MB9EF226 - 32-bit ARM Cortex-R4 MCU, 128MHz, 2MB Flash | Infineon
料号： MB9EF226 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.45 | $2,345.00 |
| 500 | $20.8 | $10,400.00 |
| 1,000 | $18.95 | $18,950.00 |
MB9EF226 概述
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and peripherals. Within the broader semiconductor taxonomy, MCUs belong to integrated circuits, then to embedded processors, then to the power management hierarchy of system-on-chip devices. The MB9EF226 sits at the high-performance end of automotive-grade Cortex-R MCUs, bridging the gap between Cortex-M microcontrollers (used for general embedded control) and Cortex-A application processors (used for OS-heavy workloads).
Key features include 128 MHz Cortex-R4 core with FPU support, 2 MB Flash and substantial SRAM, automotive-grade qualification under AEC-Q100, and a rich peripheral set including multiple CAN-FD interfaces, Ethernet, USB, and FlexRay. The wide operating voltage range and extended temperature capability make the device suitable for chassis and powertrain ECUs.
Architecturally, the MB9EF226 uses the Titan platform with tightly coupled memory for deterministic latency. The Cortex-R4 core implements branch prediction and dual-issue capability for sustained high code density at clock speed. Hardware floating-point support accelerates sensor fusion and motor-control vector math.
Typical applications include automotive body controllers, electric vehicle battery management systems (BMS), industrial motor drives, and safety-critical PLCs. The MB9EF226 is also commonly deployed in HVAC control modules where deterministic CAN-FD communication is required.
When designing with this part, ensure your firmware toolchain supports Cortex-R4 (such as ARM DS-5 or IAR EWARM for Cortex-R). Decoupling capacitor placement around the 176-LQFP power pins is critical - use at least four 100 nF ceramics distributed across the package perimeter.
This page consolidates distributor pricing, verified alternatives from the same Titan family, and practical PCB-layout guidance not found in the standalone manufacturer datasheet, giving engineers a faster path from selection to prototype.
直接替换替代料： MB9EF226 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MB9EF226 （相同外形与封装尺寸） ——差异在于 Core Architecture, Package.
快速对比工具——选择替代料号进行并排对比：
CY9EF226
✅ 直接替换📋 参考替代料（不在目录中）
MB9EF226BPMC-GSE2-HTV
✅ 直接替换📋 参考替代料（不在目录中）
MB9EF226PMC-GSE2
✅ 直接替换✓ 有现货
$12.1 / 个
查看数据手册 →MB9EF226PMC-GSK5E2
✅ 直接替换📋 参考替代料（不在目录中）
MB9EF226EPMC-GSK5E2
✅ 直接替换📋 参考替代料（不在目录中）
MB9EF226EBPMC-GSE2
✅ 直接替换📋 参考替代料（不在目录中）
MB9EF226 最大额定值与电气特性
| Core Architecture | ARM Cortex-R4 with FPU |
| Core Bit Width | 32-bit |
| 最大时钟频率 | 128 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| 封装 | 176-pin LQFP (24x24 mm) |
| 安装类型 | Surface Mount |
| Instruction Pipeline | Yes (RISC-like performance) |
| Family | Titan / FCR4 MB9EF226 Series |
| Communication Interfaces | CAN-FD, Ethernet, USB, FlexRay |
| Automotive Qualification | AEC-Q100 (per Infineon listing) |
| RoHS 状态 | Compliant |
MB9EF226 176-pin lqfp (24x24 mm) 引脚配置指南
MB9EF226（176-pin lqfp (24x24 mm) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MB9EF226.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MB9EF226 适用于 6 应用s: Automotive Body Control Module, Electric Vehicle Battery Management System, Industrial Motor Drive Controller, Safety-Critical PLC, HVAC Control Module, Industrial Sensor Hub.
Automotive Body Control Module
The MB9EF226 fits automotive BCM applications because its 128 MHz Cortex-R4 core delivers deterministic interrupt latency for CAN-FD message handling across body domain networks. The 2 MB Flash holds lighting, door, and seat control firmware with headroom for over-the-air update staging. Hardware FPU accelerates sensor fusion for intrusion detection while AEC-Q100 qualification ensures reliability under -40C to +125C hood temperatures. The 176-LQFP package provides enough pins for multiple LIN, CAN-FD, and GPIO peripherals required by modern body ECUs.
推荐
Electric Vehicle Battery Management System
In EV BMS applications, the MB9EF226 monitors cell voltage and temperature across high-voltage battery packs with deterministic sampling timing from its Cortex-R4 core. The 2 MB Flash stores state-of-charge algorithms, cell-balancing routines, and diagnostic logs. Hardware floating-point accelerates Coulomb counting math while 176-LQFP pins provide sufficient GPIO for daisy-chained cell monitoring ICs. AEC-Q100 qualification and extended temperature support allow direct mounting near the battery pack without thermal derating.
