HMCG78MEBSA092N - 16GB DDR5 4800 SODIMM | SK Hynix | Laptop Memory
料号： HMCG78MEBSA092N ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $490.9091 | $490.91 |
| 10 | $354.5455 | $3,545.46 |
| 100 | $313.6364 | $31,363.64 |
| 500 | $300 | $150,000.00 |
| 1,000 | $286.3636 | $286,363.60 |
HMCG78MEBSA092N 概述
A DDR5 SODIMM (Small Outline Dual In-line Memory Module) is a compact memory module defined by the JEDEC DDR5 standard for space-constrained mobile computing platforms. Within the memory hierarchy, it sits as main system memory (DRAM) below CPU cache and above storage, and DDR5 doubles the bank groups and burst length (BL16) versus DDR4 while moving the power management IC (PMIC) onto the module itself.
Key features of this module include 16GB capacity in a single-rank 1Rx8 organization built from eight 2Gx8 DDR5 DRAM devices, 4800 MT/s data rate for 38.4 GB/s peak bandwidth per 64-bit channel, and the DDR5 on-module PMIC that improves power integrity versus DDR4. DDR5 native on-die ECC improves data reliability while the module remains non-ECC from the host perspective.
Technically, the module configures as 2Gx64 (1Gx64 per rank equivalent addressing), uses the DDR5 262-pin SODIMM edge connector with a single notch key, and supports CL40 latency at the JEDEC 4800 profile. The 1.1V VDD lowers power versus DDR4 1.2V, important for battery-operated notebooks.
Typical applications include laptop and notebook memory upgrades, mobile workstations, mini PCs, and embedded x86/ARM compute platforms with 262-pin DDR5 SODIMM sockets. It is marketed as a direct replacement for systems specifying Hynix HMCG78MEBSA092N or HMCG78MEBSA095N.
Design and upgrade consideration: verify the host BIOS supports JEDEC DDR5-4800 unbuffered non-ECC SODIMMs and populate matched modules per the platform manual; DDR5 SODIMMs are not backward-compatible with DDR4 sockets.
This page synthesizes distributor stock, cross-reference equivalents (OWC, Integral, NEMIX RAM), and practical design notes beyond what the manufacturer datasheet provides.
直接替换替代料： HMCG78MEBSA092N ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： HMCG78MEBSA092N （相同外形与封装尺寸） ——差异在于 Data Rate, Form Factor, ECC, CAS Latency, Memory Type.
快速对比工具——选择替代料号进行并排对比：
HMCG78MEBSA095N
📋 参考替代料（不在目录中）
HMCG78MEBSA092N-IN
📋 参考替代料（不在目录中）
OWCMSA16GA48ES
📋 参考替代料（不在目录中）
NEMIX-RAM-DDR5-4800-SODIMM-16GB
📋 参考替代料（不在目录中）
HMCG78AGBSA092N
📋 参考替代料（不在目录中）
HMCG78MEBSA092N 最大额定值与电气特性
| Capacity | 16 GB |
| 存储器类型 | DDR5 SDRAM SODIMM |
| 数据速率 | 4800 MT/s |
| PC Rating | PC5-38400 / PC5-4800B |
| Form Factor | 262-pin SODIMM |
| Voltage | 1.1 V |
| ECC | Non-ECC (DDR5 on-die ECC) |
| Buffered / Registered | Unbuffered |
| Rank / Organization | 1Rx8 |
| Module Configuration | 2Gx64 |
| DRAM Configuration | 8 x 2Gx8 DRAM |
| Data Width | 64-bit |
| CAS 延迟 | CL40 |
| Target Systems | Laptop / mobile workstation / mini PC |
| RoHS 状态 | Compliant (per JEDEC-standard equivalent listings) |
HMCG78MEBSA092N standard 引脚配置指南
HMCG78MEBSA092N（standard 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： HMCG78MEBSA092N.
请参阅 数据手册 以查看完整引脚配置。
典型应用
HMCG78MEBSA092N 适用于 6 应用s: Laptop and Notebook Memory Upgrade, Mobile Workstations, Mini PCs and Small Form Factor Desktops, Embedded and Industrial Compute, System Integrators and Channel Builds, Memory Repair and Field Service.
Laptop and Notebook Memory Upgrade
The HMCG78MEBSA092N is a direct-fit upgrade for laptops specifying 16GB DDR5-4800 PC5-38400 unbuffered non-ECC 262-pin SODIMMs. Its 1.1V VDD and DDR5 on-module PMIC reduce system power draw versus DDR4 1.2V modules, directly benefiting battery runtime, while 4800 MT/s delivers 38.4 GB/s of peak bandwidth per channel for responsive multitasking. The 1Rx8 single-rank organization simplifies memory training in consumer BIOSes and leaves the second SODIMM slot free for a matched module to enable dual-channel mode. Because DDR5-4800 is the baseline JEDEC profile for mainstream Intel Alder Lake and AMD Rembrandt mobile platforms, the module runs at full rated speed without BIOS overclocking.
推荐
Mobile Workstations
Mobile workstations used for CAD, video editing, and software compilation benefit from the HMCG78MEBSA092N's 16GB single-module capacity and 38.4 GB/s per-channel bandwidth at 4800 MT/s. The 1Rx8 organization with eight 2Gx8 DRAM devices keeps command/address load low, supporting stable operation at the JEDEC 4800 profile with CL40 latency. For workloads that exceed 16GB, a second identical or equivalent HMCG78MEBSA095N module enables dual-channel 32GB configurations, roughly doubling memory bandwidth for large dataset processing. DDR5's on-die ECC improves data integrity during long renders and simulation runs even though the module is host-side non-ECC, which suits the unbuffered SODIMM sockets found in workstation-class notebooks.
