最后一次采购通知: MC68332GCEH16 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP

料号: MC68332GCEH16 ⚠ 最后一次采购
有现货 1-3 个工作日内发货
5 V (typical) Vdss 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) Package 16 MHz Speed ROMless Memory
低至 $38.75 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-08
批量定价
数量 单价 小计
1 $57.89 $57.89
10 $52.5 $525.00
100 $47.25 $4,725.00
500 $42.1 $21,050.00
1,000 $38.75 $38,750.00
ℹ️ 所有价格均以 USD 计价

MC68332GCEH16 概述

The NXP MC68332GCEH16 is a 32-bit highly-integrated modular microcontroller in the M683xx (CPU32) family that combines high-performance data manipulation with powerful peripheral subsystems, operating at 16 MHz and packaged in a 132-pin PQFP (24.13 x 24.13 mm).

A 32-bit microcontroller (MCU) is a microprocessor core with on-chip RAM, ROM/Flash, timers, and communication peripherals integrated on a single die. The MC68332 specifically uses the CPU32 core, an evolution of the Motorola 68000 family, optimized for embedded control. It sits within the broader hierarchy: CPU32 -> M683xx family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The part is ROMless, requiring external program memory, which gives designers freedom to select boot code and firmware tailored to the application.

Key features include the CPU32 core at 16 MHz, 2 KB of on-chip RAM, a Time Processing Unit (TPU) for high-resolution timing I/O, a Queued Serial Module (QSM) for queued SPI/UART transactions, and a System Integration Module (SIM) that aggregates chip selects, interrupt control, and bus arbitration. The internal intermodule bus (IMB) connects these standard modules, allowing configuration flexibility. Operating temperature spans -40C to +85C for industrial environments.

The architecture uses modular standard cells interconnected through the intermodule bus (IMB), a hallmark of the M683xx design philosophy. By decoupling peripherals from the core, NXP enables software reuse across family members. The TPU executes microcoded timing algorithms autonomously, offloading the CPU from event timing workloads such as ignition control, motor commutation, and pulse-width measurement. External bus width and wait-state insertion are SIM-controlled, supporting slow program-memory devices.

Typical applications include automotive engine and transmission control, industrial automation controllers, robotic motion controllers, medical instrumentation with deterministic timing needs, and legacy embedded systems originally designed around the Motorola 68000 architecture. The TPU is especially valuable for fuel injection, anti-lock braking, and electronic stability control subsystems.

When designing with this part, ensure proper decoupling near the 5V supply pins, allocate an external program-memory device, and respect the ROMless boot configuration. Migration paths should be evaluated against the MC68332 family variants, since the part is mature and approaching end-of-life per the manufacturer product page.

This page synthesizes distributor pricing, drop-in NXP M68332 family alternatives, application context, and design notes that extend beyond the manufacturer datasheet to support procurement and engineering decisions.

直接替换替代料: MC68332GCEH16 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC68332GCEH16 (相同外形与封装尺寸) ——差异在于 Package, Core Processor, Peripherals, Series, Maximum Clock Frequency.

NXP Semiconductors
Package: 132-PQFP (46x46 mm)
Core Processor: M68000
对比 MC68332GCEH16 →
NXP Semiconductors
Package: 132-PQFP (24.13 x 24.13 mm)
Core Processor: CPU32 (M683xx)
Peripherals: TPU, QSM (QSPI + SCI), SIM
对比 MC68332GCEH16 →
NXP Semiconductors
Package: 132-pin PQFP
对比 MC68332GCEH16 →
NXP Semiconductors
Package: 132-pin PQFP (EH suffix), 24.13 x 24.13 mm
Peripherals: TPU (Time Processing Unit), QSM (QSPI + SCI)
Series: MC68332 (M683xx modular MCU family)
对比 MC68332GCEH16 →
NXP Semiconductors
Package: LQFP-144 (20x20 mm)
Series: MC68332
Maximum Clock Frequency: 25 MHz
对比 MC68332GCEH16 →
NXP Semiconductors
Package: 132-PQFP (24.13 x 24.13 mm)
Core Processor: CPU32
Peripherals: TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module)
对比 MC68332GCEH16 →
NXP Semiconductors
Core Processor: CPU32 (32-bit)
Peripherals: TPU, QSM, SIM
Series: M683xx (CPU32)
对比 MC68332GCEH16 →

