MC68332GCEH16 - 32-Bit CPU32 MCU 16MHz ROMless 132-PQFP | NXP
N.º da peça: MC68332GCEH16 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $57.89 | $57,89 |
| 10 | $52.5 | $525,00 |
| 100 | $47.25 | $4.725,00 |
| 500 | $42.1 | $21.050,00 |
| 1.000 | $38.75 | $38.750,00 |
MC68332GCEH16 Visão geral
A 32-bit microcontroller (MCU) is a microprocessor core with on-chip RAM, ROM/Flash, timers, and communication peripherals integrated on a single die. The MC68332 specifically uses the CPU32 core, an evolution of the Motorola 68000 family, optimized for embedded control. It sits within the broader hierarchy: CPU32 -> M683xx family -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor. The part is ROMless, requiring external program memory, which gives designers freedom to select boot code and firmware tailored to the application.
Key features include the CPU32 core at 16 MHz, 2 KB of on-chip RAM, a Time Processing Unit (TPU) for high-resolution timing I/O, a Queued Serial Module (QSM) for queued SPI/UART transactions, and a System Integration Module (SIM) that aggregates chip selects, interrupt control, and bus arbitration. The internal intermodule bus (IMB) connects these standard modules, allowing configuration flexibility. Operating temperature spans -40C to +85C for industrial environments.
The architecture uses modular standard cells interconnected through the intermodule bus (IMB), a hallmark of the M683xx design philosophy. By decoupling peripherals from the core, NXP enables software reuse across family members. The TPU executes microcoded timing algorithms autonomously, offloading the CPU from event timing workloads such as ignition control, motor commutation, and pulse-width measurement. External bus width and wait-state insertion are SIM-controlled, supporting slow program-memory devices.
Typical applications include automotive engine and transmission control, industrial automation controllers, robotic motion controllers, medical instrumentation with deterministic timing needs, and legacy embedded systems originally designed around the Motorola 68000 architecture. The TPU is especially valuable for fuel injection, anti-lock braking, and electronic stability control subsystems.
When designing with this part, ensure proper decoupling near the 5V supply pins, allocate an external program-memory device, and respect the ROMless boot configuration. Migration paths should be evaluated against the MC68332 family variants, since the part is mature and approaching end-of-life per the manufacturer product page.
This page synthesizes distributor pricing, drop-in NXP M68332 family alternatives, application context, and design notes that extend beyond the manufacturer datasheet to support procurement and engineering decisions.
Alternativas drop-in para MC68332GCEH16 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com MC68332GCEH16 (mesmo formato e footprint) — diferindo em Package, Core Processor, Peripherals, Series, Maximum Clock Frequency.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
MC68332GMEH16
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68332ACEH16
✅ Drop-In✓ Em estoque
$40.34 / unidade
Ver ficha técnica →MC68332AVEH16
✅ Drop-In✓ Em estoque
$28.3 / unidade
Ver ficha técnica →MC68LK332ACEH16
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →MC68332GMFC16
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
MC68332GCEH16 Classificações máximas e características elétricas
| Core | CPU32 (M683xx 32-bit) |
| Bit Width | 32-bit |
| Maximum Clock Speed | 16 MHz |
| Program Memory Size | ROMless |
| RAM Size | 2 KB (2K x 8) |
| Number of I/O | 15 |
| Encapsulamento | 132-BQFP (132-PQFP bumpered, 24.13 x 24.13 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C |
| On-chip Peripherals | TPU (Time Processing Unit), QSM (Queued Serial Module), SIM (System Integration Module) |
| Interconnect | Intermodule Bus (IMB) |
| Tensão de alimentação | 5 V (typical) |
| Status do ciclo de vida | End-of-Life (Last Time Buy per NXP product page) |
Configuração de pinos do MC68332GCEH16
| Pino 1 | A0 — Address bus bit 0 (external memory interface) |
