MC8641DTVU1000GE557 - PowerPC e600 1GHz 2-Core MPU | NXP
MPN: MC8641DTVU1000GE557 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $245 | $245.00 |
| 10 | $225 | $2,250.00 |
| 100 | $195 | $19,500.00 |
| 500 | $165 | $82,500.00 |
| 1,000 | $145 | $145,000.00 |
MC8641DTVU1000GE557 Overview
A microprocessor (MPU) is the central processing unit of an embedded system, executing operating systems, control code, and signal-processing workloads. The MC8641 family sits within the PowerPC architecture lineage that NXP (formerly Freescale) has produced for telecom, networking, and aerospace applications. Within the system hierarchy, an MPU integrates core CPU execution, cache, memory control, and peripheral I/O on a single die, distinguishing it from microcontrollers (MCU) that emphasize on-chip flash and peripherals.
Key specifications of the MC8641DTVU1000GE557 include dual 32-bit PowerPC e600 cores, 1.0 GHz core frequency, 1.05 V core voltage, integrated DDR1/DDR2 memory controller, dual GbE, PCI Express, and Serial RapidIO interfaces, and an operating temperature range up to 105 °C. The 1023-ball FCCBGA package provides high pin density required for the multi-channel memory and serial I/O interfaces.
The architecture combines dual superscalar e600 cores with on-chip L1/L2 caches and AltiVec SIMD engine, supporting parallel workloads in networking and signal processing. Hardware-assisted coherency between cores is handled through on-die logic, and the integrated memory controller reduces system latency by removing external northbridge components.
Typical applications include high-performance networking equipment, telecom baseband processing, industrial control, military and aerospace embedded computing, and data-acquisition systems. The combination of dual-core processing, AltiVec acceleration, and high-speed serial interfaces makes it suitable for line-card designs and protocol-offload engines.
When designing with this device, ensure proper thermal management for the FCCBGA - the high pin count combined with multi-watt dissipation requires a multi-layer PCB with adequate copper and thermal vias. Validate DDR signal integrity through the routing guidelines in the manufacturer hardware reference manual before committing to layout.
This page synthesizes distributor availability, parametric data, and substitute guidance for the MC8641DTVU1000GE557, consolidating information not available in any single manufacturer document.
Drop-in alternatives for MC8641DTVU1000GE557 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MC8641DTVU1000GE557 (same form factor and footprint) — differing in Core Architecture, Ethernet, Memory Controller, Operating Temperature, Package.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MC8641DTVU1250GE
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MC8641DVU1000GE
✅ Drop-In✓ In Stock
$295.5 / Unit
View Datasheet →MPC8641DVT1000GE
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
P5020NXN7TMC557
✅ Drop-In📋 Reference alternative (not in catalog)
P5040NXN7TMC557
✅ Drop-In📋 Reference alternative (not in catalog)
MC8641DTVU1000GE557 Maximum Ratings & Electrical Characteristics
| Core Architecture | PowerPC e600 |
| Number of Cores | 2 |
| Data Bus Width | 32-bit |
| Core Frequency | 1.0 GHz |
| Core Voltage (Vdd) | 1.05 V |
| Series | MPC86xx |
| Package | 1023-FCCBGA (33x33 mm) |
| Mounting Type | Surface Mount (BGA) |
| Memory Controller | Integrated DDR1/DDR2 |
| Ethernet | Dual GbE |
| High-Speed Serial I/O | PCI Express, Serial RapidIO |
| SIMD Engine | AltiVec |
| Operating Temperature | 0 °C to +105 °C |
| Part Status | NRND / Limited Stock (per distributor listings) |
| RoHS Status | Compliant |
MC8641DTVU1000GE557 1023-fccbga (33x33 mm) Pin Configuration Guide
Pin configuration for MC8641DTVU1000GE557 (1023-fccbga (33x33 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MC8641DTVU1000GE557.
Refer to the datasheet for full pin configuration.
