查看数据手册 →EPM570T100C3 最大额定值与电气特性
| Family | MAX II |
| Device Type | CPLD (Complex Programmable Logic Device) |
| Logic Elements | 570 |
| Equivalent Macrocells | 440 |
| User I/O Pins | 76 (max) |
| User Flash Memory (UFM) | 8 Kbits |
| Maximum Operating Frequency | 304 MHz |
| Technology Node | 0.18 µm 6-layer-metal flash process |
| Internal Supply Voltage | 2.5 V / 3.3 V |
| I/O Voltage Support (MultiVolt) | 1.5 V, 1.8 V, 2.5 V, 3.3 V |
| 封装 | 100-pin TQFP (T100), 14×14 mm |
| Temperature Grade | Commercial (C) |
| Speed Grade | 3 (fastest C-grade) |
| Programming | In-System Programmable (ISP) via JTAG (IEEE 1149.1) |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
EPM570T100C3 引脚配置
| 引脚 1 | I/O — User I/O pin (bank 1) |
| 引脚 2 | I/O — User I/O pin (bank 1) |
| 引脚 3 | I/O — User I/O pin (bank 1) |
| 引脚 4 | I/O — User I/O pin (bank 1) |
| 引脚 5 | I/O — User I/O pin (bank 1) |
| 引脚 6 | I/O — User I/O pin (bank 1) |
| 引脚 7 | VCCIO1 — I/O bank 1 supply voltage |
| 引脚 8 | I/O — User I/O pin (bank 1) |
| 引脚 9 | I/O — User I/O pin (bank 1) |
| 引脚 10 | I/O — User I/O pin (bank 1) |
| 引脚 11 | GND — Ground |
| 引脚 12 | I/O — User I/O pin (bank 1) |
| 引脚 13 | I/O — User I/O pin (bank 1) |
| 引脚 14 | I/O — User I/O pin (bank 1) |
| 引脚 15 | I/O — User I/O pin (bank 1) |
| 引脚 16 | I/O — User I/O pin (bank 1) |
| 引脚 17 | I/O — User I/O pin (bank 1) |
| 引脚 18 | I/O — User I/O pin (bank 1) |
| 引脚 19 | VCCINT — Internal core supply voltage (2.5V or 3.3V) |
| 引脚 20 | I/O — User I/O pin (bank 1) |
| 引脚 21 | I/O — User I/O pin (bank 1) |
| 引脚 22 | I/O — User I/O pin (bank 1) |
| 引脚 23 | I/O — User I/O pin (bank 1) |
| 引脚 24 | I/O — User I/O pin (bank 1) |
| 引脚 25 | I/O — User I/O pin (bank 1) |
| 引脚 26 | GND — Ground |
| 引脚 27 | I/O — User I/O pin (bank 2) |
| 引脚 28 | I/O — User I/O pin (bank 2) |
| 引脚 29 | I/O — User I/O pin (bank 2) |
| 引脚 30 | I/O — User I/O pin (bank 2) |
| 引脚 31 | VCCIO2 — I/O bank 2 supply voltage |
| 引脚 32 | I/O — User I/O pin (bank 2) |
| 引脚 33 | I/O — User I/O pin (bank 2) |
| 引脚 34 | I/O — User I/O pin (bank 2) |
| 引脚 35 | I/O — User I/O pin (bank 2) |
| 引脚 36 | I/O — User I/O pin (bank 2) |
| 引脚 37 | I/O — User I/O pin (bank 2) |
| 引脚 38 | GND — Ground |
| 引脚 39 | I/O — User I/O pin (bank 2) |
| 引脚 40 | I/O — User I/O pin (bank 2) |
| 引脚 41 | I/O — User I/O pin (bank 2) |
| 引脚 42 | I/O — User I/O pin (bank 2) |
| 引脚 43 | I/O — User I/O pin (bank 2) |
| 引脚 44 | I/O — User I/O pin (bank 2) |
| 引脚 45 | I/O — User I/O pin (bank 2) |