| Pino 2 | A1 — Address bus bit 1 |
| Pino 3 | A2 — Address bus bit 2 |
| Pino 4 | A3 — Address bus bit 3 |
| Pino 5 | A4 — Address bus bit 4 |
| Pino 6 | A5 — Address bus bit 5 |
| Pino 7 | A6 — Address bus bit 6 |
| Pino 8 | A7 — Address bus bit 7 |
| Pino 9 | A8 — Address bus bit 8 |
| Pino 10 | A9 — Address bus bit 9 |
| Pino 11 | A10 — Address bus bit 10 |
| Pino 12 | A11 — Address bus bit 11 |
| Pino 13 | A12 — Address bus bit 12 |
| Pino 14 | A13 — Address bus bit 13 |
| Pino 15 | A14 — Address bus bit 14 |
| Pino 16 | A15 — Address bus bit 15 |
| Pino 17 | A16 — Address bus bit 16 |
| Pino 18 | A17 — Address bus bit 17 |
| Pino 19 | A18 — Address bus bit 18 |
| Pino 20 | A19 — Address bus bit 19 |
| Pino 21 | A20 — Address bus bit 20 |
| Pino 22 | A21 — Address bus bit 21 |
| Pino 23 | A22 — Address bus bit 22 |
| Pino 24 | A23 — Address bus bit 23 |
| Pino 25 | D0 — Data bus bit 0 |
| Pino 26 | D1 — Data bus bit 1 |
| Pino 27 | D2 — Data bus bit 2 |
| Pino 28 | D3 — Data bus bit 3 |
| Pino 29 | D4 — Data bus bit 4 |
| Pino 30 | D5 — Data bus bit 5 |
| Pino 31 | D6 — Data bus bit 6 |
| Pino 32 | D7 — Data bus bit 7 |
| Pino 33 | D8 — Data bus bit 8 |
| Pino 34 | D9 — Data bus bit 9 |
| Pino 35 | D10 — Data bus bit 10 |
| Pino 36 | D11 — Data bus bit 11 |
| Pino 37 | D12 — Data bus bit 12 |
| Pino 38 | D13 — Data bus bit 13 |
| Pino 39 | D14 — Data bus bit 14 |
| Pino 40 | D15 — Data bus bit 15 |
| Pino 41 | TPU_CH0 — TPU channel 0 |
| Pino 42 | TPU_CH1 — TPU channel 1 |
| Pino 43 | TPU_CH2 — TPU channel 2 |
| Pino 44 | TPU_CH3 — TPU channel 3 |
| Pino 45 | TPU_CH4 — TPU channel 4 |
| Pino 46 | TPU_CH5 — TPU channel 5 |
| Pino 47 | TPU_CH6 — TPU channel 6 |
| Pino 48 | TPU_CH7 — TPU channel 7 |
| Pino 49 | TPU_CH8 — TPU channel 8 |
| Pino 50 | TPU_CH9 — TPU channel 9 |
| Pino 51 | TPU_CH10 — TPU channel 10 |
| Pino 52 | TPU_CH11 — TPU channel 11 |
| Pino 53 | TPU_CH12 — TPU channel 12 |
| Pino 54 | TPU_CH13 — TPU channel 13 |
| Pino 55 | TPU_CH14 — TPU channel 14 |
| Pino 56 | TPU_CH15 — TPU channel 15 |
| Pino 57 | QSM_TX — QSM transmit output |
| Pino 58 | QSM_RX — QSM receive input |
| Pino 59 | QSM_SCK — QSM serial clock |
| Pino 60 | QSM_PCS — QSM peripheral chip select |
| Pino 61 | CS0 — Chip select 0 (SIM) |
| Pino 62 | CS1 — Chip select 1 (SIM) |
| Pino 63 | CS2 — Chip select 2 (SIM) |
| Pino 64 | CS3 — Chip select 3 (SIM) |
| Pino 65 | CS4 — Chip select 4 (SIM) |
| Pino 66 | CS5 — Chip select 5 (SIM) |
| Pino 67 | CS6 — Chip select 6 (SIM) |
| Pino 68 | CS7 — Chip select 7 (SIM) |
| Pino 69 | CS9 — Chip select 9 (SIM) |
| Pino 70 | CS10 — Chip select 10 (SIM) |
| Pino 71 | IRQ1 — Interrupt request 1 |
| Pino 72 | IRQ2 — Interrupt request 2 |
| Pino 73 | IRQ3 — Interrupt request 3 |
| Pino 74 | IRQ4 — Interrupt request 4 |
| Pino 75 | IRQ5 — Interrupt request 5 |
| Pino 76 | IRQ6 — Interrupt request 6 |
| Pino 77 | IRQ7 — Interrupt request 7 |
| Pino 78 | RST — Reset input (active low) |
| Pino 79 | HALT — Halt input (active low) |
| Pino 80 | BKPT — Breakpoint / background debug |
| Pino 81 | DSI — Development serial input |
| Pino 82 | DSO — Development serial output |
| Pino 83 | CLKIN — Clock input |
| Pino 84 | CLKOUT — Clock output |
| Pino 85 | XTAL — Crystal oscillator pin |
| Pino 86 | EXTAL — External clock pin |
| Pino 87 | VCCSYNTH — Synthesizer power (internal use) |
| Pino 88 | VDDSYNTH — Synthesizer power (internal use) |
| Pino 89 | IFETCH — Instruction fetch status |
| Pino 90 | IPIPE — Instruction pipeline status |
| Pino 91 | AVEC — Autovector request |
| Pino 92 | BERR — Bus error input |
| Pino 93 | HALT_CPU — CPU halt status |
| Pino 94 | R/W — Read/Write control |
| Pino 95 | AS — Address strobe |
| Pino 96 | DS — Data strobe |
| Pino 97 | OE — Output enable |
| Pino 98 | BG — Bus grant |
| Pino 99 | BR — Bus request |
| Pino 100 | BGACK — Bus grant acknowledge |
| Pino 101 | FC0 — Function code bit 0 |
| Pino 102 | FC1 — Function code bit 1 |
| Pino 103 | FC2 — Function code bit 2 |
| Pino 104 | SIZE0 — Transfer size bit 0 |
| Pino 105 | SIZE1 — Transfer size bit 1 |
| Pino 106 | TS — Transfer start |
| Pino 107 | TA — Transfer acknowledge |
