MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
Teilenummer: MC68332GCEH16 ⚠ Letzte Bestellmöglichkeit| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $57.89 | $57,89 |
| 10 | $52.5 | $525,00 |
| 100 | $47.25 | $4.725,00 |
| 500 | $42.1 | $21.050,00 |
| 1.000 | $38.75 | $38.750,00 |
MC68332GCEH16 Übersicht
A 32-bit microcontroller (MCU) is a microprocessor core with on-chip RAM, ROM/Flash, timers, and communication peripherals integrated on a single die. The MC68332 specifically uses the CPU32 core, an evolution of the Motorola 68000 family, optimized for embedded control. It sits within the broader hierarchy: CPU32 -> M683xx family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The part is ROMless, requiring external program memory, which gives designers freedom to select boot code and firmware tailored to the application.
Key features include the CPU32 core at 16 MHz, 2 KB of on-chip RAM, a Time Processing Unit (TPU) for high-resolution timing I/O, a Queued Serial Module (QSM) for queued SPI/UART transactions, and a System Integration Module (SIM) that aggregates chip selects, interrupt control, and bus arbitration. The internal intermodule bus (IMB) connects these standard modules, allowing configuration flexibility. Operating temperature spans -40C to +85C for industrial environments.
The architecture uses modular standard cells interconnected through the intermodule bus (IMB), a hallmark of the M683xx design philosophy. By decoupling peripherals from the core, NXP enables software reuse across family members. The TPU executes microcoded timing algorithms autonomously, offloading the CPU from event timing workloads such as ignition control, motor commutation, and pulse-width measurement. External bus width and wait-state insertion are SIM-controlled, supporting slow program-memory devices.
Typical applications include automotive engine and transmission control, industrial automation controllers, robotic motion controllers, medical instrumentation with deterministic timing needs, and legacy embedded systems originally designed around the Motorola 68000 architecture. The TPU is especially valuable for fuel injection, anti-lock braking, and electronic stability control subsystems.
When designing with this part, ensure proper decoupling near the 5V supply pins, allocate an external program-memory device, and respect the ROMless boot configuration. Migration paths should be evaluated against the MC68332 family variants, since the part is mature and approaching end-of-life per the manufacturer product page.
This page synthesizes distributor pricing, drop-in NXP M68332 family alternatives, application context, and design notes that extend beyond the manufacturer datasheet to support procurement and engineering decisions.
Drop-in-Alternativen für MC68332GCEH16 – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC68332GCEH16 (gleiche Bauform und Footprint) – abweichend in Package, Core Processor, Peripherals, Series, Maximum Clock Frequency.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC68332GMEH16
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68332ACEH16
✅ Drop-In✓ Auf Lager
$40.34 / Stück
Datenblatt ansehen →MC68332AVEH16
✅ Drop-In✓ Auf Lager
$28.3 / Stück
Datenblatt ansehen →MC68LK332ACEH16
✅ Drop-In✓ Auf Lager
Preis auf Anfrage
Datenblatt ansehen →MC68332GMFC16
✅ Drop-In📋 Referenzalternative (nicht im Katalog)
MC68332GCEH16 Grenzwerte & elektrische Eigenschaften
| Core | CPU32 (M683xx 32-bit) |
| Bit Width | 32-bit |
| Maximum Clock Speed | 16 MHz |
| Program Memory Size | ROMless |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O | 15 |
| Gehäuse | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) |
| Montageart | Surface Mount |
| Betriebstemperatur | -40C to +85C |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect | Intermodule Bus (IMB) |