推荐
Industrial Motor Drive Controller
The MB9EF226 serves industrial motor drives by combining 128 MHz Cortex-R4 performance with hardware FPU for field-oriented control (FOC) math. The 2 MB Flash accommodates motor parameter tables, PI tuning data, and fault logging without external memory expansion. The 176-LQFP exposes multiple PWM timers, quadrature encoder interfaces, and CAN-FD channels for servo drive integration. Deterministic interrupt response from the Cortex-R4 core keeps current-loop execution under 5 microseconds per PWM cycle.
推荐
Safety-Critical PLC
For safety PLCs, the MB9EF226's Cortex-R4 core provides branch prediction and dual-issue capability that maintains scan-loop timing under firmware variation. The 2 MB Flash stores IEC 61131-3 ladder logic compilation outputs plus safety signature data. The 176-LQFP package offers redundant CAN-FD channels for safety bus connectivity. AEC-Q100 qualification and locked-step debug interfaces support SIL-2 and SIL-3 industrial safety certification paths.
推荐
HVAC Control Module
The MB9EF226 handles HVAC zone control with deterministic CAN-FD communication for damper, blower, and temperature sensor coordination. The 2 MB Flash stores control maps for multi-zone climate algorithms and diagnostic trouble codes. The Cortex-R4 hardware FPU computes PID loops faster than software-emulated alternatives. The 176-LQFP package supports simultaneous LIN peripheral connections to actuator nodes and PWM outputs for blower speed control with minimal firmware overhead.
推荐
Industrial Sensor Hub
The MB9EF226 aggregates data from vibration, pressure, and temperature sensors in industrial IIoT gateways with deterministic sampling. The 2 MB Flash holds edge analytics firmware plus configuration profiles for multiple sensor types. The Cortex-R4 core's branch prediction maintains consistent cycle counts even with variable conditional code paths from different sensor pipelines. The 176-LQFP provides sufficient peripheral channels for SPI sensor clusters and Ethernet uplink connectivity.
推荐
推荐产品汇总
工程参考数据： MB9EF226 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | CY9EF226 | MB9EF226BPMC-GSE2-HTV | MB9EF226PMC-GSE2 | MB9EF226PMC-GSK5E2 | MB9EF226EPMC-GSK5E2 |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (LQP176, 24x24 mm) | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same |
| Brand | Infineon (formerly Cypress) | Infineon | Infineon | Infineon | Infineon | Infineon |
| Core | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU |
| Maximum Clock Frequency | 128 MHz | 128 MHz | 128 MHz | 128 MHz | 128 MHz | 128 MHz |
| Flash Memory | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) |
| Temperature Grade | Standard (GSE2) | Standard | Extended (HTV) | Standard | Standard | Extended (E prefix) |
| Automotive Qualification | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Reel/Packaging Variant | Standard | Standard | HTV packaging | GSE2 reel | GSK5E2 reel | GSK5E2 reel, E prefix |
关键差异点
- Cortex-R4 deterministic interrupt latency （对比 Cortex-M4 general-purpose MCU alternatives)
- AEC-Q100 automotive qualification （对比 Industrial-grade MCUs)
- Integrated CAN-FD and FlexRay （对比 MCUs requiring external communication controllers)
设计说明
Place at least four 100 nF ceramic decoupling capacitors around the perimeter of the 176-LQFP package, one near each corner of the power pin group. Add a 10 uF bulk capacitor adjacent to the main VDD pins to suppress transient current spikes during Cortex-R4 core activity peaks at 128 MHz. Use a solid ground pour on layer 2 directly under the package to minimize return-path inductance.
The 176-LQFP package has a junction-to-ambient thermal resistance of approximately 35 C/W. Estimated: at maximum CPU activity with 1.5 W core dissipation, junction temperature rises roughly 52 C above ambient. For continuous 128 MHz operation in enclosed automotive enclosures, consider attaching a small heatsink or improving PCB copper thermal dissipation with thermal vias beneath the exposed die pad.
Do not confuse the MB9EF226 (Cypress legacy prefix) with the CY9EF226 (Infineon post-acquisition prefix) when sourcing from mixed inventories; both are valid Infineon/Cypress part numbers for the same Titan die. Confirm with your distributor that firmware toolchain support targets Cortex-R4 specifically, as Cortex-M or Cortex-A toolchains will not generate correct code for this core.
合规信息
AEC-Q100 automotive qualified per Infineon Titan family datasheet. RoHS compliance confirmed via distributor listings.