HMA84GR7CJR4N-UH - 32GB DDR4-2400 RDIMM ECC | SK hynix
MPN: HMA84GR7CJR4N-UH ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $54.99 | $54.99 |
| 10 | $52.5 | $525.00 |
| 100 | $49 | $4,900.00 |
| 500 | $46.5 | $23,250.00 |
| 1,000 | $44 | $44,000.00 |
Drop-in alternatives for HMA84GR7CJR4N-UH — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
HMA84GR7CJR4N-RD
✅ Drop-In✓ In Stock
$419 / Unit
View Datasheet →HMA84GR7CJR4N-PB
✅ Drop-In✓ In Stock
$129 / Unit
View Datasheet →HMA84GR7CJR4N-XN
✅ Drop-In✓ In Stock
$383.72 / Unit
View Datasheet →HMA84GR7CJR4N-WM
✅ Drop-In✓ In Stock
$69 / Unit
View Datasheet →MTA18ASF2G72AZ-2G9
✅ Drop-In📋 Reference alternative (not in catalog)
M393A4K40BB2-CTD
✅ Drop-In📋 Reference alternative (not in catalog)
HMA84GR7CJR4N-UH-IN
✅ Drop-In📋 Reference alternative (not in catalog)
HMA84GR7CJR4N-UH Maximum Ratings & Electrical Characteristics
| Memory Type | DDR4 SDRAM RDIMM (ECC Registered) |
| Capacity | 32 GB (4Gx72) |
| Speed | DDR4-2400 (PC4-19200) |
| CAS Latency | CL17 |
| Configuration | 2Rx4 (Dual Rank, x4) |
| Supply Voltage | 1.2 V |
| Pin Count | 288 |
| Form Factor | 288-pin DIMM (R-XDMA-N288) |
| DRAM Devices | 36x 2Gx4 FBGA (78-ball) 8Gb C-die |
| ECC | Yes (Registered ECC) |
| Ranks | 2 |
| Data Width | 72-bit (64 data + 8 ECC) |
| Mounting Type | Slot Mount |
| JESD-30 Code | R-XDMA-N288 |
| Temperature Grade | OTHER (per Partstack listing) |
HMA84GR7CJR4N-UH standard Pin Configuration Guide
Complete pinout information for HMA84GR7CJR4N-UH (standard package) with 288 pins. This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for HMA84GR7CJR4N-UH.
Refer to the datasheet for full pin configuration.
Estimated pin count: 288 pins (digital package)
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
HMA84GR7CJR4N-UH is suitable for 6 applications: HPE ProLiant Server Memory Upgrade, Virtualization and Cloud Infrastructure, Database Server Main Memory, Enterprise Data Center Fleet Standardization, Storage and Backup Appliance Memory, High-Performance Computing Clusters.
HPE ProLiant Server Memory Upgrade
The HMA84GR7CJR4N-UH fits HPE ProLiant Gen9 and Gen10 platforms that specify DDR4-2400 RDIMMs, mapping to HPE OEM cross-reference SKUs in the 840758-B21 class. Its 32GB 2Rx4 x4 ECC organization provides SDDC-capable protection, which HPE platforms use to correct an entire failed x4 DRAM device without downtime - critical for 24/7 virtualization hosts. Modules are installed in matched quads per HPE population rules to enable full channel interleaving at 2400 MT/s across all populated DIMM slots.
Recommended
Virtualization and Cloud Infrastructure
Hypervisor hosts (VMware ESXi, KVM, Hyper-V) benefit from the module's large 32GB capacity per DIMM, letting a 2-socket server reach 512GB-1TB with 16-32 modules. The registered interface reduces memory-controller electrical loading, sustaining 2400 MT/s even with two DIMMs per channel, while ECC corrects single-bit errors that would otherwise crash VMs. With CL17 at 1.2V, per-module power stays low, keeping chassis thermals within budget in high-density blade and 1U configurations.
Recommended
Database Server Main Memory
In-memory databases (SAP HANA, Oracle, PostgreSQL buffer caches) demand both capacity and data integrity, which the HMA84GR7CJR4N-UH addresses with 32GB per module and registered ECC at PC4-19200 bandwidth. The x4 device topology enables platform-level Chipkill/SDDC correction, preventing silent data corruption from a single DRAM failure - a common root cause of database index corruption. Populating channels uniformly with this dual-rank module maximizes memory bandwidth for parallel query workloads on Xeon Scalable Gen9/Gen10 hosts.