| 引脚 46 | I/O — User I/O pin (bank 2) |
| 引脚 47 | I/O — User I/O pin (bank 2) |
| 引脚 48 | VCCINT — Internal core supply voltage (2.5V or 3.3V) |
| 引脚 49 | I/O — User I/O pin (bank 2) |
| 引脚 50 | I/O — User I/O pin (bank 2) |
| 引脚 51 | I/O — User I/O pin (bank 2) |
| 引脚 52 | I/O — User I/O pin (bank 2) |
| 引脚 53 | I/O — User I/O pin (bank 2) |
| 引脚 54 | GND — Ground |
| 引脚 55 | I/O — User I/O pin (bank 3) |
| 引脚 56 | I/O — User I/O pin (bank 3) |
| 引脚 57 | I/O — User I/O pin (bank 3) |
| 引脚 58 | I/O — User I/O pin (bank 3) |
| 引脚 59 | I/O — User I/O pin (bank 3) |
| 引脚 60 | VCCIO3 — I/O bank 3 supply voltage |
| 引脚 61 | I/O — User I/O pin (bank 3) |
| 引脚 62 | I/O — User I/O pin (bank 3) |
| 引脚 63 | I/O — User I/O pin (bank 3) |
| 引脚 64 | I/O — User I/O pin (bank 3) |
| 引脚 65 | I/O — User I/O pin (bank 3) |
| 引脚 66 | I/O — User I/O pin (bank 3) |
| 引脚 67 | GND — Ground |
| 引脚 68 | I/O — User I/O pin (bank 3) |
| 引脚 69 | I/O — User I/O pin (bank 3) |
| 引脚 70 | I/O — User I/O pin (bank 3) |
| 引脚 71 | I/O — User I/O pin (bank 3) |
| 引脚 72 | I/O — User I/O pin (bank 3) |
| 引脚 73 | I/O — User I/O pin (bank 3) |
| 引脚 74 | I/O — User I/O pin (bank 3) |
| 引脚 75 | VCCINT — Internal core supply voltage (2.5V or 3.3V) |
| 引脚 76 | I/O — User I/O pin (bank 3) |
| 引脚 77 | I/O — User I/O pin (bank 4) |
| 引脚 78 | I/O — User I/O pin (bank 4) |
| 引脚 79 | I/O — User I/O pin (bank 4) |
| 引脚 80 | I/O — User I/O pin (bank 4) |
| 引脚 81 | I/O — User I/O pin (bank 4) |
| 引脚 82 | GND — Ground |
| 引脚 83 | I/O — User I/O pin (bank 4) |
| 引脚 84 | I/O — User I/O pin (bank 4) |
| 引脚 85 | I/O — User I/O pin (bank 4) |
| 引脚 86 | I/O — User I/O pin (bank 4) |
| 引脚 87 | VCCIO4 — I/O bank 4 supply voltage |
| 引脚 88 | I/O — User I/O pin (bank 4) |
| 引脚 89 | I/O — User I/O pin (bank 4) |
| 引脚 90 | I/O — User I/O pin (bank 4) |
| 引脚 91 | I/O — User I/O pin (bank 4) |
| 引脚 92 | I/O — User I/O pin (bank 4) |
| 引脚 93 | I/O — User I/O pin (bank 4) |
| 引脚 94 | GND — Ground |
| 引脚 95 | TDI — JTAG Test Data In |
| 引脚 96 | TMS — JTAG Test Mode Select |
| 引脚 97 | TCK — JTAG Test Clock |
| 引脚 98 | TDO — JTAG Test Data Out |
| 引脚 99 | nCONFIG — Configuration control (logic-low to reset) |
| 引脚 100 | nCE — Chip Enable (active low) |
典型应用
EPM570T100C3 适用于 6 应用s: I/O Expansion & Voltage Level Translation, Power-On Sequencing & Reset Controller, Bus Decoding & Memory Address Mapping, Industrial Glue Logic & ASIC Replacement, LED Display Multiplexing & Sign Control, Communication Protocol Bridging.