推荐
Mini PCs and Small Form Factor Desktops
Mini PCs built on mobile SoCs (Intel NUC-class, AMD mini platforms) use 262-pin DDR5 SODIMM sockets rather than UDIMMs, making the HMCG78MEBSA092N a fit-for-purpose memory option. The module's 4800 MT/s rate matches the default JEDEC speed supported by these SoCs' integrated memory controllers, and its 1.1V operation keeps the compact chassis thermal budget comfortable - a 16GB DDR5 SODIMM typically dissipates only a few watts under load. The 2Gx64 configuration presents a clean 64-bit data width to the controller, and the on-module PMIC offloads voltage regulation from the often power-constrained mini PC board design.
推荐
Embedded and Industrial Compute
Industrial PCs, edge gateways, and network appliances built from mobile chipsets frequently specify DDR5 SODIMMs for serviceability. The HMCG78MEBSA092N's JEDEC-standard 4800 MT/s unbuffered non-ECC profile ensures compatibility across a broad range of embedded x86 boards with 262-pin sockets, and its availability from multiple distributors (Octopart reported about 45,800 pcs of stock as of Aug 2026) supports long-term BOM stability. Designers should confirm module height clearance inside sealed or fanless enclosures and verify the board vendor's QVL, as industrial BIOSes can be conservative about DDR5 memory training. The single-rank 1Rx8 build reduces address/command loading, which improves margin on long SODIMM traces common in passive-backplane designs.
推荐
System Integrators and Channel Builds
System integrators building fleets of laptops and mini PCs can standardize on the HMCG78MEBSA092N as the qualifying module, with the OWC and NEMIX RAM JEDEC-identical equivalents as second-source options to de-risk supply. All listed equivalents share the 262-pin form factor, 4800 MT/s PC5-38400 profile, CL40 latency, 1.1V rail, and 1Rx8 organization, so images and memory-training settings validated on the Hynix module carry over without BIOS changes. Volume buyers typically source through Octopart-listed distributors, Win Source, or Fusion Worldwide via RFQ; XAIPART tier pricing reaches $39.90/unit at 1000 pieces as of 2026-09-05, supporting costed BOM rollups.
推荐
Memory Repair and Field Service
Field service technicians repairing business laptops often need a verified replacement for failed Hynix modules; the HMCG78MEBSA092N is frequently the factory-fitted part in enterprise DDR5 notebooks, and distributors such as CPUmedics and Compuram classify it explicitly as laptop/mobile-workstation memory. Carrying the HMCG78MEBSA095N or an OWC equivalent covers both Hynix suffixes with one stock item, since vendors list a single replacement SKU for both part numbers. DDR5's lower 1.1V rail and on-die ECC reduce repeat failures from marginal power delivery. Technicians should reseat modules and clean contacts first, as DDR5 SODIMM detection faults are often contact-related rather than DRAM device failure.
推荐
推荐产品汇总
工程参考数据： HMCG78MEBSA092N ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | HMCG78MEBSA095N | HMCG78MEBSA092N-IN | OWCMSA16GA48ES | NEMIX-RAM-DDR5-4800-SODIMM-16GB | HMCG78AGBSA092N |
|---|---|---|---|---|---|---|
| Package | 262-pin SODIMM | 262-pin SODIMM - same | 262-pin SODIMM - same | 262-pin SODIMM - same | 262-pin SODIMM - same | 262-pin SODIMM - same |
| Brand | SK Hynix | SK Hynix | Integral Memory | Other World Computing (OWC) | NEMIX RAM | SK Hynix |
| Capacity | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB | 16 GB |
| Voltage | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V | 1.1 V |
关键差异点
- Original manufacturer module with guaranteed JEDEC DDR5-4800 profile （对比 OWCMSA16GA48ES)
- Single-rank 1Rx8 build lowers memory-controller load （对比 HMCG78AGBSA092N)
- Deep second-source ecosystem （对比 HMCG78MEBSA092N-IN)
设计说明
DDR5 SODIMMs are mechanically and electrically incompatible with DDR4 SODIMM sockets: 262 pins vs 260, different notch key position, and 1.1V vs 1.2V VDD. Never force insertion. Also confirm the host platform's QVL before mixing die revisions - DDR5 memory training is more sensitive than DDR4, and mixing the HMCG78MEBSA092N (M-die class) with an A-die module such as HMCG78AGBSA092N may change training results.
For dual-channel operation, install matched modules (same capacity, speed, rank) in the socket pair defined by the platform manual. A 1Rx8 module like the HMCG78MEBSA092N paired with a 2Rx8 module may still train, but the channel runs at the common denominator profile, reducing the 4800 MT/s bandwidth benefit. The on-module PMIC also means power-integrity issues on the 5V auxiliary rail can manifest as memory errors - verify host PMIC firmware support (Intel/AMD reference designs).
Estimated: a 16GB DDR5-4800 SODIMM drawing roughly 2-4 W under active load (vs ~4-6 W for an equivalent DDR4 module) reflects the 1.1V rail and on-die ECC. In battery designs, the on-module PMIC improves rail efficiency but adds a small quiescent draw; for fanless enclosures, verify module height and airflow clearance above the DRAMs, as enclosed SODIMM bays are the primary thermal bottleneck for memory reliability.
合规信息
OWC listing for the HMCG78MEBSA092N replacement states JEDEC-standard and RoHS compliant; direct SK Hynix REACH/lead-free declarations not found in provided data.
