LFE3-35EA-6FTN256I - ECP3 33K LUTs FPGA 1.2V | Lattice
N.º da peça: LFE3-35EA-6FTN256I ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $52 | $52,00 |
| 10 | $46.5 | $465,00 |
| 100 | $38.2 | $3.820,00 |
| 500 | $33.8 | $16.900,00 |
| 1.000 | $30.1 | $30.100,00 |
LFE3-35EA-6FTN256I Visão geral
An FPGA (Field-Programmable Gate Array) is a class of programmable logic device that allows hardware designers to implement arbitrary digital logic through SRAM-based configuration cells. FPGAs sit between ASICs and microcontrollers in the design hierarchy: ASIC > FPGA > CPLD > microcontroller > DSP. The LatticeECP3 family targets low-power, high-volume applications that require SERDES connectivity, DSP blocks, and a low-cost fabric, making it distinct from Lattice's high-density ECP5 and CrossLink-NX families.
Key features of the LFE3-35EA-6FTN256I include 33.3K LUTs, 1.36 Mbit embedded sysMEM block RAM distributed across the fabric, 18x18 multipliers in dedicated DSP blocks, and multi-protocol SERDES supporting standards such as PCIe, Ethernet (SGMII, GbE), CPRI, and JESD204A/B. The 1.2 V core voltage enables low static and dynamic power consumption, while the -6 speed grade provides timing closure margin for cost-sensitive designs.
The LFE3-35EA-6FTN256I uses a 65 nm CMOS process and a symmetric FPGA fabric with embedded block RAM and DSP tiles. Configuration is loaded from external SPI flash through dedicated pins, and the part supports bitstream encryption and dual-boot for field upgrades. The on-chip SERDES reduces BOM cost by eliminating external PHY components for many common serial standards.
Typical applications include industrial Ethernet switches and fieldbus bridges, video bridging and display controllers, low-cost wireline backplanes, software-defined radio front ends, machine vision and image processing pipelines, and portable medical instrumentation. Designers select this part when they need SERDES, moderate logic density, and low power in a single, low-cost BGA.
When designing with this device, provide at least four PCB layers with continuous ground and power planes beneath the BGA, and route all differential SERDES pairs with 100 ohm differential impedance and intra-pair length matching under 150 mil. Decouple every VCC and VCCAUX pin with a 0.1 uF X7R capacitor placed within 100 mil of the ball.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone, helping engineers compare LFE3-35EA-6FTN256I against other ECP3 speed and package options.
Alternativas drop-in para LFE3-35EA-6FTN256I — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com LFE3-35EA-6FTN256I (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Mounting Type, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
LFE3-35EA-7FTN256I
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$36.5 / unidade
Ver ficha técnica →LFE3-35EA-6FTN256C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-35EA-8FTN256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-17EA-6FTN256I
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
LFE3-35EA-6FTN256C
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP4CE30F23C8N
✅ Drop-In✓ Em estoque
$22.4 / unidade
Ver ficha técnica →LCMXO3LF-6900E-5MG256I
✅ Drop-In✓ Em estoque
$15.68 / unidade
Ver ficha técnica →LFE3-35EA-6FTN256I Classificações máximas e características elétricas
| Family | LatticeECP3 |
| Logic Elements / LUTs | 33,000 (33.3K LUTs) |
| Number of Logic Cells | 33,000 |
| Number of I/O | 133 user I/O |
| Embedded Block RAM | 1,358,848 bits (1.36 Mbit) |
| DSP Blocks (18x18 multipliers) | 24 |
| On-die SERDES Channels | 4 (multi-protocol: PCIe, SGMII, CPRI, JESD204A/B) |
| Core Supply Voltage | 1.2 V |
| Speed Grade | -6 |
| Temperatura de operação | -40C to +100C (Industrial, 'I' suffix) |
| Encapsulamento | 256-ball ftBGA (FTN256) |
| Process Technology | 65 nm CMOS |
| Configuration | External SPI flash, dual-boot, bitstream encryption supported |
| Status RoHS | Compliant |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do LFE3-35EA-6FTN256I 256-ball ftbga (ftn256)
Configuração de pinos para LFE3-35EA-6FTN256I (pacote 256-ball ftbga (ftn256)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para LFE3-35EA-6FTN256I.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
LFE3-35EA-6FTN256I é adequado para 6 aplicaçãos: Industrial Ethernet Switch and Fieldbus Bridge, Video Bridging and Display Controller, Low-Cost Software-Defined Radio Front End, Machine Vision and Image Processing, Portable Medical Instrumentation, Wireline Backplane and Protocol Bridge.
Industrial Ethernet Switch and Fieldbus Bridge
The LFE3-35EA-6FTN256I is well suited for industrial Ethernet switches, PROFINET/EtherCAT/IP gateways, and fieldbus bridges. Its 4 multi-protocol SERDES channels natively support SGMII, GbE, and PCIe, enabling direct connection to PHY devices without external bridging ICs. The 33K LUTs and 1.36 Mbit block RAM handle packet buffering and Layer 2 switching tables. The 1.2 V core and industrial -40C to +100C temperature range meet IEC 61850 and EN 50155 requirements for substation and rail signaling applications.
Recomendado
Video Bridging and Display Controller
The LFE3-35EA-6FTN256I serves as a video bridge between MIPI CSI-2, LVDS, and RGB/HDMI sources, with the 24 DSP blocks providing pixel processing and scaling. The 1.36 Mbit block RAM stores multiple frame buffers for deinterlacing and OSD overlay. The 133 user I/O accommodate wide parallel video buses, while the industrial temperature range supports kiosk, digital signage, and medical display applications. Designers pair this FPGA with HDMI transmitters and TFT bias ICs to form complete display subsystems.