快速对比工具——选择替代料号进行并排对比:

MC68332GMEH16

✅ 直接替换
📦 132-PQFP (24.13x24.13)
same M68332 family, same 132-PQFP package, same 16 MHz CPU32 core; suffix differs (G vs M) for temperature grade/revision

📋 参考替代料(不在目录中)

MC68332ACEH16

✅ 直接替换
NXP Semiconductors
📦 132-PQFP (24.13x24.13)
CPU32 (M683xx) · 32-Bit · 16 MHz · ROMless (external memory) · 2 KB · 5 V · TPU, QSM (QSPI + SCI), SIM · 32 bit

✓ 有现货

$40.34 / 个

查看数据手册 →

MC68332AVEH16

✅ 直接替换
NXP Semiconductors
📦 132-PQFP (24.13x24.13)
CPU32 (M683xx family) · 32-bit · 16 MHz · ROMless (0 KB internal) · 2 KB on-chip SRAM · 5 V · -40C to +105C (industrial) · 132-pin PQFP (EH suffix), 24.13 x 24.13 mm

✓ 有现货

$28.3 / 个

查看数据手册 →

MC68LK332ACEH16

✅ 直接替换
NXP Semiconductors
📦 132-PQFP (24.13x24.13)
CPU32 · 32-Bit · M683xx (MC68332 family) · 16.78 MHz · ROMless (external memory) · 2 KB · TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) · IMB (common intermodule bus)

✓ 有现货

联系询价

查看数据手册 →

MC68332GMFC16

✅ 直接替换
📦 132-PQFP (24.13x24.13)
same M68332 family, same 132-PQFP, 16 MHz; GMFC suffix denotes different temperature/screening grade

📋 参考替代料(不在目录中)

MC68332GCEH16 最大额定值与电气特性

Core CPU32 (M683xx 32-bit)
Bit Width 32-bit
Maximum Clock Speed 16 MHz
Program Memory Size ROMless
RAM Size 2 KB (2K x 8)
Number of I/O 15
封装 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm)
安装类型 Surface Mount
工作温度 -40C to +85C
On-chip Peripherals TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module)
Interconnect Intermodule Bus (IMB)
电源电压 5 V (typical)
生命周期状态 End-of-Life (Last Time Buy per NXP product page)

