LFE3-35EA-7FTN256I - 33K LUTs ECP3 FPGA, 256-FTBGA | Lattice
MPN: LFE3-35EA-7FTN256I ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $58.4 | $58.40 |
| 10 | $52.1 | $521.00 |
| 100 | $46.85 | $4,685.00 |
| 500 | $41.2 | $20,600.00 |
| 1,000 | $36.5 | $36,500.00 |
LFE3-35EA-7FTN256I Overview
A Field-Programmable Gate Array (FPGA) is a semiconductor device whose digital logic fabric, interconnect, and I/O can be reconfigured by the end user after manufacture. Within the broader semiconductor hierarchy, an FPGA is a programmable logic device, sitting alongside CPLDs as the two main categories of user-configurable digital ICs, both of which fall under the larger umbrella of Application-Specific Standard Products (ASSPs) and digital ASICs. The LatticeECP3 family specifically targets bridging, video, and low-cost communication designs, positioning this MPN between small CPLDs and high-end FPGAs such as Xilinx Virtex or Intel (Altera) Stratix families.
Key features of the LFE3-35EA-7FTN256I include 33.3K LUTs with embedded sysDSP-style multipliers, 133 user I/O supporting multiple I/O standards (LVCMOS, LVTTL, LVDS, SSTL, HSTL), integrated SERDES channels rated up to 3.2 Gbps for protocols such as PCIe Gen1, SGMII, SATA, and 8b/10b-encoded links, and a typical internal fabric operating frequency sufficient for high-speed control and data-path logic. The -7 speed grade indicates the second-fastest commercial bin within the ECP3 family, and the I-suffix indicates the industrial temperature range.
The LFE3-35EA-7FTN256I is built on a 65 nm CMOS process, which provides a favorable performance-per-watt ratio for embedded bridging, video processing, and machine-to-machine communication designs. The device integrates 1,358,848 system gates and 6.69 Mbits of embedded memory (EBR) for FIFO and buffer applications. Power-aware design flow via Lattice Diamond or ispLEVER Classic, combined with on-chip PLLs and clock-management tiles, lets designers hit timing closure at multi-hundred-megahertz Fmax while staying within a tight power envelope.
Typical applications for the LFE3-35EA-7FTN256I include low-cost video bridging (HDMI, DisplayPort, MIPI converters), industrial Ethernet / SERDES bridges, motor-control and factory-automation controllers, surveillance and machine-vision front-ends, and consumer-connectivity products such as docking stations and high-speed hubs. Industrial-grade temperature support and integrated 3.2 Gbps SERDES make it a common choice when designers need a hot-swappable, multi-protocol interconnect front-end.
When designing with this FPGA, ensure that the 256-ball FTBGA PCB footprint uses the manufacturer-recommended land pattern, including proper microvia stacking and a continuous ground plane under the BGA for signal-integrity and thermal relief. Plan clock trees around the on-chip PLLs and use the Lattice Diamond toolchain for synthesis, place-and-route, and SERDES configuration. For high-speed SERDES channels, follow the reference schematics for AC-coupling capacitor selection, 100-ohm differential routing, and pre-emphasis / de-emphasis settings as documented in the LatticeECP3 family data sheet.
This page synthesizes distributor pricing, same-family and cross-brand drop-in alternatives, comparison parameters, and practical design notes that go beyond the bare Lattice ECP3 datasheet, helping procurement and engineering teams make informed component decisions.
Drop-in alternatives for LFE3-35EA-7FTN256I — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with LFE3-35EA-7FTN256I (same form factor and footprint) — differing in Operating Temperature, Package, Speed Grade.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
LFE3-35EA-6FTN256I
✅ Drop-In✓ In Stock
$30.1 / Unit
View Datasheet →LFE3-35EA-8FTN256I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LFE3-70EA-7FTN256I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LFE3-35EA-7FTN256C
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LFE3-35EA-7FTG256I
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
LFE3-35EA-7FTN256I Maximum Ratings & Electrical Characteristics
| Product Type | FPGA (Field-Programmable Gate Array) |
| Series | LatticeECP3 (EConomy Plus 3) |
| Logic Cells / LUTs | 33,000 (33.3K LUTs) |
| System Gates | 1,358,848 |
| User I/O | 133 |
| Core Supply Voltage | 1.2 V |
| Process Technology | 65 nm CMOS |
| SERDES Data Rate | 150 Mbps to 3.2 Gbps |
| SERDES Protocol Support | PCIe Gen1, SGMII, SATA, 8b/10b, 10-bit SERDES |
| Speed Grade | -7 (second-fastest ECP3 bin) |
| Operating Temperature | -40 C to +100 C (Industrial, I-suffix) |
| Package | 256-ball FTBGA (FT = 17 x 17 mm, 1.0 mm pitch) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Lead-free, RoHS compliant |
| Configuration Memory | SRAM-based (external configuration flash required) |
LFE3-35EA-7FTN256I 256-ball ftbga (ft = 17 x 17 mm, 1.0 mm pitch) Pin Configuration Guide
Pin configuration for LFE3-35EA-7FTN256I (256-ball ftbga (ft = 17 x 17 mm, 1.0 mm pitch) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for LFE3-35EA-7FTN256I.