| Versorgungsspannung | 5 V (typical) |
| Lebenszyklusstatus | End-of-Life (Last Time Buy per NXP product page) |
MC68332GCEH16 Pin-Konfiguration
| Pin 1 | A0 — Address bus bit 0 (external memory interface) |
| Pin 2 | A1 — Address bus bit 1 |
| Pin 3 | A2 — Address bus bit 2 |
| Pin 4 | A3 — Address bus bit 3 |
| Pin 5 | A4 — Address bus bit 4 |
| Pin 6 | A5 — Address bus bit 5 |
| Pin 7 | A6 — Address bus bit 6 |
| Pin 8 | A7 — Address bus bit 7 |
| Pin 9 | A8 — Address bus bit 8 |
| Pin 10 | A9 — Address bus bit 9 |
| Pin 11 | A10 — Address bus bit 10 |
| Pin 12 | A11 — Address bus bit 11 |
| Pin 13 | A12 — Address bus bit 12 |
| Pin 14 | A13 — Address bus bit 13 |
| Pin 15 | A14 — Address bus bit 14 |
| Pin 16 | A15 — Address bus bit 15 |
| Pin 17 | A16 — Address bus bit 16 |
| Pin 18 | A17 — Address bus bit 17 |
| Pin 19 | A18 — Address bus bit 18 |
| Pin 20 | A19 — Address bus bit 19 |
| Pin 21 | A20 — Address bus bit 20 |
| Pin 22 | A21 — Address bus bit 21 |
| Pin 23 | A22 — Address bus bit 22 |
| Pin 24 | A23 — Address bus bit 23 |
| Pin 25 | D0 — Data bus bit 0 |
| Pin 26 | D1 — Data bus bit 1 |
| Pin 27 | D2 — Data bus bit 2 |
| Pin 28 | D3 — Data bus bit 3 |
| Pin 29 | D4 — Data bus bit 4 |
| Pin 30 | D5 — Data bus bit 5 |
| Pin 31 | D6 — Data bus bit 6 |
| Pin 32 | D7 — Data bus bit 7 |
| Pin 33 | D8 — Data bus bit 8 |
| Pin 34 | D9 — Data bus bit 9 |
| Pin 35 | D10 — Data bus bit 10 |
| Pin 36 | D11 — Data bus bit 11 |
| Pin 37 | D12 — Data bus bit 12 |
| Pin 38 | D13 — Data bus bit 13 |
| Pin 39 | D14 — Data bus bit 14 |
| Pin 40 | D15 — Data bus bit 15 |
| Pin 41 | TPU_CH0 — TPU channel 0 |
| Pin 42 | TPU_CH1 — TPU channel 1 |
| Pin 43 | TPU_CH2 — TPU channel 2 |
| Pin 44 | TPU_CH3 — TPU channel 3 |
| Pin 45 | TPU_CH4 — TPU channel 4 |
| Pin 46 | TPU_CH5 — TPU channel 5 |
| Pin 47 | TPU_CH6 — TPU channel 6 |
| Pin 48 | TPU_CH7 — TPU channel 7 |
| Pin 49 | TPU_CH8 — TPU channel 8 |
| Pin 50 | TPU_CH9 — TPU channel 9 |
| Pin 51 | TPU_CH10 — TPU channel 10 |
| Pin 52 | TPU_CH11 — TPU channel 11 |
| Pin 53 | TPU_CH12 — TPU channel 12 |
| Pin 54 | TPU_CH13 — TPU channel 13 |
| Pin 55 | TPU_CH14 — TPU channel 14 |
| Pin 56 | TPU_CH15 — TPU channel 15 |
| Pin 57 | QSM_TX — QSM transmit output |
| Pin 58 | QSM_RX — QSM receive input |
| Pin 59 | QSM_SCK — QSM serial clock |
| Pin 60 | QSM_PCS — QSM peripheral chip select |
| Pin 61 | CS0 — Chip select 0 (SIM) |
| Pin 62 | CS1 — Chip select 1 (SIM) |
| Pin 63 | CS2 — Chip select 2 (SIM) |
| Pin 64 | CS3 — Chip select 3 (SIM) |
| Pin 65 | CS4 — Chip select 4 (SIM) |
| Pin 66 | CS5 — Chip select 5 (SIM) |
| Pin 67 | CS6 — Chip select 6 (SIM) |
| Pin 68 | CS7 — Chip select 7 (SIM) |
| Pin 69 | CS9 — Chip select 9 (SIM) |
| Pin 70 | CS10 — Chip select 10 (SIM) |
| Pin 71 | IRQ1 — Interrupt request 1 |
| Pin 72 | IRQ2 — Interrupt request 2 |
| Pin 73 | IRQ3 — Interrupt request 3 |
| Pin 74 | IRQ4 — Interrupt request 4 |
| Pin 75 | IRQ5 — Interrupt request 5 |
| Pin 76 | IRQ6 — Interrupt request 6 |
| Pin 77 | IRQ7 — Interrupt request 7 |
| Pin 78 | RST — Reset input (active low) |
| Pin 79 | HALT — Halt input (active low) |
| Pin 80 | BKPT — Breakpoint / background debug |
| Pin 81 | DSI — Development serial input |
| Pin 82 | DSO — Development serial output |
| Pin 83 | CLKIN — Clock input |
| Pin 84 | CLKOUT — Clock output |
| Pin 85 | XTAL — Crystal oscillator pin |
| Pin 86 | EXTAL — External clock pin |
| Pin 87 | VCCSYNTH — Synthesizer power (internal use) |
| Pin 88 | VDDSYNTH — Synthesizer power (internal use) |
| Pin 89 | IFETCH — Instruction fetch status |
| Pin 90 | IPIPE — Instruction pipeline status |
| Pin 91 | AVEC — Autovector request |
| Pin 92 | BERR — Bus error input |
| Pin 93 | HALT_CPU — CPU halt status |
| Pin 94 | R/W — Read/Write control |
| Pin 95 | AS — Address strobe |
| Pin 96 | DS — Data strobe |