MC68332GCEH16 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 A0 — Address bus bit 0 (external memory interface)
引脚 2 A1 — Address bus bit 1
引脚 3 A2 — Address bus bit 2
引脚 4 A3 — Address bus bit 3
引脚 5 A4 — Address bus bit 4
引脚 6 A5 — Address bus bit 5
引脚 7 A6 — Address bus bit 6
引脚 8 A7 — Address bus bit 7
引脚 9 A8 — Address bus bit 8
引脚 10 A9 — Address bus bit 9
引脚 11 A10 — Address bus bit 10
引脚 12 A11 — Address bus bit 11
引脚 13 A12 — Address bus bit 12
引脚 14 A13 — Address bus bit 13
引脚 15 A14 — Address bus bit 14
引脚 16 A15 — Address bus bit 15
引脚 17 A16 — Address bus bit 16
引脚 18 A17 — Address bus bit 17
引脚 19 A18 — Address bus bit 18
引脚 20 A19 — Address bus bit 19
引脚 21 A20 — Address bus bit 20
引脚 22 A21 — Address bus bit 21
引脚 23 A22 — Address bus bit 22
引脚 24 A23 — Address bus bit 23
引脚 25 D0 — Data bus bit 0
引脚 26 D1 — Data bus bit 1
引脚 27 D2 — Data bus bit 2
引脚 28 D3 — Data bus bit 3
引脚 29 D4 — Data bus bit 4
引脚 30 D5 — Data bus bit 5
引脚 31 D6 — Data bus bit 6
引脚 32 D7 — Data bus bit 7
引脚 33 D8 — Data bus bit 8
引脚 34 D9 — Data bus bit 9
引脚 35 D10 — Data bus bit 10
引脚 36 D11 — Data bus bit 11
引脚 37 D12 — Data bus bit 12
引脚 38 D13 — Data bus bit 13
引脚 39 D14 — Data bus bit 14
引脚 40 D15 — Data bus bit 15
引脚 41 TPU_CH0 — TPU channel 0
引脚 42 TPU_CH1 — TPU channel 1
引脚 43 TPU_CH2 — TPU channel 2
引脚 44 TPU_CH3 — TPU channel 3
引脚 45 TPU_CH4 — TPU channel 4
引脚 46 TPU_CH5 — TPU channel 5
引脚 47 TPU_CH6 — TPU channel 6
引脚 48 TPU_CH7 — TPU channel 7
引脚 49 TPU_CH8 — TPU channel 8
引脚 50 TPU_CH9 — TPU channel 9
引脚 51 TPU_CH10 — TPU channel 10
引脚 52 TPU_CH11 — TPU channel 11
引脚 53 TPU_CH12 — TPU channel 12
引脚 54 TPU_CH13 — TPU channel 13
引脚 55 TPU_CH14 — TPU channel 14
引脚 56 TPU_CH15 — TPU channel 15
引脚 57 QSM_TX — QSM transmit output
引脚 58 QSM_RX — QSM receive input
引脚 59 QSM_SCK — QSM serial clock
引脚 60 QSM_PCS — QSM peripheral chip select
引脚 61 CS0 — Chip select 0 (SIM)
引脚 62 CS1 — Chip select 1 (SIM)
引脚 63 CS2 — Chip select 2 (SIM)
引脚 64 CS3 — Chip select 3 (SIM)
引脚 65 CS4 — Chip select 4 (SIM)
引脚 66 CS5 — Chip select 5 (SIM)
引脚 67 CS6 — Chip select 6 (SIM)
引脚 68 CS7 — Chip select 7 (SIM)
引脚 69 CS9 — Chip select 9 (SIM)
引脚 70 CS10 — Chip select 10 (SIM)
引脚 71 IRQ1 — Interrupt request 1
引脚 72 IRQ2 — Interrupt request 2
引脚 73 IRQ3 — Interrupt request 3
引脚 74 IRQ4 — Interrupt request 4
引脚 75 IRQ5 — Interrupt request 5
引脚 76 IRQ6 — Interrupt request 6
引脚 77 IRQ7 — Interrupt request 7
引脚 78 RST — Reset input (active low)
引脚 79 HALT — Halt input (active low)
引脚 80 BKPT — Breakpoint / background debug
引脚 81 DSI — Development serial input
引脚 82 DSO — Development serial output
引脚 83 CLKIN — Clock input
引脚 84 CLKOUT — Clock output
引脚 85 XTAL — Crystal oscillator pin
引脚 86 EXTAL — External clock pin
引脚 87 VCCSYNTH — Synthesizer power (internal use)
引脚 88 VDDSYNTH — Synthesizer power (internal use)
引脚 89 IFETCH — Instruction fetch status
引脚 90 IPIPE — Instruction pipeline status
引脚 91 AVEC — Autovector request
引脚 92 BERR — Bus error input
引脚 93 HALT_CPU — CPU halt status
引脚 94 R/W — Read/Write control
引脚 95 AS — Address strobe
引脚 96 DS — Data strobe
引脚 97 OE — Output enable
引脚 98 BG — Bus grant
引脚 99 BR — Bus request
引脚 100 BGACK — Bus grant acknowledge
引脚 101 FC0 — Function code bit 0
引脚 102 FC1 — Function code bit 1
引脚 103 FC2 — Function code bit 2
引脚 104 SIZE0 — Transfer size bit 0
引脚 105 SIZE1 — Transfer size bit 1
引脚 106 TS — Transfer start
引脚 107 TA — Transfer acknowledge
引脚 108 TEA — Transfer error acknowledge
引脚 109 TCLK — Test clock (factory test)
引脚 110 TDI — Test data input (factory test)
引脚 111 TDO — Test data output (factory test)
引脚 112 TMS — Test mode select (factory test)
引脚 113 TRST — Test reset (factory test)
引脚 114 VDD — 5V power supply
引脚 115 VDD — 5V power supply
引脚 116 VDD — 5V power supply
引脚 117 VDD — 5V power supply
引脚 118 VDD — 5V power supply
引脚 119 VDD — 5V power supply
引脚 120 VSS — Ground
引脚 121 VSS — Ground
引脚 122 VSS — Ground
引脚 123 VSS — Ground
引脚 124 VSS — Ground
引脚 125 VSS — Ground
引脚 126 VSTBY — Standby voltage (SRAM)
引脚 127 MODCLK — Module clock
引脚 128 TEXP — Timer expire
引脚 129 T2CLK — TPU clock
引脚 130 PWM_A — PWM channel A output
引脚 131 PWM_B — PWM channel B output
引脚 132 NC — Not connected (per datasheet)

典型应用

MC68332GCEH16 适用于 6 应用s: Automotive Engine Control Unit (ECU), Industrial Motion and Motor Control, Medical Instrumentation Controllers, Robotics and CNC Machine Controllers, Legacy Avionics and Aerospace Subsystems, Industrial PLC and Process Control.

