HMA84GR7CJR4N-UH - 32GB DDR4-2400 RDIMM ECC | SK hynix
料号： HMA84GR7CJR4N-UH ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $360 | $360.00 |
| 10 | $260 | $2,600.00 |
| 100 | $230 | $23,000.00 |
| 500 | $220 | $110,000.00 |
| 1,000 | $210 | $210,000.00 |
HMA84GR7CJR4N-UH 概述
A Registered DIMM (RDIMM) is a server-class memory module in which address and command signals pass through a register chip before reaching the DRAM devices. This registration reduces electrical loading on the memory controller, allowing more DIMMs per channel and higher capacities than unbuffered UDIMMs. Combined with ECC (Error Correction Code), which detects and corrects single-bit errors, RDIMMs sit at the top of the memory hierarchy for data-center and enterprise computing, above UDIMMs and SO-DIMMs.
Key features include 32GB capacity organized as 4Gx72 (64-bit data plus 8-bit ECC), DDR4-2400 transfer rate (PC4-19200 bandwidth), CAS latency CL17, and dual-rank x4 topology using 36 pieces of 2Gx4 8Gb C-die DDR4 SDRAM. The x4 DRAM organization enables SDDC (Single Device Data Correction), which corrects an entire DRAM device failure - a critical reliability feature for large-memory servers.
The module operates from a single 1.2V supply, roughly 20% lower than DDR3, reducing power draw and thermal load in dense server chassis. On-module register and PLL buffer the CA signals and clock, while on-die termination and DBI (data bus inversion) support signal integrity at 2400 MT/s across the 288-pin registered interface.
Typical applications include HPE ProLiant and Dell PowerEdge server memory upgrades, virtualization hosts, database servers, and cloud infrastructure where ECC-registered memory is mandatory for platform validation.
When deploying, verify server BIOS and QRD (Qualified Vendor List) support for DDR4-2400 RDIMMs, and populate channels in matched sets per the platform memory population rules to achieve optimal interleaving and speed.
This page synthesizes distributor pricing, drop-in alternatives, FAQ answers, and practical deployment notes not found in the manufacturer datasheet.
直接替换替代料： HMA84GR7CJR4N-UH ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
HMA84GR7CJR4N-RD
✓ 有现货
$419 / 个
查看数据手册 →HMA84GR7CJR4N-PB
✓ 有现货
$129 / 个
查看数据手册 →HMA84GR7CJR4N-XN
✓ 有现货
$377.3438 / 个
查看数据手册 →HMA84GR7CJR4N-WM
✓ 有现货
$230.6818 / 个
查看数据手册 →MTA18ASF2G72AZ-2G9
📋 参考替代料（不在目录中）
M393A4K40BB2-CTD
📋 参考替代料（不在目录中）
HMA84GR7CJR4N-UH-IN
📋 参考替代料（不在目录中）
HMA84GR7CJR4N-UH 规格参数
| 存储器类型 | DDR4 SDRAM RDIMM (ECC Registered) |
| Capacity | 32 GB (4Gx72) |
| Speed | DDR4-2400 (PC4-19200) |
| CAS 延迟 | CL17 |
| Configuration | 2Rx4 (Dual Rank, x4) |
| 电源电压 | 1.2 V |
| 引脚数量 | 288 |
| Form Factor | 288-pin DIMM (R-XDMA-N288) |
| DRAM Devices | 36x 2Gx4 FBGA (78-ball) 8Gb C-die |
| ECC | Yes (Registered ECC) |
| Ranks | 2 |
| Data Width | 72-bit (64 data + 8 ECC) |
| 安装类型 | Slot Mount |
| JESD-30 Code | R-XDMA-N288 |
| Temperature Grade | OTHER (per Partstack listing) |
HMA84GR7CJR4N-UH standard 引脚配置指南
HMA84GR7CJR4N-UH（standard 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： HMA84GR7CJR4N-UH.
请参阅 数据手册 以查看完整引脚配置。
典型应用
HMA84GR7CJR4N-UH 适用于 6 应用s: HPE ProLiant Server Memory Upgrade, Virtualization and Cloud Infrastructure, Database Server Main Memory, Enterprise Data Center Fleet Standardization, Storage and Backup Appliance Memory, High-Performance Computing Clusters.
HPE ProLiant Server Memory Upgrade
The HMA84GR7CJR4N-UH fits HPE ProLiant Gen9 and Gen10 platforms that specify DDR4-2400 RDIMMs, mapping to HPE OEM cross-reference SKUs in the 840758-B21 class. Its 32GB 2Rx4 x4 ECC organization provides SDDC-capable protection, which HPE platforms use to correct an entire failed x4 DRAM device without downtime - critical for 24/7 virtualization hosts. Modules are installed in matched quads per HPE population rules to enable full channel interleaving at 2400 MT/s across all populated DIMM slots.