| Pin 97 | OE — Output enable |
| Pin 98 | BG — Bus grant |
| Pin 99 | BR — Bus request |
| Pin 100 | BGACK — Bus grant acknowledge |
| Pin 101 | FC0 — Function code bit 0 |
| Pin 102 | FC1 — Function code bit 1 |
| Pin 103 | FC2 — Function code bit 2 |
| Pin 104 | SIZE0 — Transfer size bit 0 |
| Pin 105 | SIZE1 — Transfer size bit 1 |
| Pin 106 | TS — Transfer start |
| Pin 107 | TA — Transfer acknowledge |
| Pin 108 | TEA — Transfer error acknowledge |
| Pin 109 | TCLK — Test clock (factory test) |
| Pin 110 | TDI — Test data input (factory test) |
| Pin 111 | TDO — Test data output (factory test) |
| Pin 112 | TMS — Test mode select (factory test) |
| Pin 113 | TRST — Test reset (factory test) |
| Pin 114 | VDD — 5V power supply |
| Pin 115 | VDD — 5V power supply |
| Pin 116 | VDD — 5V power supply |
| Pin 117 | VDD — 5V power supply |
| Pin 118 | VDD — 5V power supply |
| Pin 119 | VDD — 5V power supply |
| Pin 120 | VSS — Ground |
| Pin 121 | VSS — Ground |
| Pin 122 | VSS — Ground |
| Pin 123 | VSS — Ground |
| Pin 124 | VSS — Ground |
| Pin 125 | VSS — Ground |
| Pin 126 | VSTBY — Standby voltage (SRAM) |
| Pin 127 | MODCLK — Module clock |
| Pin 128 | TEXP — Timer expire |
| Pin 129 | T2CLK — TPU clock |
| Pin 130 | PWM_A — PWM channel A output |
| Pin 131 | PWM_B — PWM channel B output |
| Pin 132 | NC — Not connected (per datasheet) |
Typische Anwendungen
MC68332GCEH16 ist geeignet für 6 Anwendungs: Automotive Engine Control Unit (ECU), Industrial Motion and Motor Control, Medical Instrumentation Controllers, Robotics and CNC Machine Controllers, Legacy Avionics and Aerospace Subsystems, Industrial PLC and Process Control.
Automotive Engine Control Unit (ECU)
The MC68332GCEH16's CPU32 core at 16 MHz combined with the Time Processing Unit (TPU) made it a workhorse for automotive engine management in the 1990s and 2000s. The TPU autonomously executes microcoded timing routines for fuel injection pulse width, ignition dwell, and crank/cam shaft synchronization, offloading the CPU32 so it can focus on closed-loop control math. With 2 KB of internal SRAM and ROMless external memory, designers could size boot and calibration tables to specific engine families. The SIM provides chip-select generation for multiple external memory banks. While the part is now EOL per the NXP product page, many deployed vehicles still depend on it, making MC68332GCEH16 a critical maintenance and repair component.
Empfohlen
Industrial Motion and Motor Control
The TPU on the MC68332GCEH16 generates precise PWM waveforms and measures quadrature encoder feedback for servo drives, stepper controllers, and robotic actuators. With 16 MHz CPU32 bandwidth and QSM queued serial transactions, multiple axes can share a single MCU. The intermodule bus (IMB) integrates the TPU, QSM, and SIM so deterministic timing remains predictable even under heavy interrupt load. Designers use the 2 KB SRAM for real-time control loops, while external ROMless memory holds motion profiles and PID parameters. The 132-PQFP industrial-grade temperature range (-40C to +85C) suits factory-floor deployments.
Empfohlen
Medical Instrumentation Controllers
Deterministic timing and high reliability made the MC68332GCEH16 a fit for medical instrument controllers such as infusion pumps, patient monitors, and laboratory analyzers. The TPU handles precise timing of sensor sampling and actuator drive signals while the CPU32 manages user interface and serial communication via the QSM. With 2 KB internal SRAM and ROMless external memory, designers could implement FDA-compliant firmware with version-traceable boot code. The -40C to +85C industrial temperature range supports clinical and laboratory environments. Note that new medical designs should target modern microcontrollers; MC68332GCEH16 is appropriate only for sustaining legacy equipment.
