MB9EF226 - 32-bit ARM Cortex-R4 MCU, 128MHz, 2MB Flash | Infineon
部品番号: MB9EF226 ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $26.1 | $261.00 |
| 100 | $23.45 | $2,345.00 |
| 500 | $20.8 | $10,400.00 |
| 1,000 | $18.95 | $18,950.00 |
MB9EF226 概要
A microcontroller (MCU) is a single-chip computer containing a CPU core, program and data memory, and peripherals. Within the broader semiconductor taxonomy, MCUs belong to integrated circuits, then to embedded processors, then to the power management hierarchy of system-on-chip devices. The MB9EF226 sits at the high-performance end of automotive-grade Cortex-R MCUs, bridging the gap between Cortex-M microcontrollers (used for general embedded control) and Cortex-A application processors (used for OS-heavy workloads).
Key features include 128 MHz Cortex-R4 core with FPU support, 2 MB Flash and substantial SRAM, automotive-grade qualification under AEC-Q100, and a rich peripheral set including multiple CAN-FD interfaces, Ethernet, USB, and FlexRay. The wide operating voltage range and extended temperature capability make the device suitable for chassis and powertrain ECUs.
Architecturally, the MB9EF226 uses the Titan platform with tightly coupled memory for deterministic latency. The Cortex-R4 core implements branch prediction and dual-issue capability for sustained high code density at clock speed. Hardware floating-point support accelerates sensor fusion and motor-control vector math.
Typical applications include automotive body controllers, electric vehicle battery management systems (BMS), industrial motor drives, and safety-critical PLCs. The MB9EF226 is also commonly deployed in HVAC control modules where deterministic CAN-FD communication is required.
When designing with this part, ensure your firmware toolchain supports Cortex-R4 (such as ARM DS-5 or IAR EWARM for Cortex-R). Decoupling capacitor placement around the 176-LQFP power pins is critical - use at least four 100 nF ceramics distributed across the package perimeter.
This page consolidates distributor pricing, verified alternatives from the same Titan family, and practical PCB-layout guidance not found in the standalone manufacturer datasheet, giving engineers a faster path from selection to prototype.
ドロップイン代替品: MB9EF226 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MB9EF226 （同一形状・フットプリント） — 相違点: Core Architecture, Package.
クイック比較ツール — 並列比較する代替部品を選択:
CY9EF226
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MB9EF226BPMC-GSE2-HTV
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MB9EF226PMC-GSE2
✅ ドロップイン✓ 在庫あり
$12.1 / 個
データシートを見る →MB9EF226PMC-GSK5E2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MB9EF226EPMC-GSK5E2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MB9EF226EBPMC-GSE2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MB9EF226 最大定格＆電気的特性
| Core Architecture | ARM Cortex-R4 with FPU |
| Core Bit Width | 32-bit |
| 最大クロック周波数 | 128 MHz |
| Program Flash Memory | 2 MB (2M x 8) |
| パッケージ | 176-pin LQFP (24x24 mm) |
| 実装タイプ | Surface Mount |
| Instruction Pipeline | Yes (RISC-like performance) |
| Family | Titan / FCR4 MB9EF226 Series |
| Communication Interfaces | CAN-FD, Ethernet, USB, FlexRay |
| Automotive Qualification | AEC-Q100 (per Infineon listing) |
| RoHS ステータス | Compliant |
MB9EF226 176-pin lqfp (24x24 mm) ピン配置ガイド
MB9EF226 (176-pin lqfp (24x24 mm) パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MB9EF226.
詳細は データシート をご参照ください。
主な用途
MB9EF226 の用途: 6 件s: Automotive Body Control Module, Electric Vehicle Battery Management System, Industrial Motor Drive Controller, Safety-Critical PLC, HVAC Control Module, Industrial Sensor Hub.
Automotive Body Control Module
The MB9EF226 fits automotive BCM applications because its 128 MHz Cortex-R4 core delivers deterministic interrupt latency for CAN-FD message handling across body domain networks. The 2 MB Flash holds lighting, door, and seat control firmware with headroom for over-the-air update staging. Hardware FPU accelerates sensor fusion for intrusion detection while AEC-Q100 qualification ensures reliability under -40C to +125C hood temperatures. The 176-LQFP package provides enough pins for multiple LIN, CAN-FD, and GPIO peripherals required by modern body ECUs.
おすすめ
Electric Vehicle Battery Management System
In EV BMS applications, the MB9EF226 monitors cell voltage and temperature across high-voltage battery packs with deterministic sampling timing from its Cortex-R4 core. The 2 MB Flash stores state-of-charge algorithms, cell-balancing routines, and diagnostic logs. Hardware floating-point accelerates Coulomb counting math while 176-LQFP pins provide sufficient GPIO for daisy-chained cell monitoring ICs. AEC-Q100 qualification and extended temperature support allow direct mounting near the battery pack without thermal derating.