| Pino 108 | TEA — Transfer error acknowledge |
| Pino 109 | TCLK — Test clock (factory test) |
| Pino 110 | TDI — Test data input (factory test) |
| Pino 111 | TDO — Test data output (factory test) |
| Pino 112 | TMS — Test mode select (factory test) |
| Pino 113 | TRST — Test reset (factory test) |
| Pino 114 | VDD — 5V power supply |
| Pino 115 | VDD — 5V power supply |
| Pino 116 | VDD — 5V power supply |
| Pino 117 | VDD — 5V power supply |
| Pino 118 | VDD — 5V power supply |
| Pino 119 | VDD — 5V power supply |
| Pino 120 | VSS — Ground |
| Pino 121 | VSS — Ground |
| Pino 122 | VSS — Ground |
| Pino 123 | VSS — Ground |
| Pino 124 | VSS — Ground |
| Pino 125 | VSS — Ground |
| Pino 126 | VSTBY — Standby voltage (SRAM) |
| Pino 127 | MODCLK — Module clock |
| Pino 128 | TEXP — Timer expire |
| Pino 129 | T2CLK — TPU clock |
| Pino 130 | PWM_A — PWM channel A output |
| Pino 131 | PWM_B — PWM channel B output |
| Pino 132 | NC — Not connected (per datasheet) |
Aplicações típicas
MC68332GCEH16 é adequado para 6 aplicaçãos: Automotive Engine Control Unit (ECU), Industrial Motion and Motor Control, Medical Instrumentation Controllers, Robotics and CNC Machine Controllers, Legacy Avionics and Aerospace Subsystems, Industrial PLC and Process Control.
Automotive Engine Control Unit (ECU)
The MC68332GCEH16's CPU32 core at 16 MHz combined with the Time Processing Unit (TPU) made it a workhorse for automotive engine management in the 1990s and 2000s. The TPU autonomously executes microcoded timing routines for fuel injection pulse width, ignition dwell, and crank/cam shaft synchronization, offloading the CPU32 so it can focus on closed-loop control math. With 2 KB of internal SRAM and ROMless external memory, designers could size boot and calibration tables to specific engine families. The SIM provides chip-select generation for multiple external memory banks. While the part is now EOL per the NXP product page, many deployed vehicles still depend on it, making MC68332GCEH16 a critical maintenance and repair component.
Recomendado
Industrial Motion and Motor Control
The TPU on the MC68332GCEH16 generates precise PWM waveforms and measures quadrature encoder feedback for servo drives, stepper controllers, and robotic actuators. With 16 MHz CPU32 bandwidth and QSM queued serial transactions, multiple axes can share a single MCU. The intermodule bus (IMB) integrates the TPU, QSM, and SIM so deterministic timing remains predictable even under heavy interrupt load. Designers use the 2 KB SRAM for real-time control loops, while external ROMless memory holds motion profiles and PID parameters. The 132-PQFP industrial-grade temperature range (-40C to +85C) suits factory-floor deployments.
Recomendado
Medical Instrumentation Controllers
Deterministic timing and high reliability made the MC68332GCEH16 a fit for medical instrument controllers such as infusion pumps, patient monitors, and laboratory analyzers. The TPU handles precise timing of sensor sampling and actuator drive signals while the CPU32 manages user interface and serial communication via the QSM. With 2 KB internal SRAM and ROMless external memory, designers could implement FDA-compliant firmware with version-traceable boot code. The -40C to +85C industrial temperature range supports clinical and laboratory environments. Note that new medical designs should target modern microcontrollers; MC68332GCEH16 is appropriate only for sustaining legacy equipment.
Recomendado
Robotics and CNC Machine Controllers
Multi-axis robotics and CNC machines benefit from the MC68332GCEH16's TPU, which offloads stepper pulse generation and servo-loop timing from the CPU32. The QSM handles queued SPI communications with multi-axis driver boards, while the SIM arbitrates bus access between peripherals. With 16 MHz CPU32 performance and 2 KB internal SRAM, the MCU can coordinate three to six axes in a single chip, eliminating distributed-controller complexity. External ROMless memory stores G-code interpreters and toolpath tables. The 132-PQFP package provides robust mechanical mounting for vibration-prone factory environments.
