M1AFS1500-1FGG256K - 1.5M Gate Fusion FPGA, ARM Cortex-M1 | Microchip
料号： M1AFS1500-1FGG256K ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
M1AFS1500-1FGG256K 概述
A field-programmable gate array (FPGA) is a semiconductor device containing programmable logic blocks and interconnects that a designer configures after manufacturing. FPGAs sit within the broader hierarchy of programmable logic devices, bridging fixed-function ASICs and software-programmable processors. The Fusion family extends the standard FPGA concept by integrating configurable analog blocks, large flash memory, clock generation and management circuitry, and flash-based programmable logic into a single monolithic die, making it a true mixed-signal platform.
Key differentiating features of this M1 variant include an embedded ARM Cortex-M1 processor, flash-based (non-volatile) configuration that eliminates external boot memory, integrated analog peripherals for monitoring and control, and industrial-grade temperature performance. The 119 available I/Os support system interfacing while the 276,480 RAM bits accommodate buffering and embedded memory needs.
Architecturally, the device combines flash-based programmable fabric with the ARM Cortex-M1 soft-embedded processing solution, allowing single-chip control-plus-logic designs that would otherwise require a separate MCU. The monolithic integration of analog configuration circuitry and comprehensive clock management reduces bill-of-materials count and board area compared to discrete FPGA-plus-analog solutions.
Typical applications include industrial automation and control, power supply and system monitoring, embedded systems requiring mixed-signal integration, and aerospace or defense platforms needing the extended -55C to +100C temperature capability.
Design considerations: verify supply regulation within the 1.425V to 1.575V window and plan I/O banking according to the 256-FBGA ball map; the part ships in trays and carries a 16-week manufacturer lead time, so plan inventory accordingly.
This page synthesizes distributor pricing context, drop-in alternatives within the same 256-ball package, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： M1AFS1500-1FGG256K ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： M1AFS1500-1FGG256K （相同外形与封装尺寸） ——差异在于 Family, Package, System Gates, Clock Management, Process Technology.
快速对比工具——选择替代料号进行并排对比：
M1AFS1500-1FGG256I
✅ 直接替换✓ 有现货
$136.9 / 个
查看数据手册 →M1AFS1500-1FGG256
✅ 直接替换✓ 有现货
$172.23 / 个
查看数据手册 →M1AFS1500-2FGG256
✅ 直接替换✓ 有现货
$124.5 / 个
查看数据手册 →M1AFS1500-1FG256K
✅ 直接替换✓ 有现货
$627.13 / 个
查看数据手册 →M1AFS600-2FGG256
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →M7AFS600-FGG256
✅ 直接替换✓ 有现货
$232.4 / 个
查看数据手册 →M1AFS1500-1FGG256K 最大额定值与电气特性
| Number of Gates | 1,500,000 system gates |
| Number of I/O | 119 |
| Total RAM Bits | 276480 |
| Embedded Processor | ARM Cortex-M1 |
| 电源电压 | 1.425 V to 1.575 V (1.5 V nominal) |
| Max Frequency | 1282.05 MHz |
| Technology | 130 nm flash-based |
| 封装 / 外壳 | 256-LBGA (256-FBGA, 17x17 mm) |
| Supplier Device Package | 256-FPBGA (17x17) |
| 安装类型 | Surface Mount |
| 工作温度 | -55C to +100C (TJ) |
| Family | Fusion Mixed-Signal FPGA |
| Packaging | Tray |
| Programmable Type | In-System Programmable (flash-based, non-volatile) |
| RoHS 状态 | RoHS3 Compliant |
| Lead Free Status | Lead Free |
| Manufacturer Lead Time | 16 weeks |
| Product Status | Active |
M1AFS1500-1FGG256K 256-fpbga (17x17) 引脚配置指南
M1AFS1500-1FGG256K（256-fpbga (17x17) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： M1AFS1500-1FGG256K.