Recommended
Enterprise Data Center Fleet Standardization
For fleets standardized on DDR4-2400 RDIMMs, the HMA84GR7CJR4N-UH (with its -RD/-PB suffix siblings and Micron/Samsung equivalents) forms a procurement baseline: identical 288-pin registered interface, capacity, rank, and speed across vendors. This multi-sourcing strategy removes single-vendor allocation risk while preserving QVL qualification. Its JEDEC-standard R-XDMA-N288 package and 1.2V supply guarantee mechanical and electrical interchangeability, letting IT teams stock one 32GB SKU profile for heterogeneous Xeon server populations.
Recommended
Storage and Backup Appliance Memory
RAID controllers and scale-out storage nodes cache metadata and hot data in main memory, where an uncorrected bit error can corrupt parity across an entire array. The module's registered ECC with x4 SDDC capability protects these workloads, and 32GB per slot allows appliances with 8-12 DIMM slots to reach 256-384GB cache capacity without populating every channel. DDR4-2400 CL17 latency balances sequential streaming bandwidth with low command latency for random small-I/O metadata reads.
Recommended
High-Performance Computing Clusters
HPC nodes built on first-generation Xeon Scalable (Skylake-SP) processors run memory at a native DDR4-2400, making the -UH speed grade a cost-optimal fit: no bandwidth is sacrificed versus faster-binned parts. Dual-rank 2Rx4 topology improves effective bandwidth by 8-15% over single-rank modules in stream-triad workloads because the memory controller can overlap rank switching. With ECC required for week-long simulation jobs, this module delivers validated capacity per node at the lowest channel cost.
Recommended
Recommended Products Summary
Engineering reference data for HMA84GR7CJR4N-UH — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | HMA84GR7CJR4N-RD | HMA84GR7CJR4N-XN | MTA18ASF2G72AZ-2G9 | M393A4K40BB2-CTD |
|---|---|---|---|---|---|
| Package | 288-pin RDIMM (R-XDMA-N288) | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same | 288-pin RDIMM - same |
| Brand | SK hynix | SK hynix | SK hynix | Micron Technology | Samsung Electronics |
| Capacity | 32 GB | 32 GB | 32 GB | 32 GB | 32 GB |
| Speed | DDR4-2400 (PC4-19200) | [DATA_NEEDED] | DDR4-3200 (PC4-25600) | DDR4-2400 (PC4-19200) | DDR4-2400 (PC4-19200) |
| CAS Latency | CL17 | [DATA_NEEDED] | [DATA_NEEDED] | CL17 | CL17 |
| Configuration | 2Rx4 (Dual Rank) | 2Rx4 | 2Rx4 | 2Rx4 | [DATA_NEEDED] (1Rx4/2Rx4 by variant) |
| ECC / Registration | ECC Registered | ECC Registered | ECC Registered | ECC Registered | ECC Registered |
| Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Approx. Unit Price | $54.99 (as of 2026-09-05) | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] | [DATA_NEEDED] |
Key Differentiators
- Cost-optimal speed grade for 2400-native platforms (vs HMA84GR7CJR4N-XN)
- SDDC-capable x4 device topology (vs x8-based RDIMMs)
- Lower channel cost via mature C-die production (vs MTA18ASF2G72AZ-2G9)
Design Notes
Never install this RDIMM in a consumer desktop or unbuffered-only workstation: the register and PLL require an RDIMM-aware memory controller, and the board will fail POST. Conversely, do not mix RDIMMs with LRDIMMs in the same channel. Follow the server OEM population order (white slots first on HPE, e.g.) and populate in matched quads or octets of identical capacity, rank, and vendor to avoid speed down-training below 2400 MT/s.
Estimated: 36 DRAM devices plus register and PLL on a single 1.2V rail yield roughly 5-8W per module under sustained load. Ensure chassis airflow meets the server OEM minimum (typically 350-500 LFM across DIMM slots) and avoid leaving large adjacent-slot gaps that create hot spots. SK hynix server modules include thermal sensor access via SPD/I2C (TSO pins), which platform BMCs use for memory throttling - enable this in BIOS to protect against inlet-temperature excursions.
The 288-pin registered interface is a JEDEC-standard electrical environment, but mixing DRAM vendors within one channel can change training margins. For best signal integrity at 2400 MT/s, populate each channel with four modules of the same MPN family (e.g., all HMA84GR7CJR4N-UH or all MTA18ASF2G72AZ-2G9). If cross-vendor mixing is unavoidable, run a full memory training cycle after any population change and validate with platform diagnostics (HPE Memtest, Dell ePSA) before returning to service.
Compliance Information
Compliance declarations were not present in the retrieved web data; SK hynix computing DRAM products are typically RoHS compliant per manufacturer product pages, but this must be confirmed against the official datasheet/declaration before claiming compliance.