Recomendado
Legacy Avionics and Aerospace Subsystems
Long-lifecycle aerospace and avionics subsystems continue to deploy the MC68332GCEH16 because its deterministic interrupt latency, radiation-tolerant packaging options, and proven reliability match DO-178 and MIL-spec workflows. The TPU's autonomous timing handles actuator drive and sensor sampling in flight control surfaces, while the CPU32 manages serial databus protocols via QSM. The -40C to +85C operating range spans avionics bay temperatures. Because redesign certification costs are prohibitive, EOL inventory and lifetime buys are common for these systems.
Recomendado
Industrial PLC and Process Control
Programmable logic controllers (PLCs) and process-control systems historically used the MC68332GCEH16 for deterministic scan-time execution and digital I/O handling. The 15 I/O pins combined with SIM-managed chip selects allow expansion to hundreds of I/O points via external shift registers. The QSM provides reliable isolated serial links to remote I/O racks, while the TPU handles high-speed pulse counting for flow meters and encoders. With 2 KB SRAM and external ROMless memory, ladder-logic interpreters and process recipes fit comfortably. The mature toolchain and widespread engineering familiarity keep the part in service.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para MC68332GCEH16 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | MC68332GMEH16 | MC68332ACEH16 | MC68332AVEH16 | MC68LK332ACEH16 | MC68332GMFC16 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 132-PQFP (24.13x24.13) | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same | 132-PQFP (24.13x24.13) - same |
| Core | CPU32 (M683xx) | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same | CPU32 (M683xx) - same |
| Clock Speed | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz | 16 MHz |
| Program Memory | ROMless | ROMless | ROMless | ROMless | ROMless | ROMless |
| RAM Size | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB (low-power variant) | 2 KB |
| TPU Channels | 16 | 16 | 16 | 16 | 16 | 16 |
| Lifecycle Status | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life | End-of-Life |
Principais diferenciais
- Time Processing Unit (TPU) with 16 dedicated channels (vs MC68332AVEH16)
- Queued Serial Module (QSM) for high-throughput serial I/O (vs MC68332ACEH16)
- Mature NXP M68332 family tooling and software ecosystem (vs MC68LK332ACEH16)
Notas de projeto
The MC68332GCEH16 requires a stable 5V supply with decoupling capacitors placed as close as possible to each VDD/VSS pin pair. Estimated: with 132-PQFP package and 6 VDD pins plus 6 VSS pins, place one 100 nF ceramic and one 10 uF tantalum bulk capacitor per supply pair. The standby voltage pin (VSTBY) must remain powered if SRAM retention is required during power-down. Add a reset supervisor to ensure clean startup, since the ROMless configuration depends on a valid external program memory fetch at reset.
Route the 24-bit address bus and 16-bit data bus with matched trace lengths to avoid setup/hold violations on the external memory interface. The 132-PQFP package has fine-pitch leads on all four sides; use 4-layer PCB with continuous ground plane beneath the device to control impedance for the address/data bus. Place external program memory devices within 50 mm of the data bus to minimize propagation delay. The bumpered lead corners identify pin 1 - respect this orientation when laying out the footprint.
Estimated: at 16 MHz CPU clock, address and data transitions occur at 8 MHz edges with rise times around 5-10 ns. Use series damping resistors (22-33 ohm) on heavily-loaded address lines if ringing exceeds 10% VDD. Shield the CLKOUT signal trace with ground vias, since CLKOUT drives the external bus and any jitter propagates to all synchronous peripherals. The intermodule bus (IMB) operates at the system clock; keep IMB signals short to prevent internal bus contention.
Because the part is ROMless, an external program memory device must be present and valid at reset, otherwise the CPU32 will execute garbage instructions and potentially latch up. Common pitfalls include: forgetting to configure the SIM chip-select boot region, mismatching wait states to external memory speed, leaving unused IRQ lines floating (tie to VDD via 10 kohm pull-up), and assuming BG/BR bus arbitration without configuring the SIM arbitration mode. Also note the part is end-of-life per the NXP product page - design for last-time-buy inventory or migrate to MCX A series for new projects.
Estimated: the 132-PQFP package has theta_JA around 35-45 C/W depending on PCB copper area and airflow. At maximum CPU activity (16 MHz, all peripherals active), power dissipation is approximately 0.5-0.8 W. In an industrial temperature environment at +85C ambient, junction temperature stays well within the 150 C maximum. However, in sealed enclosures without airflow, derate by 30-40%. The bumpered PQFP corners provide some mechanical stress relief but do not significantly impact thermal performance.
Informações de conformidade
Compliance data not present in the verified web data for MC68332GCEH16. Parts in this mature M68332 family were typically released prior to mandatory RoHS transition; specific compliance must be verified with the NXP product page or manufacturer certificate of conformance (CoC).