请参阅 数据手册 以查看完整引脚配置。
典型应用
M1AFS1500-1FGG256K 适用于 6 应用s: Industrial Automation and Control, Power Supply and System Monitoring, Embedded Processing and Single-Chip Control, Aerospace and Defense Platforms, Test and Measurement Instrumentation, IoT Edge Nodes and Smart Sensors.
Industrial Automation and Control
The M1AFS1500-1FGG256K fits industrial control nodes that combine custom sequencing logic with closed-loop analog monitoring, because its 1.5M-gate Fusion fabric and integrated configurable analog blocks replace separate FPGA, MCU, and monitor ICs on one die. The embedded ARM Cortex-M1 runs the control state machine while the fabric implements deterministic interfacing to encoders, actuators, and field buses across the 119 user I/Os. In a typical deployment, the 276,480 RAM bits buffer sensor and communication data, and the flash-based configuration makes the node instantly active at power-up without external boot memory. The -55C to +100C junction range and RoHS3 compliance suit factory-floor temperature excursions and lead-free assembly.
推荐
Power Supply and System Monitoring
The M1AFS1500-1FGG256K is well suited to power-supply supervision and telemetry boards because the Fusion family monolithically integrates configurable analog circuitry - voltage and temperature monitoring - with 1.5M gates of programmable logic for sequencing, fault latching, and PMBus-style control. The ARM Cortex-M1 processor executes management firmware while the fabric implements parallel comparators and protection interlocks with deterministic latency. Operating from a 1.5V core (1.425V to 1.575V) with flash-based non-volatile configuration, the device monitors rails from the moment power is applied, with no configuration-load window. The 256-ball 17x17 mm FBGA keeps the supervisor footprint compact on dense power boards.
推荐
Embedded Processing and Single-Chip Control
Designs needing a soft MCU plus glue logic benefit directly from the M1AFS1500-1FGG256K because the ARM Cortex-M1 processor is embedded in the same die as the programmable fabric, removing the separate microcontroller from the BOM. According to the Microchip Fusion family documentation, Cortex-M1 devices are offered in the same speed grades and packages as basic Fusion devices, so the processor plus 1.5M gates of custom logic, 276,480 RAM bits, and 119 I/Os coexist in the 256-ball FBGA. Typical builds include protocol bridges, motor-control sequencers, and data-acquisition front ends where firmware flexibility and hardware determinism must coexist on one verified, flash-configured device.
推荐
Aerospace and Defense Platforms
The M1AFS1500-1FGG256K supports defense and aerospace ground and airborne electronics because its specified -55C to +100C junction temperature range covers wide environmental extremes, and the flash-based fabric avoids the configuration-refresh vulnerability and external boot memory of SRAM FPGAs. The 1.5M gates accommodate sensor interfaces, bus controllers, and signal preprocessing, while the ARM Cortex-M1 hosts mission software. The monolithic integration of clock generation and management circuitry reduces the component count that must be qualified. For designs migrating between programs, footprint-compatible siblings such as M1AFS1500-1FGG256I and M1AFS1500-2FGG256 allow speed or grade changes without PCB respin.
推荐
Test and Measurement Instrumentation
Bench and rack instruments use the M1AFS1500-1FGG256K where custom timing, data capture, and analog health monitoring must coexist. The 1282.05 MHz family performance figure and 130nm flash fabric support fast state machines, while 276,480 RAM bits implement capture buffers and the 119 I/Os interface front-end ADCs, relays, and communication ports. The ARM Cortex-M1 runs instrument command firmware, and Fusion analog blocks track board temperature and supply health without extra monitor ICs. Flash configuration provides instant-on behavior valued in instruments, and the industrial temperature range allows use in uncooled, fanless enclosures common in modular test systems.
推荐
IoT Edge Nodes and Smart Sensors
Edge nodes that fuse multiple sensor streams benefit from the M1AFS1500-1FGG256K combination of ARM Cortex-M1 processing, 1.5M gates of custom preprocessing logic, and monolithic configurable analog for local signal conditioning and health monitoring. The flash-based fabric wakes instantly on power or event triggers with no configuration delay, an advantage for duty-cycled battery-backed nodes. The 256-ball 17x17 mm FBGA provides high integration density for compact sensor modules, and the industrial junction range tolerates uncontrolled outdoor and cabinet environments. Locally fusing and filtering data in fabric before Cortex-M1 processing reduces upstream bandwidth and latency for time-critical telemetry.