推荐
Virtualization and Cloud Infrastructure
Hypervisor hosts (VMware ESXi, KVM, Hyper-V) benefit from the module's large 32GB capacity per DIMM, letting a 2-socket server reach 512GB-1TB with 16-32 modules. The registered interface reduces memory-controller electrical loading, sustaining 2400 MT/s even with two DIMMs per channel, while ECC corrects single-bit errors that would otherwise crash VMs. With CL17 at 1.2V, per-module power stays low, keeping chassis thermals within budget in high-density blade and 1U configurations.
推荐
Database Server Main Memory
In-memory databases (SAP HANA, Oracle, PostgreSQL buffer caches) demand both capacity and data integrity, which the HMA84GR7CJR4N-UH addresses with 32GB per module and registered ECC at PC4-19200 bandwidth. The x4 device topology enables platform-level Chipkill/SDDC correction, preventing silent data corruption from a single DRAM failure - a common root cause of database index corruption. Populating channels uniformly with this dual-rank module maximizes memory bandwidth for parallel query workloads on Xeon Scalable Gen9/Gen10 hosts.
推荐
Enterprise Data Center Fleet Standardization
For fleets standardized on DDR4-2400 RDIMMs, the HMA84GR7CJR4N-UH (with its -RD/-PB suffix siblings and Micron/Samsung equivalents) forms a procurement baseline: identical 288-pin registered interface, capacity, rank, and speed across vendors. This multi-sourcing strategy removes single-vendor allocation risk while preserving QVL qualification. Its JEDEC-standard R-XDMA-N288 package and 1.2V supply guarantee mechanical and electrical interchangeability, letting IT teams stock one 32GB SKU profile for heterogeneous Xeon server populations.
推荐
Storage and Backup Appliance Memory
RAID controllers and scale-out storage nodes cache metadata and hot data in main memory, where an uncorrected bit error can corrupt parity across an entire array. The module's registered ECC with x4 SDDC capability protects these workloads, and 32GB per slot allows appliances with 8-12 DIMM slots to reach 256-384GB cache capacity without populating every channel. DDR4-2400 CL17 latency balances sequential streaming bandwidth with low command latency for random small-I/O metadata reads.
推荐
High-Performance Computing Clusters
HPC nodes built on first-generation Xeon Scalable (Skylake-SP) processors run memory at a native DDR4-2400, making the -UH speed grade a cost-optimal fit: no bandwidth is sacrificed versus faster-binned parts. Dual-rank 2Rx4 topology improves effective bandwidth by 8-15% over single-rank modules in stream-triad workloads because the memory controller can overlap rank switching. With ECC required for week-long simulation jobs, this module delivers validated capacity per node at the lowest channel cost.
推荐
推荐产品汇总
工程参考数据： HMA84GR7CJR4N-UH ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | HMA84GR7CJR4N-RD | HMA84GR7CJR4N-XN | MTA18ASF2G72AZ-2G9 | M393A4K40BB2-CTD |
|---|---|---|---|---|---|
| Package | 288-pin RDIMM (R-XDMA-N288) | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | SK hynix | SK hynix | SK hynix | Micron Technology | Samsung Electronics |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB |
| ECC / Registration | ECC Registered | ECC Registered | ECC Registered | ECC Registered | ECC Registered |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
关键差异点
- Cost-optimal speed grade for 2400-native platforms （对比 HMA84GR7CJR4N-XN)
- SDDC-capable x4 device topology （对比 x8-based RDIMMs)
- Lower channel cost via mature C-die production （对比 MTA18ASF2G72AZ-2G9)
设计说明
Never install this RDIMM in a consumer desktop or unbuffered-only workstation: the register and PLL require an RDIMM-aware memory controller, and the board will fail POST. Conversely, do not mix RDIMMs with LRDIMMs in the same channel. Follow the server OEM population order (white slots first on HPE, e.g.) and populate in matched quads or octets of identical capacity, rank, and vendor to avoid speed down-training below 2400 MT/s.
Estimated: 36 DRAM devices plus register and PLL on a single 1.2V rail yield roughly 5-8W per module under sustained load. Ensure chassis airflow meets the server OEM minimum (typically 350-500 LFM across DIMM slots) and avoid leaving large adjacent-slot gaps that create hot spots. SK hynix server modules include thermal sensor access via SPD/I2C (TSO pins), which platform BMCs use for memory throttling - enable this in BIOS to protect against inlet-temperature excursions.
The 288-pin registered interface is a JEDEC-standard electrical environment, but mixing DRAM vendors within one channel can change training margins. For best signal integrity at 2400 MT/s, populate each channel with four modules of the same MPN family (e.g., all HMA84GR7CJR4N-UH or all MTA18ASF2G72AZ-2G9). If cross-vendor mixing is unavoidable, run a full memory training cycle after any population change and validate with platform diagnostics (HPE Memtest, Dell ePSA) before returning to service.
合规信息
Compliance declarations were not present in the retrieved web data; SK hynix computing DRAM products are typically RoHS compliant per manufacturer product pages, but this must be confirmed against the official datasheet/declaration before claiming compliance.