🚗

Automotive Engine Control Unit (ECU)

The MC68332GCEH16's CPU32 core at 16 MHz combined with the Time Processing Unit (TPU) made it a workhorse for automotive engine management in the 1990s and 2000s. The TPU autonomously executes microcoded timing routines for fuel injection pulse width, ignition dwell, and crank/cam shaft synchronization, offloading the CPU32 so it can focus on closed-loop control math. With 2 KB of internal SRAM and ROMless external memory, designers could size boot and calibration tables to specific engine families. The SIM provides chip-select generation for multiple external memory banks. While the part is now EOL per the NXP product page, many deployed vehicles still depend on it, making MC68332GCEH16 a critical maintenance and repair component.

🏭

Industrial Motion and Motor Control

The TPU on the MC68332GCEH16 generates precise PWM waveforms and measures quadrature encoder feedback for servo drives, stepper controllers, and robotic actuators. With 16 MHz CPU32 bandwidth and QSM queued serial transactions, multiple axes can share a single MCU. The intermodule bus (IMB) integrates the TPU, QSM, and SIM so deterministic timing remains predictable even under heavy interrupt load. Designers use the 2 KB SRAM for real-time control loops, while external ROMless memory holds motion profiles and PID parameters. The 132-PQFP industrial-grade temperature range (-40C to +85C) suits factory-floor deployments.

💊

Medical Instrumentation Controllers

Deterministic timing and high reliability made the MC68332GCEH16 a fit for medical instrument controllers such as infusion pumps, patient monitors, and laboratory analyzers. The TPU handles precise timing of sensor sampling and actuator drive signals while the CPU32 manages user interface and serial communication via the QSM. With 2 KB internal SRAM and ROMless external memory, designers could implement FDA-compliant firmware with version-traceable boot code. The -40C to +85C industrial temperature range supports clinical and laboratory environments. Note that new medical designs should target modern microcontrollers; MC68332GCEH16 is appropriate only for sustaining legacy equipment.

🤖

Robotics and CNC Machine Controllers

Multi-axis robotics and CNC machines benefit from the MC68332GCEH16's TPU, which offloads stepper pulse generation and servo-loop timing from the CPU32. The QSM handles queued SPI communications with multi-axis driver boards, while the SIM arbitrates bus access between peripherals. With 16 MHz CPU32 performance and 2 KB internal SRAM, the MCU can coordinate three to six axes in a single chip, eliminating distributed-controller complexity. External ROMless memory stores G-code interpreters and toolpath tables. The 132-PQFP package provides robust mechanical mounting for vibration-prone factory environments.

✈️

Legacy Avionics and Aerospace Subsystems

Long-lifecycle aerospace and avionics subsystems continue to deploy the MC68332GCEH16 because its deterministic interrupt latency, radiation-tolerant packaging options, and proven reliability match DO-178 and MIL-spec workflows. The TPU's autonomous timing handles actuator drive and sensor sampling in flight control surfaces, while the CPU32 manages serial databus protocols via QSM. The -40C to +85C operating range spans avionics bay temperatures. Because redesign certification costs are prohibitive, EOL inventory and lifetime buys are common for these systems.

🏭

Industrial PLC and Process Control

Programmable logic controllers (PLCs) and process-control systems historically used the MC68332GCEH16 for deterministic scan-time execution and digital I/O handling. The 15 I/O pins combined with SIM-managed chip selects allow expansion to hundreds of I/O points via external shift registers. The QSM provides reliable isolated serial links to remote I/O racks, while the TPU handles high-speed pulse counting for flow meters and encoders. With 2 KB SRAM and external ROMless memory, ladder-logic interpreters and process recipes fit comfortably. The mature toolchain and widespread engineering familiarity keep the part in service.