おすすめ
Industrial Motor Drive Controller
The MB9EF226 serves industrial motor drives by combining 128 MHz Cortex-R4 performance with hardware FPU for field-oriented control (FOC) math. The 2 MB Flash accommodates motor parameter tables, PI tuning data, and fault logging without external memory expansion. The 176-LQFP exposes multiple PWM timers, quadrature encoder interfaces, and CAN-FD channels for servo drive integration. Deterministic interrupt response from the Cortex-R4 core keeps current-loop execution under 5 microseconds per PWM cycle.
おすすめ
Safety-Critical PLC
For safety PLCs, the MB9EF226's Cortex-R4 core provides branch prediction and dual-issue capability that maintains scan-loop timing under firmware variation. The 2 MB Flash stores IEC 61131-3 ladder logic compilation outputs plus safety signature data. The 176-LQFP package offers redundant CAN-FD channels for safety bus connectivity. AEC-Q100 qualification and locked-step debug interfaces support SIL-2 and SIL-3 industrial safety certification paths.
おすすめ
HVAC Control Module
The MB9EF226 handles HVAC zone control with deterministic CAN-FD communication for damper, blower, and temperature sensor coordination. The 2 MB Flash stores control maps for multi-zone climate algorithms and diagnostic trouble codes. The Cortex-R4 hardware FPU computes PID loops faster than software-emulated alternatives. The 176-LQFP package supports simultaneous LIN peripheral connections to actuator nodes and PWM outputs for blower speed control with minimal firmware overhead.
おすすめ
Industrial Sensor Hub
The MB9EF226 aggregates data from vibration, pressure, and temperature sensors in industrial IIoT gateways with deterministic sampling. The 2 MB Flash holds edge analytics firmware plus configuration profiles for multiple sensor types. The Cortex-R4 core's branch prediction maintains consistent cycle counts even with variable conditional code paths from different sensor pipelines. The 176-LQFP provides sufficient peripheral channels for SPI sensor clusters and Ethernet uplink connectivity.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MB9EF226 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | CY9EF226 | MB9EF226BPMC-GSE2-HTV | MB9EF226PMC-GSE2 | MB9EF226PMC-GSK5E2 | MB9EF226EPMC-GSK5E2 |
|---|---|---|---|---|---|---|
| Package | 176-LQFP (LQP176, 24x24 mm) | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same | 176-LQFP (LQP176) - same |
| Brand | Infineon (formerly Cypress) | Infineon | Infineon | Infineon | Infineon | Infineon |
| Core | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU | ARM Cortex-R4 with FPU |
| Maximum Clock Frequency | 128 MHz | 128 MHz | 128 MHz | 128 MHz | 128 MHz | 128 MHz |
| Flash Memory | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) | 2 MB (2M x 8) |
| Temperature Grade | Standard (GSE2) | Standard | Extended (HTV) | Standard | Standard | Extended (E prefix) |
| Automotive Qualification | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
| Reel/Packaging Variant | Standard | Standard | HTV packaging | GSE2 reel | GSK5E2 reel | GSK5E2 reel, E prefix |
主な差別化要因
- Cortex-R4 deterministic interrupt latency （vs Cortex-M4 general-purpose MCU alternatives)
- AEC-Q100 automotive qualification （vs Industrial-grade MCUs)
- Integrated CAN-FD and FlexRay （vs MCUs requiring external communication controllers)
設計ノート
Place at least four 100 nF ceramic decoupling capacitors around the perimeter of the 176-LQFP package, one near each corner of the power pin group. Add a 10 uF bulk capacitor adjacent to the main VDD pins to suppress transient current spikes during Cortex-R4 core activity peaks at 128 MHz. Use a solid ground pour on layer 2 directly under the package to minimize return-path inductance.
The 176-LQFP package has a junction-to-ambient thermal resistance of approximately 35 C/W. Estimated: at maximum CPU activity with 1.5 W core dissipation, junction temperature rises roughly 52 C above ambient. For continuous 128 MHz operation in enclosed automotive enclosures, consider attaching a small heatsink or improving PCB copper thermal dissipation with thermal vias beneath the exposed die pad.
Do not confuse the MB9EF226 (Cypress legacy prefix) with the CY9EF226 (Infineon post-acquisition prefix) when sourcing from mixed inventories; both are valid Infineon/Cypress part numbers for the same Titan die. Confirm with your distributor that firmware toolchain support targets Cortex-R4 specifically, as Cortex-M or Cortex-A toolchains will not generate correct code for this core.
コンプライアンス情報
AEC-Q100 automotive qualified per Infineon Titan family datasheet. RoHS compliance confirmed via distributor listings.