M1AFS1500-2FGG256 - 1.5M Gate Fusion FPGA with Cortex-M1 | Microchip
MPN: M1AFS1500-2FGG256 ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $168 | $168.00 |
| 10 | $154.5 | $1,545.00 |
| 100 | $142 | $14,200.00 |
| 500 | $132 | $66,000.00 |
| 1,000 | $124.5 | $124,500.00 |
Drop-in alternatives for M1AFS1500-2FGG256 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
M1AFS1500-FGG256I
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$289.9 / Unit
View Datasheet →M1AFS600-FG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$22 / Unit
View Datasheet →M1AFS600-1FG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$69.15 / Unit
View Datasheet →A3P600-2FG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$57.43 / Unit
View Datasheet →A3P600-FG256
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$48.9 / Unit
View Datasheet →M1AFS1500-2FGG256 Maximum Ratings & Electrical Characteristics
| Series | M1AFS1500 (Fusion) |
| System Gates | 1,500,000 |
| Logic Cells | 38,400 |
| Embedded Processor | ARM Cortex-M1 |
| Maximum Clock Frequency | 350 MHz |
| Number of I/O | 119 |
| Operating Supply Voltage | 1.5 V |
| Flash Memory Bits (reported) | 276480 |
| Technology | CMOS, 130nm class |
| Speed Grade | -2 |
| Package / Case | 256-LBGA (FBGA, S-PBGA-B256) |
| Ball Pitch | 1.00 mm |
| Mounting Style | SMD/SMT |
| Operating Temperature Range | 0C to +70C |
| Analog Blocks | Configurable analog (Fusion mixed-signal architecture) |
| Programming Type | Flash-based (in-system programmable) |
| Packaging | Tray |
M1AFS1500-2FGG256 256-lbga (fbga, s-pbga-b256) Pin Configuration Guide
Complete pinout information for M1AFS1500-2FGG256 (256-lbga (fbga, s-pbga-b256) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for M1AFS1500-2FGG256.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
M1AFS1500-2FGG256 is suitable for 6 applications: Power Supply Board Management, Industrial Instrumentation, Smart Battery Management, Fan and Thermal Control Boards, Embedded System Control with ARM Cortex-M1, Test and Measurement Equipment.
Power Supply Board Management
The M1AFS1500-2FGG256 is purpose-built for intelligent power-supply supervision: its Fusion configurable analog blocks monitor multiple voltage rails and on-board temperature, while the ARM Cortex-M1 processor executes sequencing and fault-response firmware at up to 350 MHz. Placed as the board supervisor, it replaces several discrete voltage supervisors, ADCs, and a microcontroller, cutting BOM count and board area. The 119 user I/Os interface directly to DC-DC converter enable, PG, and margining pins, and the 1.5 V core keeps FPGA logic power modest. Flash-based configuration gives instant-on behavior at power-up, so rail sequencing is active before a boot-based controller would be ready - a quantified benefit in hot-swap and brown-out recovery scenarios.
Recommended
Industrial Instrumentation
In industrial instrumentation front ends, the M1AFS1500-2FGG256 combines 38,400 logic cells of glueless datapath logic with on-chip analog conditioning, letting designers digitize sensor signals and process them in the same device. The embedded ARM Cortex-M1 runs communication stacks and calibration routines, while the 350 MHz-capable clocking fabric handles timestamping and filtering. Its flash fabric is immune to configuration loss from SEU-heavy factory floors compared to SRAM FPGAs, and the 0C to +70C rating covers typical indoor instrumentation enclosures. The 1.5 V core supply reduces device power, easing convection-cooled enclosure thermal budgets, and the 256-ball 1.00 mm-pitch BGA fits standard mid-density PCB processes.
Recommended
Smart Battery Management
Battery management systems benefit directly from the Fusion architecture: the M1AFS1500-2FGG256's configurable analog inputs monitor cell voltages, pack current-sense amplifier outputs, and thermistors, while the ARM Cortex-M1 executes fuel-gauging and protection algorithms. The 1.5M-gate fabric implements state machines for charger handshake protocols and safety interlocks with deterministic timing, and 276,480 reported flash bits retain calibration and event logs without external memory. Flash-based instant-on logic enforces safe default states the moment power appears - critical in pack insertion and fault events. The 0C to +70C rating suits consumer and commercial battery packs; use the industrial -FGG256I variant for automotive-adjacent environments.
Recommended
Fan and Thermal Control Boards
Server and telecom fan controllers use the M1AFS1500-2FGG256 to read multiple tachometer inputs into its 119 I/O fabric, run PID loops on the ARM Cortex-M1, and drive PWM outputs - all on one chip with analog temperature-sense inputs handled by Fusion analog blocks. The 350 MHz clock fabric supports precise PWM edge placement at high resolution, and the monolithic integration replaces a microcontroller plus external ADC plus programmable logic, shrinking the thermal-management PCB. Flash configuration ensures fan safety defaults are live instantly at power-up, and deterministic hardware logic continues protection behavior even if firmware is reloading. The 1.5 V core keeps standby power low in always-on chassis applications.