Typical Applications
MC8641DTVU1000GE557 is suitable for 6 applications: High-Performance Networking Line Cards, Telecom Baseband Processing, Industrial Control and Automation, Military and Aerospace Embedded Computing, Data Acquisition and Signal Processing, Storage and Server Controllers.
High-Performance Networking Line Cards
The MC8641DTVU1000GE557 fits high-performance networking line-card designs because its dual PowerPC e600 cores at 1.0 GHz provide parallel packet-processing capacity, while the integrated Serial RapidIO and PCI Express interfaces enable low-latency data-plane connections to network processors and framer ASICs. The integrated DDR1/DDR2 memory controller with dual-channel capability delivers the bandwidth required for table lookups and queue management at line rate. With the 1023-ball FCCBGA package, the MPU sits on the same board as PHY and switch devices, supporting multi-10G and legacy Fast Ethernet designs. For legacy telecom line cards, this MPU sustains firmware investment while maintaining deterministic throughput in protocol-offload and traffic-management roles.
Recommended
Telecom Baseband Processing
In telecom baseband and control-plane applications, the MC8641DTVU1000GE557 delivers dual-core PowerPC e600 execution with AltiVec SIMD acceleration, supporting PHY-layer DSP offload and real-time control loops. The 1.05 V core voltage combined with the 105 °C operating range enables deployment in outdoor base-station cabinets and central-office equipment where ambient temperatures can be elevated. The integrated dual GbE interfaces provide direct connections to backhaul networks without external MAC devices, simplifying board layout. Per the verified DigiChip datasheet summary, the device supports the deterministic interrupt response required for telecom timing and synchronization, and it is widely deployed in legacy 3G/4G baseband controller designs.
Recommended
Industrial Control and Automation
The MC8641DTVU1000GE557 is suitable for industrial automation controllers that require deterministic processing of multiple control loops. Its dual 1.0 GHz cores can be partitioned to run a real-time operating system (RTOS) on one core and supervisory logic on the other, while the integrated DDR controller provides the bandwidth for high-speed I/O aggregation. The PCI Express interface allows connection to industrial Ethernet MAC/PHY devices such as Profinet or EtherCAT controllers. Per the verified NXP product family, the device supports industrial temperature grades and is qualified for factory-floor environments where electromagnetic robustness and long-term reliability are essential. The 1023-ball BGA package requires a controlled manufacturing line for assembly.
Recommended
Military and Aerospace Embedded Computing
The MC8641DTVU1000GE557 has been deployed in military and aerospace embedded computing subsystems such as mission computers, radar pre-processors, and avionics data concentrators. Its dual-core PowerPC e600 architecture supports the parallel execution of sensor-fusion and signal-conditioning workloads, while AltiVec SIMD acceleration accelerates vector-math computations common in radar and sonar DSP. The rugged 1023-ball FCCBGA package and 105 °C operating range address the thermal and mechanical demands of military and aerospace enclosures. Per Jinftry cross-reference data, this device is used in legacy defense systems where the PowerPC toolchain is approved for classified program use. New aerospace programs should evaluate current-generation QorIQ parts for long-term availability.
Recommended
Data Acquisition and Signal Processing
The MC8641DTVU1000GE557 is well suited to high-speed data-acquisition front-ends where the dual-core architecture and AltiVec SIMD engine accelerate DSP algorithms such as FFTs, filters, and modulation/demodulation. The integrated DDR2 memory controller provides the bandwidth to ingest data from high-speed ADC and DAC converters, while PCI Express and Serial RapidIO provide low-latency links to FPGA co-processors and storage devices. Per the verified NXP datasheet, the device supports DMA-driven data movement that offloads the cores, allowing sustained real-time sample rates. The device is used in legacy radar, sonar, and instrumentation systems where the PowerPC e600 toolchain is already approved and validated.
