LFE3-35EA-6FTN256I - ECP3 33K LUTs FPGA 1.2V | Lattice
料号： LFE3-35EA-6FTN256I ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $52 | $52.00 |
| 10 | $46.5 | $465.00 |
| 100 | $38.2 | $3,820.00 |
| 500 | $33.8 | $16,900.00 |
| 1,000 | $30.1 | $30,100.00 |
LFE3-35EA-6FTN256I 概述
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic through SRAM-based configuration cells. FPGAs sit between ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP. The LatticeECP3 family targets low-power, high-volume applications that require SERDES connectivity, DSP blocks, and a low-cost fabric, making it distinct from Lattice's high-density ECP5 and CrossLink-NX families.
Key features of the LFE3-35EA-6FTN256I include 33.3K LUTs, 1.36 Mbit embedded sysMEM block RAM distributed across the fabric, 18x18 multipliers in dedicated DSP blocks, and multi-protocol SERDES supporting standards such as PCIe, Ethernet (SGMII, GbE), CPRI, and JESD204A/B. The 1.2 V core voltage enables low static and dynamic power consumption, while the -6 speed grade provides timing closure margin for cost-sensitive designs.
The LFE3-35EA-6FTN256I uses a 65 nm CMOS process and a symmetric FPGA fabric with embedded block RAM and DSP tiles. Configuration is loaded from external SPI flash through dedicated pins, and the part supports bitstream encryption and dual-boot for field upgrades. The on-chip SERDES reduces BOM cost by eliminating external PHY components for many common serial standards.
Typical applications include industrial Ethernet switches and fieldbus bridges, video bridging and display controllers, low-cost wireline backplanes, software-defined radio front ends, machine vision and image processing pipelines, and portable medical instrumentation. Designers select this part when they need SERDES, moderate logic density, and low power in a single, low-cost BGA.
When designing with this device, provide at least four PCB layers with continuous ground and power planes beneath the BGA, and route all differential SERDES pairs with 100 ohm differential impedance and intra-pair length matching under 150 mil. Decouple every VCC and VCCAUX pin with a 0.1 uF X7R capacitor placed within 100 mil of the ball.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers compare LFE3-35EA-6FTN256I against other ECP3 speed and package options.
直接替换替代料： LFE3-35EA-6FTN256I ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： LFE3-35EA-6FTN256I （相同外形与封装尺寸） ——差异在于 Operating Temperature, Package, Speed Grade, Mounting Type, Process Technology.
快速对比工具——选择替代料号进行并排对比：
LFE3-35EA-7FTN256I
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$36.5 / 个
查看数据手册 →LFE3-35EA-6FTN256C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LFE3-35EA-8FTN256I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LFE3-17EA-6FTN256I
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
LFE3-35EA-6FTN256C
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
EP4CE30F23C8N
✅ 直接替换✓ 有现货
$22.4 / 个
查看数据手册 →LCMXO3LF-6900E-5MG256I
✅ 直接替换✓ 有现货
$15.68 / 个
查看数据手册 →LFE3-35EA-6FTN256I 最大额定值与电气特性
| Family | LatticeECP3 |
| Logic Elements / LUTs | 33,000 (33.3K LUTs) |
| Number of Logic Cells | 33,000 |
| Number of I/O | 133 user I/O |
| Embedded Block RAM | 1,358,848 bits (1.36 Mbit) |
| DSP Blocks (18x18 multipliers) | 24 |
| On-die SERDES Channels | 4 (multi-protocol: PCIe, SGMII, CPRI, JESD204A/B) |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| 工作温度 | -40C to +100C (Industrial, 'I' suffix) |
| 封装 | 256-ball ftBGA (FTN256) |
| Process Technology | 65 nm CMOS |
| Configuration | External SPI flash, dual-boot, bitstream encryption supported |
| RoHS 状态 | Compliant |
| 安装类型 | Surface Mount (BGA) |
LFE3-35EA-6FTN256I 256-ball ftbga (ftn256) 引脚配置指南
LFE3-35EA-6FTN256I（256-ball ftbga (ftn256) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： LFE3-35EA-6FTN256I.
请参阅 数据手册 以查看完整引脚配置。
典型应用
LFE3-35EA-6FTN256I 适用于 6 应用s: Industrial Ethernet Switch and Fieldbus Bridge, Video Bridging and Display Controller, Low-Cost Software-Defined Radio Front End, Machine Vision and Image Processing, Portable Medical Instrumentation, Wireline Backplane and Protocol Bridge.
Industrial Ethernet Switch and Fieldbus Bridge
The LFE3-35EA-6FTN256I is well suited for industrial Ethernet switches, PROFINET/EtherCAT/IP gateways, and fieldbus bridges. Its 4 multi-protocol SERDES channels natively support SGMII, GbE, and PCIe, enabling direct connection to PHY devices without external bridging ICs. The 33K LUTs and 1.36 Mbit block RAM handle packet buffering and Layer 2 switching tables. The 1.2 V core and industrial -40C to +100C temperature range meet IEC 61850 and EN 50155 requirements for substation and rail signaling applications.
推荐
Video Bridging and Display Controller
The LFE3-35EA-6FTN256I serves as a video bridge between MIPI CSI-2, LVDS, and RGB/HDMI sources, with the 24 DSP blocks providing pixel processing and scaling. The 1.36 Mbit block RAM stores multiple frame buffers for deinterlacing and OSD overlay. The 133 user I/O accommodate wide parallel video buses, while the industrial temperature range supports kiosk, digital signage, and medical display applications. Designers pair this FPGA with HDMI transmitters and TFT bias ICs to form complete display subsystems.
