MC9S08GT32ACFDER - 8-Bit S08 MCU 32KB Flash 40MHz | NXP
料号： MC9S08GT32ACFDER ⚠ 最后一次采购| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $6.84 | $6.84 |
| 10 | $6.18 | $61.80 |
| 100 | $5.47 | $547.00 |
| 500 | $4.95 | $2,475.00 |
| 1,000 | $4.42 | $4,420.00 |
MC9S08GT32ACFDER 概述
A microcontroller (MCU) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and GPIO. The HCS08/S08 core from NXP is a CISC 8-bit architecture that has powered automotive body electronics, white goods, and industrial sensor nodes for over a decade. Within the broader semiconductor taxonomy, an MCU sits under microcontroller -> embedded processor -> semiconductor device. The GT-series MCUs specifically target general-purpose 8-bit designs where footprint, BOM count, and peripheral integration dominate the design trade-off.
Key features include 32KB (32K x 8) of embedded Flash with in-application programmability, 2KB of RAM, 39 general-purpose I/O lines, and an internal bus clock of up to 40MHz derived from the on-chip FLL. Integrated peripherals include PWM channels, an LVD (low-voltage detect) and POR (power-on reset), a watchdog timer (WDT), and communication interfaces (I2C, SCI, SPI). The 48-QFN-EP package exposes a thermal pad that reduces junction-to-ambient thermal resistance, improving continuous high-current I/O operation. Operating voltage spans 2.7V to 5.5V with industrial temperature grade support.
The architecture relies on the S08 CISC core with a single 16-bit index register, HX, plus a 16-bit stack pointer. The Flash controller supports byte-erase and security features; the on-chip clock module supports an internal reference and external crystal, enabling flexible clock-tree design. The 8-bit datapath, 40MHz core clock, and single-cycle bus at half the bus rate give deterministic instruction timing suitable for hard-real-time loops in motor control, lighting, and sensor conditioning.
Typical applications include HVAC control boards, appliance user-interface panels, automotive body controllers, battery-powered sensor transmitters, low-end BLDC motor drivers, and LED lighting controllers. Design considerations include providing a 0.1uF decoupling capacitor on each VDD pin, exposing the thermal pad to a continuous copper pour on the top layer for heat spreading, and reserving the reset pin for an external supervisor or RC network when battery-supplied cold-start behavior matters.
直接替换替代料： MC9S08GT32ACFDER ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S08GT32ACFDER （相同外形与封装尺寸） ——差异在于 Package, RAM.
快速对比工具——选择替代料号进行并排对比：
MC9S08GT60ACFDER
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08GT16ACFDER
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08GT32ACFDE
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →MC9S08GT32CFDE
✅ 直接替换📋 参考替代料（不在目录中）
S9S08AW32MFGE
✅ 直接替换📋 参考替代料（不在目录中）
MC9S08AW32MFGE
✅ 直接替换✓ 有现货
$3.15 / 个
查看数据手册 →MC9S08GT32ACFDER 最大额定值与电气特性
| Core Processor | S08 |
| Core Size | 8-Bit |
| Core Architecture | CISC |
| Maximum Clock Speed | 40 MHz |
| Program Memory Size | 32 KB (32K x 8) FLASH |
| RAM Size | 2 KB |
| EEPROM Size | Not specified in datasheet excerpt |
| Number of I/O | 39 |
| Connectivity | I2C, SCI, SPI |
| Peripherals | LVD, POR, PWM, WDT |
| 电源电压 | 2.7 V to 5.5 V |
| 工作温度 | -40 C to +85 C (industrial) |
| 封装 | 48-QFN-EP (7x7 mm) with exposed thermal pad |
| 安装类型 | Surface Mount |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
MC9S08GT32ACFDER 引脚配置
| 引脚 1 | PTB0 — General-purpose I/O / TCLK |
| 引脚 2 | PTB1 — General-purpose I/O |
| 引脚 3 | PTB2 — General-purpose I/O / SDA |
| 引脚 4 | PTB3 — General-purpose I/O / SCL |
| 引脚 5 | VDD — Supply voltage (2.7V-5.5V) |
| 引脚 6 | VSS — Ground |
| 引脚 7 | PTA0 — General-purpose I/O / RxD |
| 引脚 8 | PTA1 — General-purpose I/O / TxD |
| 引脚 9 | PTA2 — General-purpose I/O |
| 引脚 10 | PTA3 — General-purpose I/O |
| 引脚 11 | PTA4 — General-purpose I/O |
| 引脚 12 | PTA5 — General-purpose I/O / IRQ |
| 引脚 13 | PTA6 — General-purpose I/O |
| 引脚 14 | PTA7 — General-purpose I/O |
| 引脚 15 | PTC0 — General-purpose I/O |
| 引脚 16 | PTC1 — General-purpose I/O |
| 引脚 17 | PTC2 — General-purpose I/O |
| 引脚 18 | PTC3 — General-purpose I/O |
| 引脚 19 | PTC4 — General-purpose I/O |
| 引脚 20 | PTC5 — General-purpose I/O |