Refer to the datasheet for full pin configuration.
Typical Applications
LFE3-35EA-7FTN256I is suitable for 6 applications: Video Bridge / Display Converter, Industrial Ethernet / Fieldbus Bridge, Surveillance / Machine Vision Front-End, Medical Imaging / Diagnostic Equipment, Automotive Infotainment / Telematics, Docking Station / Multi-Protocol Hub.
Video Bridge / Display Converter
The LFE3-35EA-7FTN256I is well suited for video bridge applications converting HDMI, DisplayPort, MIPI DSI, or LVDS to other formats, thanks to its 33K LUTs of logic capacity, 133 user I/O supporting LVCMOS/LVDS/SSTL standards, and 3.2 Gbps SERDES channels that handle TMDS, DisplayPort 1.1, and HD-SDI link rates. The 1.2 V core supply and 65 nm process keep power below 1.5 W typical for active video pipelines, which is critical for compact adapter dongles and docking stations. The industrial temperature grade allows operation in harsh in-cabin automotive and outdoor signage environments without thermal derating. The -7 speed grade provides sufficient timing margin for 148.5 MHz pixel clocks common in 1080p60 video paths.
Recommended
Industrial Ethernet / Fieldbus Bridge
Industrial Ethernet and fieldbus bridge designs use the LFE3-35EA-7FTN256I to translate between protocols such as PROFINET, EtherCAT, SERCOS III, Modbus TCP, and CC-Link IE, leveraging its 3.2 Gbps SERDES for SGMII 1 Gbps Ethernet PHYs and its 33K LUT fabric for protocol stack processing. The industrial temperature range of -40 C to +100 C matches the requirements of factory-floor PLCs, motor drives, and remote I/O blocks. On-chip PLLs provide the precise clocking needed for IEEE 1588 timing synchronization, and the SRAM-based configuration allows field firmware updates via standard SPI flash. The 1.0 mm pitch 256-FTBGA package suits space-constrained DIN-rail modules.
Recommended
Surveillance / Machine Vision Front-End
Surveillance IP cameras and machine-vision front-ends benefit from the LFE3-35EA-7FTN256I's combination of high-speed SERDES for image-sensor interfacing, sufficient LUTs for image preprocessing pipelines (debayer, gamma, edge detection), and 133 I/O to drive parallel sensor buses, DDR2/DDR3 memory controllers, and HDMI outputs. The industrial temperature grade and 65 nm low-power process allow fanless enclosure designs. The device's ability to bridge MIPI CSI-2 to USB 3.0 or GigE Vision makes it a flexible hub for vision integrators. A typical 2-megapixel 60 fps pipeline fits comfortably within 33K LUTs at the -7 speed grade.
Recommended
Medical Imaging / Diagnostic Equipment
Medical imaging subsystems, including portable ultrasound, patient-monitoring displays, and endoscopy video processors, use the LFE3-35EA-7FTN256I to aggregate high-speed image data from sensor arrays and present it on LCD panels over LVDS or HDMI links. The 3.2 Gbps SERDES supports HD-SDI and HDMI 1.4 TMDS rates, and the 33K LUTs handle real-time image-pipeline algorithms. The industrial temperature range, low EMI from 1.2 V operation, and small 17 x 17 mm FTBGA footprint suit handheld and bedside medical devices. Lattice's long-term product longevity program supports medical certification cycles that demand 10+ year component availability.
Recommended
Automotive Infotainment / Telematics
In automotive infotainment head units, telematics control units, and rear-seat entertainment, the LFE3-35EA-7FTN256I serves as a flexible video and connectivity bridge between camera inputs, head-unit displays, MOST or Ethernet backbones, and external USB or HDMI ports. Its industrial temperature grade and 65 nm process meet typical in-cabin automotive environmental requirements. The 3.2 Gbps SERDES supports MOST150 and automotive Ethernet PHYs, while 133 I/O drive LVDS display panels and touch controllers. The same 256-FTBGA footprint across ECP3 density options enables easy migration from 33K to 70K LUTs as feature sets grow.