推荐
推荐产品汇总
工程参考数据： M1AFS1500-1FGG256K ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | M1AFS1500-1FGG256I | M1AFS1500-1FGG256 | M1AFS1500-2FGG256 | M1AFS1500-1FG256K | M1AFS600-2FGG256 | M7AFS600-FGG256 |
|---|---|---|---|---|---|---|---|
| Package | 256-LBGA (FGG256, 17x17 mm) | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same | 256-LBGA (FG256) - same footprint | 256-LBGA (FGG256) - same | 256-LBGA (FGG256) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 1,500,000 | 600,000 | 600,000 |
| Speed Grade | Standard (1) | Standard (1) | Standard (1) | -2 (faster) | Standard (1) | -2 (faster) | Standard |
| Supply Voltage | 1.425 V to 1.575 V (1.5 V nominal) | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V | 1.425 V to 1.575 V |
| Embedded Processor | ARM Cortex-M1 (M1 variant) | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 | ARM Cortex-M1 (M7 variant) |
| Configuration | Flash-based, non-volatile (no external boot device) | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile | Flash-based, non-volatile |
关键差异点
- Full 1.5M-gate capacity in the compact 256-ball footprint （对比 M1AFS600-2FGG256)
- Embedded ARM Cortex-M1 single-chip solution （对比 AFS1500 (non-M1) variants)
- Industrial-wide junction range in K grade （对比 M1AFS1500-1FGG256)
- Faster timing available in same package （对比 M1AFS1500-1FGG256K)
设计说明
Regulate the 1.5V core rail tightly within the 1.425V to 1.575V window specified for the M1AFS1500-1FGG256K. Use a low-drift buck or LDO with remote sense if the rail also serves other loads, and place bulk (22-47 uF) plus high-frequency (0.1 uF per ball region) decoupling on the 256-FBGA underside via array. Because flash-based Fusion devices draw configuration current only briefly at power-up, verify inrush against the regulator current limit; FPGA I/O bank supplies must also stay sequenced per the Fusion family datasheet power-up requirements.
The specified operating range is -55C to +100C junction temperature. Estimated: with a typical 17x17 mm 256-ball FBGA theta_JA on the order of 20-30 C/W on a standard 4-layer board, even 1W of internal dissipation can push junction temperature 20-30C above ambient, so derate your logic activity and I/O switching at high ambient temperatures. Use the Microchip Libero SoC power calculator to estimate dynamic power for your design, and add copper pour or airflow if estimated TJ approaches 100C. These theta values are estimates - confirm with the manufacturer datasheet thermal appendix.
The FGG256 suffix denotes the green (halogen-free/lead-free ball) variant of the 256-ball 17x17 mm FBGA footprint; if your supply chain may substitute FG256 parts, confirm ball metallization and reflow profile compatibility before qualifying both on one land pattern. Fan out the 0.8mm-class ball pitch with via-in-pad or dogbone escapes, define the 119 user I/O banks early to respect bank voltage groups, and keep configuration/programming balls routed to a header for in-system programming of the flash fabric.
Do not treat the 1282.05 MHz figure as a general-purpose fabric clock target - it is the family performance specification, and achievable logic speed depends on your speed grade (standard -1 vs -2) and routing. Another common pitfall is ignoring the 16-week manufacturer lead time (per Microchip USA): a shortage late in the build can idle production. Cross-qualify the same-footprint siblings M1AFS1500-1FGG256I and M1AFS1500-2FGG256 as second sources on your approved vendor list.
合规信息
RoHS3 Compliant and Lead Free per Microchip USA product listing. REACH, halogen-free, and conflict-minerals status not stated in provided data.