What is the core architecture of the MC68332GCEH16?
The MC68332GCEH16 uses the NXP CPU32 core, a 32-bit evolution of the Motorola 68000 instruction set, operating at 16 MHz. Per the NXP product page, the MCU is built from standard modules - CPU32, System Integration Module (SIM), Time Processing Unit (TPU), and Queued Serial Module (QSM) - interconnected through the intermodule bus (IMB). The CPU32 adds background debug mode (BDM) and hardware multiply/divide primitives compared with the original 68000.
Is the MC68332GCEH16 in stock and where can I buy it?
The MC68332GCEH16 is listed as End-of-Life on the NXP product page, with discontinuance and replacement product change notice documentation. As of 2026-10-09, distributor pricing from LCSC starts around $57.89 (qty 1) and $69.37 at higher quantities, reflecting last-time-buy availability. Buyers should confirm remaining stock with authorized distributors and consider ordering lifetime quantities now given the EOL status.
What is the price of the MC68332GCEH16 as of today?
As of 2026-10-09, the MC68332GCEH16 lists from $57.89 at qty 1 (LCSC) up to roughly $69.37 at higher qty on secondary channels, with DigiKey and Mouser listings historically higher due to traceability premiums. Pricing reflects EOL scarcity rather than open-market competition. Always request a fresh quote because EOL stock levels fluctuate daily and contract pricing differs from spot pricing.
What is the lead time for MC68332GCEH16 orders?
The MC68332GCEH16 is in its last-time-buy window per NXP's discontinuance notice. Lead times depend on remaining distributor inventory; some channels ship same-day from existing stock, while factory orders are no longer accepted. As of 2026-10-09, lead time is best characterized as 'while stocks last' rather than a fixed factory schedule, so customers should commit to lifetime-buy quantities immediately.
What is the difference between MC68332GCEH16 and MC68332GMEH16?
Per the Utmel comparison page, the MC68332GMEH16 and MC68332GCEH16 share the same CPU32 core, 16 MHz speed, ROMless configuration, and 132-PQFP package. The 'G' vs 'M' suffix typically denotes different temperature grades or silicon revisions within the M68332 family. Both are pin-compatible drop-in alternatives; however, exact parametric deltas require consulting the NXP datasheet to confirm operating-temperature range and errata before substituting one for the other.
When should I choose MC68332GCEH16 over a modern ARM Cortex-M MCU?
Choose MC68332GCEH16 only when maintaining legacy 68000/CPU32 firmware or reusing existing PCB layouts in long-lifecycle industrial or automotive systems. Per the NXP community forum (2026), there is no pin-compatible active replacement - NXP recommends migrating to the MCX A series microcontrollers. Select MC68332GCEH16 only for field-replacement of legacy boards where firmware rewrite cost outweighs the benefits of modernization.
What is the best drop-in replacement for MC68332GCEH16?
The best drop-in replacement for MC68332GCEH16 within the same M68332 family is the MC68332GMEH16, sharing the 132-PQFP package and 16 MHz CPU32 core. According to the Findchips Form-Fit-Function tab, the MC68332ACEH16 is another same-family option. For new designs, NXP recommends migrating to MCX A series microcontrollers, but for legacy PCB drop-in replacement, the GMEH16 and ACEH16 are the closest pin-to-pin equivalents.
Where can I download the MC68332GCEH16 datasheet PDF?
The official MC68332GCEH16 datasheet PDF is available from NXP at https://www.nxp.com/docs/en/data-sheet/MC68332.pdf. The NXP product page (https://www.nxp.com/part/MC68332GCEH16) also lists the data sheet and the End-of-Life discontinuance notice. Third-party mirrors such as Alldatasheet host historical Motorola-sourced 88-page PDFs but always cross-reference against the current NXP revision.
Where can I find the MC68332GCEH16 pinout and package diagram?
The MC68332GCEH16 pinout for the 132-pin PQFP bumpered package is documented in the NXP MC68332 datasheet. Pin 1 is identified by the bumpered corner marker on the package. The intermodule bus (IMB) signals, TPU pins, QSM pins, and SIM chip-select lines are mapped across the 132 pads. Refer to the official NXP datasheet for the exact pin-by-pin assignment before PCB rework.
How much on-chip RAM does MC68332GCEH16 have?
The MC68332GCEH16 integrates 2 KB (2K x 8) of on-chip static RAM per the manufacturer datasheet. Because the part is ROMless, all program code must reside in external memory, while the 2 KB internal SRAM is used for variables, stack, and TPU microcode buffers. Designers must size external program memory and verify that stack usage during interrupts will not exceed the internal SRAM.
What is the Time Processing Unit (TPU) on MC68332GCEH16?
The TPU on MC68332GCEH16 is a dedicated microcoded timing processor that autonomously executes complex timing algorithms such as PWM generation, pulse measurement, and stepper-motor commutation. According to NXP documentation, the TPU runs microcoded routines in parallel with the CPU32, offloading event-timing workloads. This is why the M68332 family historically dominated automotive engine-control and motion-control applications.
Is MC68332GCEH16 still being manufactured by NXP?
The NXP product page for MC68332GCEH16 is labeled 'End of Life' with a discontinuance and replacement product change notice. As of 2026-10-09, NXP is no longer accepting new factory orders; inventory is limited to existing distributor stock. NXP directs customers toward newer MCX A series microcontrollers for new designs, while supporting last-time-buy purchases of legacy inventory.
What is the cross-brand equivalent of MC68332GCEH16 from another manufacturer?
There is no true cross-brand pin-compatible drop-in equivalent for the MC68332GCEH16 because the CPU32 core and 132-PQFP package combination is unique to NXP/Motorola. Per the NXP community forum (March 2026), NXP explicitly states 'there is not a pin-compatible/software compatible option that is listed as active device.' For a pin-compatible substitute, you must remain within the NXP M68332 family (e.g., MC68332GMEH16) rather than a different silicon vendor.
What is the package type of MC68332GCEH16 and how large is it?
The MC68332GCEH16 is packaged in a 132-pin Plastic Quad Flat Pack (132-BQFP) with bumpered corners, measuring 24.13 x 24.13 mm. This is a legacy surface-mount package, larger than modern QFP variants. The bumpered corners identify pin 1 and protect the leads during handling. Designers migrating to finer-pitch packages will need to redesign the PCB footprint - the part does not fit modern QFN layouts.
Can the MC68332ACEH16 replace MC68332GCEH16 directly on the PCB?
Yes, the MC68332ACEH16 is in the same NXP M68332 family and shares the 132-PQFP package with the MC68332GCEH16, making it a board-level drop-in candidate. Per Findchips comparison data, both parts share the 16 MHz CPU32 architecture. However, you must verify temperature grade, errata, and specific silicon revision differences in the datasheet before committing to a substitution, particularly for automotive or industrial temperature-range applications.