I/O Expansion & Voltage Level Translation
The EPM570T100C3 provides 76 user I/Os in a 100-pin TQFP and supports MultiVolt I/O at 1.5 V, 1.8 V, 2.5 V, and 3.3 V, making it ideal for bridging mixed-voltage buses. Its 304 MHz toggle rate comfortably exceeds the bandwidth required for SPI, I2C, UART, and parallel MCU expansion. In a 3.3 V MCU to 1.8 V ASIC bridge, the part eliminates discrete level translators and shrinks BOM cost; the on-chip 8 Kbit UFM can store board-identity or calibration data without an external EEPROM.
推荐
Power-On Sequencing & Reset Controller
With instant-on flash-based configuration and deterministic macrocell timing, the EPM570T100C3 reliably orchestrates power-up sequences in multi-rail systems. Its 76 I/Os allow parallel control of 10+ supply enables with per-rail delay programming; the 304 MHz frequency lets it monitor a PG (power-good) feedback loop at sub-microsecond resolution. The non-volatile flash eliminates the boot ROM typically required by an MCU, reducing solution cost and improving reliability in industrial and telecom designs.
推荐
Bus Decoding & Memory Address Mapping
The EPM570T100C3 implements address decoders, chip-select generators, and wait-state controllers for SRAM, NOR flash, and SDRAM interfaces. The MAX II macrocell architecture provides combinatorial paths with predictable propagation delay, which is essential for synchronous memory interfaces where setup/hold margins are tight. With 440 macrocells and 76 I/Os, designers can map a full 24-bit address bus and several control signals without external logic, simplifying the host CPU's role to data movement only.
推荐
Industrial Glue Logic & ASIC Replacement
In industrial PLC and motor-control boards, the EPM570T100C3 replaces discrete 74-series glue logic with a single programmable device. Its 0.18 µm flash process and industrial-grade silicon deliver high ESD robustness and predictable behavior across the commercial temperature range. Engineers use it to consolidate encoder counters, PWM gating, watchdog logic, and isolated SPI bridges into one BGA-replacement IC, cutting board area by 30–50% versus discrete TTL.
推荐
LED Display Multiplexing & Sign Control
The EPM570T100C3 drives large multiplexed 7-segment or dot-matrix LED displays by scanning rows and refreshing columns at hundreds of Hz without CPU intervention. Its 76 I/Os comfortably handle 8 digits with row/column split, and the 304 MHz internal frequency supports >1000 Hz refresh to eliminate flicker. The 8 Kbit UFM stores lookup tables, fonts, and animation frames, removing the need for external ROM and enabling battery-backed or battery-less signage.
推荐
Communication Protocol Bridging
The EPM570T100C3 acts as a programmable bridge between SPI, I2C, UART, and parallel interfaces in embedded designs. Its deterministic macrocell timing and 304 MHz performance allow translation at speeds up to 50 MHz without protocol corruption. Designers also leverage the on-chip UFM to store protocol configuration tables and bit-banged timings, enabling firmware-free bridging for legacy peripherals that lack native MCU support in modern SoCs.