推荐
Low-Cost Software-Defined Radio Front End
The LFE3-35EA-6FTN256I's 24 18x18 DSP slices and 4 SERDES channels make it a competitive choice for software-defined radio (SDR) front ends operating up to 200 MHz baseband. The 33K LUTs implement DDC/DUC, FIR filters, and digital upconversion; the SERDES interfaces to high-speed ADCs and DACs over JESD204A/B. The 1.2 V core draws low power, suitable for portable SDR and signal-intelligence gear. Pair with a wideband tuner and a JESD204 ADC to complete the receiver chain.
推荐
Machine Vision and Image Processing
The LFE3-35EA-6FTN256I drives machine vision pipelines with its 33K LUTs implementing image preprocessing, edge detection, and feature extraction. The 1.36 Mbit block RAM holds line buffers for 2D filtering, while the 24 DSP blocks accelerate convolution operations. The 4 SERDES channels accept data from FPGA mezzanine card (FMC) interfaces carrying Camera Link or CoaXPress. Industrial -40C to +100C operation enables deployment in factory-floor inspection systems without additional thermal management.
推荐
Portable Medical Instrumentation
The LFE3-35EA-6FTN256I powers portable patient monitors, ultrasound front ends, and point-of-care diagnostics with its low 1.2 V core power and integrated SERDES for ADC interfacing. The 33K LUTs and DSP blocks run beamforming, FFT, and digital filtering in real time. The industrial temperature range and high reliability suit IEC 60601-1 medical equipment environments. Compact 256-ball ftBGA packaging enables handheld form factors while still providing 133 user I/O for sensors and displays.
推荐
Wireline Backplane and Protocol Bridge
The LFE3-35EA-6FTN256I bridges between backplane protocols such as PCIe, CPRI, and SGMII in telecom and datacom equipment. Its 4 multi-protocol SERDES lanes support 3.125 Gbps operation natively, and the 33K LUTs implement PCS/MAC layers without external ASSPs. The 1.36 Mbit block RAM buffers packets during protocol conversion. The 256-ball ftBGA offers sufficient routing density for high-speed serial links while remaining cost-effective for volume deployment.
推荐
推荐产品汇总
工程参考数据： LFE3-35EA-6FTN256I ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | LFE3-35EA-7FTN256I | LFE3-35EA-6FTN256C | LFE3-35EA-8FTN256I | LFE3-17EA-6FTN256I | EP4CE30F23C8N |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Intel |
| Package | 256-ball ftBGA (FTN256) | 256-ball ftBGA (FTN256) - same | 256-ball ftBGA (FTN256) - same | 256-ball ftBGA (FTN256) - same | 256-ball ftBGA (FTN256) - same | FBGA-484 - different |
| Logic Elements / LUTs | 33,000 LUTs | 33,000 LUTs | 33,000 LUTs | 33,000 LUTs | 17,000 LUTs | 28,848 LEs |
| Embedded Block RAM | 1,358,848 bits (1.36 Mbit) | 1,358,848 bits | 1,358,848 bits | 1,358,848 bits | 716,800 bits | 608,256 bits |
| DSP Blocks (18x18) | 24 | 24 | 24 | 24 | 16 | 66 (18x18 multipliers) |
| SERDES Channels | 4 (PCIe, SGMII, CPRI, JESD204A/B) | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 0 (no on-die SERDES) |
| User I/O | 133 | 133 | 133 | 133 | 133 | 328 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V (Cyclone IV E) |
| Speed Grade | -6 | -7 (faster) | -6 | -8 (fastest) | -6 | C8 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
关键差异点
- Same 33K LUTs and 256-ball ftBGA across -6, -7, and -8 speed grades （对比 LFE3-35EA-7FTN256I)
- 4 on-die multi-protocol SERDES channels without external PHY cost （对比 EP4CE30F23C8N (Cyclone IV E))
- Lower LUT count than Cyclone IV E equivalent （对比 EP4CE30F23C8N)
设计说明
Use a 4-layer PCB with continuous ground and power planes beneath the 256-ball ftBGA. Route all 4 SERDES differential pairs with 100 ohm differential impedance and intra-pair length matching under 150 mil. Place a 0.1 uF X7R decoupling capacitor within 100 mil of every VCC and VCCAUX ball; add 4.7 uF bulk capacitors near the package corners. Reference: LatticeECP3 Family Data Sheet, Hardware Checklist section.
Estimated: at 33K LUT utilization, 1.2 V core, and full SERDES operation, the LFE3-35EA-6FTN256I draws approximately 0.5 to 1.0 W from VCCINT and an additional 0.3 to 0.5 W from each SERDES channel. A 1.5 A low-noise LDO or DC-DC regulator is recommended for the 1.2 V rail, with a ferrite bead to isolate SERDES analog supply. Always sequence VCCINT before or simultaneously with VCCAUX to prevent latchup.
Do not assume all ECP3 speed grades are pin-compatible at the bitstream level; the -7 and -8 grades require re-running the Diamond design tool flow because the timing model differs. The LFE3-35EA-6FTN256C commercial temperature variant is NOT suitable for industrial environments above 85C. When migrating from LFE3-17 to LFE3-35 in the same FTN256 footprint, verify that the new bitstream is generated for the larger device or the configuration flash must be re-sized.
合规信息
RoHS compliant per Lattice ECP3 product page. Not AEC-Q100 qualified (industrial grade only). Halogen-free status not explicitly stated in verified web data.