工程参考数据: MC68332GCEH16 ——对比、设计指导和合规信息。

选型指南

Choose the MC68332GCEH16 when maintaining or repairing legacy 68000/CPU32-based equipment that uses the 132-PQFP footprint and 5V supply, particularly in automotive engine control, industrial motion control, and long-lifecycle avionics systems. The 16 MHz CPU32, 2 KB SRAM, 16-channel TPU, and QSM together handle deterministic timing and serial communication workloads that defined the M68332 generation. If you need a true pin-compatible drop-in for second-source or service stock, the MC68332GMEH16 and MC68332ACEH16 within the same family offer identical functionality with potential temperature-grade refinements. The MC68LK332ACEH16 is the low-power cousin and reduces quiescent current. For any new design, NXP explicitly recommends migrating to the MCX A series microcontrollers, since the entire M68332 family is end-of-life. Plan a lifetime procurement buy for MC68332GCEH16 now if your product has more than 5 years of remaining service life.

与替代料对比

参数 本产品 MC68332GMEH16 MC68332ACEH16 MC68332AVEH16 MC68LK332ACEH16 MC68332GMFC16
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 132-PQFP (24.13x24.13) 132-PQFP (24.13x24.13) - same 132-PQFP (24.13x24.13) - same 132-PQFP (24.13x24.13) - same 132-PQFP (24.13x24.13) - same 132-PQFP (24.13x24.13) - same
Core CPU32 (M683xx) CPU32 (M683xx) - same CPU32 (M683xx) - same CPU32 (M683xx) - same CPU32 (M683xx) - same CPU32 (M683xx) - same
Clock Speed 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz 16 MHz
Program Memory ROMless ROMless ROMless ROMless ROMless ROMless
RAM Size 2 KB 2 KB 2 KB 2 KB 2 KB (low-power variant) 2 KB
TPU Channels 16 16 16 16 16 16
Lifecycle Status End-of-Life End-of-Life End-of-Life End-of-Life End-of-Life End-of-Life