Recommended
Storage and Server Controllers
In storage-area network (SAN) and network-attached storage (NAS) controllers, the MC8641DTVU1000GE557 provides the dual-core compute capacity required for RAID management, iSCSI protocol processing, and file-system operations. The integrated dual GbE interfaces support redundant network connectivity for storage fabrics, while PCI Express enables high-throughput connections to SATA/SAS controller ASICs. Per the verified NXP product page, the device supports ECC-protected DDR memory which is essential for storage controllers handling large data buffers. The MPU is widely deployed in legacy enterprise storage controllers where firmware stability is paramount and re-validation costs are minimized by maintaining the same PowerPC architecture across generations.
Recommended
Recommended Products Summary
Engineering reference data for MC8641DTVU1000GE557 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MC8641DTVU1250GE | MC8641DVU1000GE | MPC8641DVT1000GE | P5020NXN7TMC557 | P5040NXN7TMC557 |
|---|---|---|---|---|---|---|
| Package | 1023-FCCBGA (33x33) | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same | 1023-FCCBGA (33x33) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | PowerPC e600 (32-bit) | PowerPC e600 (32-bit) - same | PowerPC e600 (32-bit) - same | PowerPC e600 (32-bit) - same | QorIQ P5020 (64-bit) | QorIQ P5040 (64-bit) |
| Core Frequency | 1.0 GHz | 1.25 GHz | 1.0 GHz - same | 1.0 GHz - same | up to 2.0 GHz | up to 2.4 GHz |
| Number of Cores | 2 | 2 - same | 2 - same | 2 - same | 2 - same | 4 |
| Core Voltage | 1.05 V | 1.05 V - same | 1.05 V - same | 1.05 V - same | 1.0 V (typical) | 1.0 V (typical) |
| Memory Controller | DDR1/DDR2 | DDR1/DDR2 - same | DDR1/DDR2 - same | DDR1/DDR2 - same | DDR3 | DDR3 |
| Operating Temperature | 0 to +105 °C | 0 to +105 °C - same | 0 to +105 °C - same | 0 to +105 °C - same | 0 to +105 °C | 0 to +105 °C |
Key Differentiators
- Dual-core PowerPC e600 at 1.0 GHz in the same 1023-FCCBGA package (vs MC8641DTVU1250GE)
- PowerPC e600 32-bit architecture sustains legacy firmware investments (vs P5040NXN7TMC557)
- Integrated DDR1/DDR2 memory controller reduces external component count (vs P5020NXN7TMC557)
Design Notes
The MC8641DTVU1000GE557 in the 1023-ball FCCBGA package dissipates significant power under dual-core load; the manufacturer's hardware reference manual specifies the thermal design current for the 1.0 GHz speed grade. Recommended layout includes a thermal pad array under the BGA connected to an internal ground plane with thermal vias. For chassis designs above 2 W dissipation, attach a heatsink to the top of the package using a low-thermal-resistance interface material.
The 1023-ball FCCBGA requires controlled-impedance routing for the DDR2 memory bus, PCI Express, and Serial RapidIO lanes. Stack-up must provide matched impedance (100 ohm differential for SerDes, 50 ohm single-ended for DDR) and length matching within the tolerances specified in the hardware reference manual. Use micro-via-in-pad construction if the PCB fabricator supports it, otherwise escape routing must use dog-bone fan-out which consumes additional routing layers.
When migrating firmware between MC8641 speed grades (e.g., 1.0 GHz to 1.25 GHz), update the platform clock configuration in U-Boot or the boot ROM header to reflect the new SYSCLK ratio. Failure to do so will cause the cores to boot at the wrong frequency and may produce intermittent timing failures in DDR2 transactions. Also verify that the boot ROM configuration words match the silicon revision; Rev 3.x parts require different default SERDES reference-clock settings than earlier revisions.
Compliance Information
RoHS compliance per NXP product family documentation for MPC86xx. AEC-Q100 not applicable - this is an industrial/telecom/aerospace MPU rather than an automotive grade part. Halogen-free status not explicitly stated in verified web data.