Recommended
Docking Station / Multi-Protocol Hub
USB Type-C docking stations, multi-protocol hubs, and Thunderbolt accessory boards use the LFE3-35EA-7FTN256I to bridge USB 3.0, DisplayPort, HDMI, SATA, and PCIe signals through its 3.2 Gbps SERDES channels. The 33K LUTs accommodate protocol mux/demux logic and PD (Power Delivery) negotiation controllers, and the 133 user I/O handle USB 2.0 sideband, I2C, SPI, and GPIO connections. The compact 256-FTBGA package fits the slim form factor of modern docking stations. The LFE3-35EA-7FTN256I's combination of cost, density, and SERDES integration lets designers replace multiple ASSP bridge ICs with one programmable device.
Recommended
Recommended Products Summary
Engineering reference data for LFE3-35EA-7FTN256I — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | LFE3-35EA-6FTN256I | LFE3-35EA-8FTN256I | LFE3-70EA-7FTN256I | LFE3-35EA-7FTN256C | LFE3-35EA-7FTG256I |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor |
| Package | 256-FTBGA (17x17 mm) | 256-FTBGA (17x17 mm) - same | 256-FTBGA (17x17 mm) - same | 256-FTBGA (17x17 mm) - same | 256-FTBGA (17x17 mm) - same | 256-FTBGA - same |
| Family | LatticeECP3 | LatticeECP3 | LatticeECP3 | LatticeECP3 | LatticeECP3 | LatticeECP3 |
| Logic Cells / LUTs | 33,000 LUTs | 33,000 LUTs | 33,000 LUTs | 70,000 LUTs (+112%) | 33,000 LUTs | 33,000 LUTs |
| Speed Grade | -7 (2nd fastest bin) | -6 (slower) | -8 (fastest) | -7 (same as this part) | -7 (same as this part) | -7 (same as this part) |
| Temperature Grade | Industrial (-40 to +100 C) | Industrial | Industrial | Industrial | Commercial (0 to +85 C) | Industrial |
| SERDES Max Rate | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps | 3.2 Gbps |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Approx. 1k Price (USD) | $36.50 | lower (cost-down option) | higher (premium speed) | higher (more density) | similar | similar |
Key Differentiators
- Same-package upgrade path within Lattice ECP3 family (vs LFE3-35EA-6FTN256I)
- Lower price vs higher-density ECP3 option (vs LFE3-70EA-7FTN256I)
- Industrial vs commercial temperature grade option (vs LFE3-35EA-7FTN256C)
Design Notes
The 256-ball FTBGA package uses a 1.0 mm ball pitch on a 17 x 17 mm body, which requires 4-layer or 6-layer PCB stackup with microvias for breakout. Use a continuous ground plane on the layer directly beneath the BGA, and follow Lattice's recommended land pattern with NSMD (non-solder mask defined) pads for best assembly yield. Decoupling: place 0.1 uF X7R ceramic bypass capacitors on every VCC and VCCAUX pin within 2-3 mm, and add 10 uF bulk caps near the package perimeter. SERDES power pins require an additional pi-filter (ferrite bead + capacitor) to isolate from noisy digital rails.
For 3.2 Gbps SERDES channels, follow 100-ohm differential routing with intra-pair skew under 1 ps and length matching to within 5 mil across the entire channel. Use AC-coupling capacitors (0.1 uF X7R 0402) on each differential pair as close to the receiver pins as possible. Reference the LatticeECP3 SERDES user guide (UG62) for pre-emphasis, de-emphasis, and equalization settings. Estimated: at 3.2 Gbps a 1 ps intra-pair skew corresponds to approximately 320 mV of eye asymmetry on a typical PRBS-7 pattern, so controlled-impedance routing is essential.
The 1.2 V core supply must be sequenced after the 2.5 V VCCAUX supply to prevent latch-up at power-up. Use a power-supply sequencer IC or a simple RC delay on the PG (power-good) input. Estimated: a typical video-bridge design running at 100 MHz fabric clock and 1 lane of 3.2 Gbps SERDES consumes approximately 0.8-1.2 W from the 1.2 V rail. Choose an LDO or DC-DC converter rated for at least 1.5 A continuous current to maintain regulation during SERDES bursts.
Do not use the LFE3-35EA-7FTN256I as a drop-in replacement for non-Lattice FPGAs (such as Xilinx Spartan-6 or Altera Cyclone IV) because the BGA ball map, configuration mode, and bitstream format are completely different. The SRAM-based configuration means the device needs an external SPI flash; design the flash footprint and programming interface (JTAG or Slave SPI) into the PCB. Common mistake: leaving JTAG TDI/TDO/TMS/TCK unconnected - the device will fail to configure if JTAG is not properly terminated to VCCIO via 4.7 kohm pull-ups.
Compliance Information
RoHS compliant and lead-free per Lattice product page and distributor listings. Not AEC-Q100 qualified; the I-suffix is industrial temperature grade, not automotive-qualified. For AEC-Q100 work, contact Lattice about Q-grade variants.