Recomendado
Low-Cost Software-Defined Radio Front End
The LFE3-35EA-6FTN256I's 24 18x18 DSP slices and 4 SERDES channels make it a competitive choice for software-defined radio (SDR) front ends operating up to 200 MHz baseband. The 33K LUTs implement DDC/DUC, FIR filters, and digital upconversion; the SERDES interfaces to high-speed ADCs and DACs over JESD204A/B. The 1.2 V core draws low power, suitable for portable SDR and signal-intelligence gear. Pair with a wideband tuner and a JESD204 ADC to complete the receiver chain.
Recomendado
Machine Vision and Image Processing
The LFE3-35EA-6FTN256I drives machine vision pipelines with its 33K LUTs implementing image preprocessing, edge detection, and feature extraction. The 1.36 Mbit block RAM holds line buffers for 2D filtering, while the 24 DSP blocks accelerate convolution operations. The 4 SERDES channels accept data from FPGA mezzanine card (FMC) interfaces carrying Camera Link or CoaXPress. Industrial -40C to +100C operation enables deployment in factory-floor inspection systems without additional thermal management.
Recomendado
Portable Medical Instrumentation
The LFE3-35EA-6FTN256I powers portable patient monitors, ultrasound front ends, and point-of-care diagnostics with its low 1.2 V core power and integrated SERDES for ADC interfacing. The 33K LUTs and DSP blocks run beamforming, FFT, and digital filtering in real time. The industrial temperature range and high reliability suit IEC 60601-1 medical equipment environments. Compact 256-ball ftBGA packaging enables handheld form factors while still providing 133 user I/O for sensors and displays.
Recomendado
Wireline Backplane and Protocol Bridge
The LFE3-35EA-6FTN256I bridges between backplane protocols such as PCIe, CPRI, and SGMII in telecom and datacom equipment. Its 4 multi-protocol SERDES lanes support 3.125 Gbps operation natively, and the 33K LUTs implement PCS/MAC layers without external ASSPs. The 1.36 Mbit block RAM buffers packets during protocol conversion. The 256-ball ftBGA offers sufficient routing density for high-speed serial links while remaining cost-effective for volume deployment.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para LFE3-35EA-6FTN256I — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | LFE3-35EA-7FTN256I | LFE3-35EA-6FTN256C | LFE3-35EA-8FTN256I | LFE3-17EA-6FTN256I | EP4CE30F23C8N |
|---|---|---|---|---|---|---|
| Brand | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Lattice Semiconductor | Intel |
| Package | 256-ball ftBGA (FTN256) | 256-ball ftBGA (FTN256) - same | 256-ball ftBGA (FTN256) - same | 256-ball ftBGA (FTN256) - same | 256-ball ftBGA (FTN256) - same | FBGA-484 - different |
| Logic Elements / LUTs | 33,000 LUTs | 33,000 LUTs | 33,000 LUTs | 33,000 LUTs | 17,000 LUTs | 28,848 LEs |
| Embedded Block RAM | 1,358,848 bits (1.36 Mbit) | 1,358,848 bits | 1,358,848 bits | 1,358,848 bits | 716,800 bits | 608,256 bits |
| DSP Blocks (18x18) | 24 | 24 | 24 | 24 | 16 | 66 (18x18 multipliers) |
| SERDES Channels | 4 (PCIe, SGMII, CPRI, JESD204A/B) | 4 (same) | 4 (same) | 4 (same) | 4 (same) | 0 (no on-die SERDES) |
| User I/O | 133 | 133 | 133 | 133 | 133 | 328 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V (Cyclone IV E) |
| Speed Grade | -6 | -7 (faster) | -6 | -8 (fastest) | -6 | C8 |
| Operating Temperature | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) | -40C to +100C (Industrial) | -40C to +100C (Industrial) | 0C to +85C (Commercial) |
Principais diferenciais
- Same 33K LUTs and 256-ball ftBGA across -6, -7, and -8 speed grades (vs LFE3-35EA-7FTN256I)
- 4 on-die multi-protocol SERDES channels without external PHY cost (vs EP4CE30F23C8N (Cyclone IV E))
- Lower LUT count than Cyclone IV E equivalent (vs EP4CE30F23C8N)
Notas de projeto
Use a 4-layer PCB with continuous ground and power planes beneath the 256-ball ftBGA. Route all 4 SERDES differential pairs with 100 ohm differential impedance and intra-pair length matching under 150 mil. Place a 0.1 uF X7R decoupling capacitor within 100 mil of every VCC and VCCAUX ball; add 4.7 uF bulk capacitors near the package corners. Reference: LatticeECP3 Family Data Sheet, Hardware Checklist section.
Estimated: at 33K LUT utilization, 1.2 V core, and full SERDES operation, the LFE3-35EA-6FTN256I draws approximately 0.5 to 1.0 W from VCCINT and an additional 0.3 to 0.5 W from each SERDES channel. A 1.5 A low-noise LDO or DC-DC regulator is recommended for the 1.2 V rail, with a ferrite bead to isolate SERDES analog supply. Always sequence VCCINT before or simultaneously with VCCAUX to prevent latchup.
Do not assume all ECP3 speed grades are pin-compatible at the bitstream level; the -7 and -8 grades require re-running the Diamond design tool flow because the timing model differs. The LFE3-35EA-6FTN256C commercial temperature variant is NOT suitable for industrial environments above 85C. When migrating from LFE3-17 to LFE3-35 in the same FTN256 footprint, verify that the new bitstream is generated for the larger device or the configuration flash must be re-sized.
Informações de conformidade
RoHS compliant per Lattice ECP3 product page. Not AEC-Q100 qualified (industrial grade only). Halogen-free status not explicitly stated in verified web data.