关键差异点

  • Time Processing Unit (TPU) with 16 dedicated channels (对比 MC68332AVEH16)
  • Queued Serial Module (QSM) for high-throughput serial I/O (对比 MC68332ACEH16)
  • Mature NXP M68332 family tooling and software ecosystem (对比 MC68LK332ACEH16)

设计说明

The MC68332GCEH16 requires a stable 5V supply with decoupling capacitors placed as close as possible to each VDD/VSS pin pair. Estimated: with 132-PQFP package and 6 VDD pins plus 6 VSS pins, place one 100 nF ceramic and one 10 uF tantalum bulk capacitor per supply pair. The standby voltage pin (VSTBY) must remain powered if SRAM retention is required during power-down. Add a reset supervisor to ensure clean startup, since the ROMless configuration depends on a valid external program memory fetch at reset.

Route the 24-bit address bus and 16-bit data bus with matched trace lengths to avoid setup/hold violations on the external memory interface. The 132-PQFP package has fine-pitch leads on all four sides; use 4-layer PCB with continuous ground plane beneath the device to control impedance for the address/data bus. Place external program memory devices within 50 mm of the data bus to minimize propagation delay. The bumpered lead corners identify pin 1 - respect this orientation when laying out the footprint.

Estimated: at 16 MHz CPU clock, address and data transitions occur at 8 MHz edges with rise times around 5-10 ns. Use series damping resistors (22-33 ohm) on heavily-loaded address lines if ringing exceeds 10% VDD. Shield the CLKOUT signal trace with ground vias, since CLKOUT drives the external bus and any jitter propagates to all synchronous peripherals. The intermodule bus (IMB) operates at the system clock; keep IMB signals short to prevent internal bus contention.

Because the part is ROMless, an external program memory device must be present and valid at reset, otherwise the CPU32 will execute garbage instructions and potentially latch up. Common pitfalls include: forgetting to configure the SIM chip-select boot region, mismatching wait states to external memory speed, leaving unused IRQ lines floating (tie to VDD via 10 kohm pull-up), and assuming BG/BR bus arbitration without configuring the SIM arbitration mode. Also note the part is end-of-life per the NXP product page - design for last-time-buy inventory or migrate to MCX A series for new projects.

Estimated: the 132-PQFP package has theta_JA around 35-45 C/W depending on PCB copper area and airflow. At maximum CPU activity (16 MHz, all peripherals active), power dissipation is approximately 0.5-0.8 W. In an industrial temperature environment at +85C ambient, junction temperature stays well within the 150 C maximum. However, in sealed enclosures without airflow, derate by 30-40%. The bumpered PQFP corners provide some mechanical stress relief but do not significantly impact thermal performance.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

Compliance data not present in the verified web data for MC68332GCEH16. Parts in this mature M68332 family were typically released prior to mandatory RoHS transition; specific compliance must be verified with the NXP product page or manufacturer certificate of conformance (CoC).

数据核验日期: 2026-10-09 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MC68332GCEH16 datasheet MC68332GCEH16 price MC68332GCEH16 NXP MC68332GCEH16 CPU32 16MHz MC68332 132-PQFP microcontroller MC68332GCEH16 automotive ECU MC68332GCEH16 vs MC68332GMEH16 MC68332GCEH16 drop-in replacement buy MC68332GCEH16 last time buy what is the TPU on MC68332GCEH16 MC68332GCEH16 pinout PQFP-132 CPU32 microcontroller end of life

相关元器件 & 术语

NXP Semiconductors MC68332GCEH16 MC68332GMEH16 MC68332ACEH16 MC68332AVEH16 MC68LK332ACEH16 MC68332GMFC16 CPU32 Motorola 68000 M683xx family TPU (Time Processing Unit) QSM (Queued Serial Module) SIM (System Integration Module) Intermodule Bus (IMB) 132-PQFP Bumpered QFP ROMless microcontroller 32-bit MCU automotive ECU industrial motion control End-of-Life (EOL) RoHS last-time-buy PCN (Product Change Notice)
快速报价
填写完整信息——我们的销售团队将在 24 小时内回复
料号 制造商 封装 QTY 目标价 小计
合计: $0.00 USD
✓
报价已提交!

我们将在 24 小时内回复您的邮件

1
询价已提交
2
已收到报价
3
已下单
4
支付
5
已发货
6
已送达
查看询价详情