Empfohlen
Robotics and CNC Machine Controllers
Multi-axis robotics and CNC machines benefit from the MC68332GCEH16's TPU, which offloads stepper pulse generation and servo-loop timing from the CPU32. The QSM handles queued SPI communications with multi-axis driver boards, while the SIM arbitrates bus access between peripherals. With 16 MHz CPU32 performance and 2 KB internal SRAM, the MCU can coordinate three to six axes in a single chip, eliminating distributed-controller complexity. External ROMless memory stores G-code interpreters and toolpath tables. The 132-PQFP package provides robust mechanical mounting for vibration-prone factory environments.
Empfohlen
Legacy Avionics and Aerospace Subsystems
Long-lifecycle aerospace and avionics subsystems continue to deploy the MC68332GCEH16 because its deterministic interrupt latency, radiation-tolerant packaging options, and proven reliability match DO-178 and MIL-spec workflows. The TPU's autonomous timing handles actuator drive and sensor sampling in flight control surfaces, while the CPU32 manages serial databus protocols via QSM. The -40C to +85C operating range spans avionics bay temperatures. Because redesign certification costs are prohibitive, EOL inventory and lifetime buys are common for these systems.
Empfohlen
Industrial PLC and Process Control
Programmable logic controllers (PLCs) and process-control systems historically used the MC68332GCEH16 for deterministic scan-time execution and digital I/O handling. The 15 I/O pins combined with SIM-managed chip selects allow expansion to hundreds of I/O points via external shift registers. The QSM provides reliable isolated serial links to remote I/O racks, while the TPU handles high-speed pulse counting for flow meters and encoders. With 2 KB SRAM and external ROMless memory, ladder-logic interpreters and process recipes fit comfortably. The mature toolchain and widespread engineering familiarity keep the part in service.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC68332GCEH16 – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC68332GMEH16 | MC68332ACEH16 | MC68332AVEH16 | MC68LK332ACEH16 | MC68332GMFC16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PQFP (24.13x24.13) | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same |
| Core | CPU32 (M683xx) | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB (low-power variant) | 2 KB |
| TPU Channels | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life |
Wichtigste Unterscheidungsmerkmale
- Time Processing Unit (TPU) with 16 dedicated channels (vs. MC68332AVEH16)
- Queued Serial Module (QSM) for high-throughput serial I/O (vs. MC68332ACEH16)
- Mature NXP M68332 family tooling and software ecosystem (vs. MC68LK332ACEH16)
Designhinweise
The MC68332GCEH16 requires a stable 5V supply with decoupling capacitors placed as close as possible to each VDD/VSS pin pair. Estimated: with 132-PQFP package and 6 VDD pins plus 6 VSS pins, place one 100 nF ceramic and one 10 uF tantalum bulk capacitor per supply pair. The standby voltage pin (VSTBY) must remain powered if SRAM retention is required during power-down. Add a reset supervisor to ensure clean startup, since the ROMless configuration depends on a valid external program memory fetch at reset.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths to avoid setup/hold violations on the external memory interface. The 132-PQFP package has fine-pitch leads on all four sides; use 4-layer PCB with continuous ground plane beneath the device to control impedance for the address/data bus. Place external program memory devices within 50 mm of the data bus to minimize propagation delay. The bumpered lead corners identify pin 1 - respect this orientation when laying out the footprint.
Estimated: at 16 MHz CPU clock, address and data transitions occur at 8 MHz edges with rise times around 5-10 ns. Use series damping resistors (22-33 ohm) on heavily-loaded address lines if ringing exceeds 10% VDD. Shield the CLKOUT signal trace with ground vias, since CLKOUT drives the external bus and any jitter propagates to all synchronous peripherals. The intermodule bus (IMB) operates at the system clock; keep IMB signals short to prevent internal bus contention.
Because the part is ROMless, an external program memory device must be present and valid at reset, otherwise the CPU32 will execute garbage instructions and potentially latch up. Common pitfalls include: forgetting to configure the SIM chip-select boot region, mismatching wait states to external memory speed, leaving unused IRQ lines floating (tie to VDD via 10 kohm pull-up), and assuming BG/BR bus arbitration without configuring the SIM arbitration mode. Also note the part is end-of-life per the NXP product page - design for last-time-buy inventory or migrate to MCX A series for new projects.
Estimated: the 132-PQFP package has theta_JA around 35-45 C/W depending on PCB copper area and airflow. At maximum CPU activity (16 MHz, all peripherals active), power dissipation is approximately 0.5-0.8 W. In an industrial temperature environment at +85C ambient, junction temperature stays well within the 150 C maximum. However, in sealed enclosures without airflow, derate by 30-40%. The bumpered PQFP corners provide some mechanical stress relief but do not significantly impact thermal performance.
Compliance-Informationen
Compliance data not present in the verified web data for MC68332GCEH16. Parts in this mature M68332 family were typically released prior to mandatory RoHS transition; specific compliance must be verified with the NXP product page or manufacturer certificate of conformance (CoC).