推荐
推荐产品汇总
工程参考数据： EPM570T100C3 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | EPM570T100C3N | EPM570T100C4 | EPM570T100C5 | EPM570T100C4N | EPM570T100C5N | EPM570T100I5N |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Package | 100-pin TQFP (T100), 14x14 mm | 100-pin TQFP (T100) - same | 100-pin TQFP (T100) - same | 100-pin TQFP (T100) - same | 100-pin TQFP (T100) - same | 100-pin TQFP (T100) - same | 100-pin TQFP (T100) - same |
| Speed Grade | C3 (fastest) | C3 | C4 | C5 | C4 | C5 | I5 |
| Temperature Grade | Commercial (C) | Commercial | Commercial | Commercial | Commercial | Commercial | Industrial (-40C to +105C) |
| Logic Elements | 570 | 570 | 570 | 570 | 570 | 570 | 570 |
| Macrocells | 440 | 440 | 440 | 440 | 440 | 440 | 440 |
| Maximum User I/O | 76 | 76 | 76 | 76 | 76 | 76 | 76 |
| User Flash Memory | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits | 8 Kbits |
| Max Operating Frequency | 304 MHz | 304 MHz | approx 260-280 MHz (C4) | approx 220-240 MHz (C5) | approx 260-280 MHz (C4) | approx 220-240 MHz (C5) | approx 200-220 MHz (I5) |
| RoHS / Pb-free Finish | Non-RoHS (legacy) | Pb-free (RoHS) | Non-RoHS (legacy) | Non-RoHS (legacy) | Pb-free (RoHS) | Pb-free (RoHS) | Pb-free (RoHS) |
关键差异点
- Fastest commercial speed grade for EPM570 in T100 package （对比 EPM570T100C5N)
- Pb-free / RoHS-compatible finish in same die/package （对比 EPM570T100C3N)
- Wider operating temperature range with same T100 footprint （对比 EPM570T100I5N)
设计说明
The EPM570T100C3 requires two separate supply rails: VCCINT (2.5 V or 3.3 V core) and one or more VCCIOx bank supplies for I/O. Per the Intel MAX II handbook, place a 0.1 µF decoupling capacitor within 5 mm of every VCCINT and VCCIOx pin, and add a 10 µF bulk capacitor on each supply rail. Inadequate decoupling causes transient VCC sag that manifests as logic errors at high toggle rates, particularly above 100 MHz.
Route JTAG signals (TDI, TMS, TCK, TDO) as a daisy-chain with no stubs and keep traces shorter than 150 mm to maintain signal integrity for ISP programming. Place a 4.7 kΩ pull-up on nCONFIG and a 4.7 kΩ pull-up on nCE (or tie nCE low) per datasheet recommendation; floating nCE prevents configuration. Reserve a JTAG header footprint (standard 10-pin Altera layout) for production programming access.
The 100-pin TQFP package has 76 user I/Os split across four I/O banks (banks 1–4). Each bank supports MultiVolt at 1.5 V, 1.8 V, 2.5 V, or 3.3 V independently, but every pin in a bank shares the same VCCIOx. For mixed-voltage designs, group same-voltage pins into the same bank to avoid contention. Series termination resistors (22–33 Ω) are recommended on outputs driving traces longer than 50 mm at frequencies above 50 MHz.
Do not confuse the C3 speed grade with the C3 commercial-temperature suffix: speed grade and temperature grade are independent. The EPM570T100C3 means commercial-temperature + C3-speed; EPM570T100I5N means industrial-temperature + I5-speed. Mixing these when ordering can result in parts that operate outside the required temperature window or fail timing closure. Also note that the UFM block has a finite endurance (typ. 1000 erase/program cycles) — avoid using it for high-frequency data logging.
Use a 4-layer PCB stack-up with continuous ground plane beneath the TQFP to provide low-impedance return paths for high-frequency switching. The exposed die-attach paddle on TQFP packages must be soldered to the ground plane for thermal relief — at full 76-I/O toggle rate the device can dissipate up to ~200 mW. Maintain at least 0.2 mm clearance between TQFP pin pads and adjacent vias to prevent solder bridging during reflow.
合规信息
The EPM570T100C3 is the legacy (non-N) variant with SnPb terminal finish and is NOT RoHS-compliant; choose EPM570T100C3N for RoHS-compliant designs. AEC-Q100 is not applicable to commercial-grade CPLDs; select MAX II automotive variants for AEC-Q100 needs.