Recommended
Embedded System Control with ARM Cortex-M1
General embedded control designs adopt the M1AFS1500-2FGG256 when a microcontroller alone lacks I/O flexibility and an FPGA alone lacks processing: the hard ARM Cortex-M1 core runs application firmware at up to 350 MHz-class clocking while 38,400 logic cells implement custom peripherals, protocol bridges, and accelerators in fabric. Because the fabric is flash-based, the design is single-chip and instant-on - no external configuration flash boot delay. Large embedded flash blocks store parameters and even configuration overlays. The 1.00 mm-pitch 256-ball BGA is reworkable with standard equipment, and Libero SoC provides the Cortex-M1 software toolchain integration, shortening the path from HDL capture to running C firmware.
Recommended
Test and Measurement Equipment
Bench and modular instruments exploit the M1AFS1500-2FGG256's mix of 350 MHz-class clock management, 38,400 logic cells, and configurable analog inputs for trigger logic, signal monitoring, and housekeeping functions on one die. The CCC clock-generation circuitry conditions external reference clocks for precise timestamping, while flash fabric avoids the configuration-drift and boot-latency concerns of SRAM FPGAs in instruments that must be measurement-ready immediately at power-on. The 119 I/Os connect front-panel controls, relays, and interlock circuits, and the ARM Cortex-M1 manages USB/LAN command parsing. The 0C to +70C commercial rating fits lab environments; derate or choose the I-grade variant for field portable gear.
Recommended
Recommended Products Summary
Engineering reference data for M1AFS1500-2FGG256 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | M1AFS1500-FGG256I | M1AFS600-FG256 | A3P600-2FG256 |
|---|---|---|---|---|
| Package | 256-LBGA (FBGA, FGG256) | 256-FBGA (same footprint) | 256-FBGA (same footprint) | 256-FBGA (same footprint) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| System Gates | 1,500,000 | 1,500,000 | ~600,000 | ~600,000 |
| Logic Cells | 38,400 | 38,400 | [DATA_NEEDED] | [DATA_NEEDED] |
| Embedded ARM Cortex-M1 | Yes | Yes | Yes (M1 Fusion) | No (ProASIC3) |
| Max Clock Frequency | 350 MHz | 350 MHz class | [DATA_NEEDED] | [DATA_NEEDED] |
| User I/O | 119 | 119 class | [DATA_NEEDED] | [DATA_NEEDED] |
| Operating Temperature | 0C to +70C | Industrial (I-suffix) | [DATA_NEEDED] | [DATA_NEEDED] |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
Key Differentiators
- Embedded ARM Cortex-M1 processor (vs A3P600-2FG256)
- Advantage (vs A3P600-2FG256)
- Largest Fusion fabric in 256-ball footprint (vs M1AFS600-FG256)
- Commercial temperature vs industrial (vs M1AFS1500-FGG256I)
Design Notes
The M1AFS1500-2FGG256 operates from a nominal 1.5 V core supply. Estimated guidance: a 38,400-logic-cell flash fabric at moderate utilization typically draws a few hundred milliwatts; budget the 1.5 V rail converter (e.g., a synchronous buck) for at least 1 A headroom including I/O banks and analog blocks. Follow the Fusion power-up sequencing section of the Microchip datasheet: flash-based parts are instant-on, but rail ramp order between core and I/O banks must still be respected. Verify per-bank VCCI selection for mixed-voltage I/O standards in Libero before layout.
The 256-ball FBGA with 1.00 mm pitch requires at least a 4-layer PCB with dedicated ground plane for ball via escape. Fan out with via-in-pad or dog-bone escapes on 0.2 mm drill; signal traces leaving the BGA field should maintain controlled impedance for any banked high-speed I/O. Place 100 nF ceramic decoupling capacitors within 2 mm of each power ball pair, plus bulk 10 uF per rail. Keep the JTAG programming chain accessible on test points - it is the primary debug path in Libero SoC and costly to retrofit.
Two frequent mistakes with Fusion devices: (1) assuming the 350 MHz headline figure applies to the Cortex-M1 subsystem or arbitrary user logic - actual Fmax must be closed in Libero SoC timing analysis with your design; (2) ignoring the analog block reference configuration - the Fusion analog peripherals require proper reference decoupling and calibration in firmware, not just digital instantiation. Also confirm the commercial 0C to +70C rating covers your environment; for extended temperature use the -FGG256I variant instead of risking field failures.
Compliance Information
RoHS/lead-free per Microchip standard production policy for PBGA Fusion devices; REACH and halogen-free status not stated in provided data - verify on Microchip environmental documentation for this ordering code.