| 引脚 21 | PTC6 — General-purpose I/O |
| 引脚 22 | PTC7 — General-purpose I/O |
| 引脚 23 | PTD0 — General-purpose I/O |
| 引脚 24 | PTD1 — General-purpose I/O |
| 引脚 25 | PTD2 — General-purpose I/O |
| 引脚 26 | PTD3 — General-purpose I/O |
| 引脚 27 | PTD4 — General-purpose I/O |
| 引脚 28 | PTD5 — General-purpose I/O |
| 引脚 29 | PTD6 — General-purpose I/O |
| 引脚 30 | PTD7 — General-purpose I/O |
| 引脚 31 | PTE0 — General-purpose I/O |
| 引脚 32 | PTE1 — General-purpose I/O |
| 引脚 33 | PTE2 — General-purpose I/O |
| 引脚 34 | PTE3 — General-purpose I/O |
| 引脚 35 | PTE4 — General-purpose I/O |
| 引脚 36 | PTE5 — General-purpose I/O |
| 引脚 37 | PTE6 — General-purpose I/O |
| 引脚 38 | PTE7 — General-purpose I/O |
| 引脚 39 | RESET — Bidirectional reset (active low) |
| 引脚 40 | BKGD — Background debug mode |
| 引脚 41 | XOSC1 — External crystal oscillator input |
| 引脚 42 | XOSC2 — External crystal oscillator output |
| 引脚 43 | TCLK — Timer clock input / PTF0 |
| 引脚 44 | PTF1 — General-purpose I/O |
| 引脚 45 | PTF2 — General-purpose I/O |
| 引脚 46 | PTF3 — General-purpose I/O |
| 引脚 47 | VDD — Supply voltage (second pin) |
| 引脚 48 | VSS — Ground (second pin) / exposed pad |
典型应用
MC9S08GT32ACFDER 适用于 6 应用s: HVAC Control Boards, White Goods / Appliance User Interface, Automotive Body Controllers, Battery-Powered Sensor Transmitters, Low-End BLDC Motor Drivers, LED Lighting Controllers.
HVAC Control Boards
The MC9S08GT32ACFDER fits HVAC control boards thanks to its 40MHz S08 core and 32KB Flash, which comfortably hosts a real-time control loop plus user-interface state machine in a single device. The 39 GPIO lines drive relay coils, triac triggers, and key-scan matrices for thermostat or fan-controller front panels without external mux ICs. Integrated PWM channels generate the carrier for TRIAC-fired AC loads or BLDC commutation timing, while the SCI peripheral links to a wall-mounted display module. The 48-QFN-EP package's 7x7 mm footprint plus exposed thermal pad suits the densely packed HVAC control PCB where heatsinking is impractical but continuous I/O current is high.
推荐
White Goods / Appliance User Interface
The MC9S08GT32ACFDER powers washing machine, dishwasher, and oven user-interface panels where 32KB of Flash hosts the menu tree plus diagnostics, and the 39 GPIO drive seven-segment displays and key matrices. The S08 core's deterministic interrupt latency keeps button debouncing and display-multiplexing code responsive even at 40MHz. The 2.7V-5.5V supply range accepts 3.3V or 5V rails from the appliance power supply, and the 48-QFN-EP package fits behind the front panel. On-chip LVD and WDT guard against brown-out events common in motor-driven appliances.
推荐
Automotive Body Controllers
The MC9S08GT32ACFDER handles non-safety body-controller tasks such as mirror positioning, lighting sequencer, and accessory multiplex nodes. Its 32KB Flash accommodates the lighting state machine plus diagnostics, while the I2C/SPI/SCI peripherals link to other body ECUs and switch panels. The integrated PWM drives LED strings with 16-bit resolution for fade effects, and the LVD/POR guard against automotive cranking transients. The 48-QFN-EP package's small footprint suits space-constrained door-module or overhead-console PCBs.
推荐
Battery-Powered Sensor Transmitters
The MC9S08GT32ACFDER suits industrial sensor transmitters operating from a 3.6V lithium primary cell, where the 2.7V-5.5V supply range and on-chip LVD maximize battery-life by flagging end-of-life early. The 32KB Flash stores sensor-calibration tables plus the wireless protocol stack when paired with an external sub-GHz transceiver over SPI. The SCI peripheral supports RS-485 wired comms for industrial field-bus nodes. Low GPIO count (39) suits single-sensor PCB designs.
推荐
Low-End BLDC Motor Drivers
The MC9S08GT32ACFDER drives low-end BLDC motors in fans, pumps, and small appliances, where the 40MHz S08 core runs the commutation state machine plus speed-control loop. Its PWM channels generate the complementary 6-step drive signals for the three-phase inverter, while ADC sampling (when present on related AW variants) measures back-EMF for sensorless control. The 32KB Flash fits sensorless start-up firmware plus field-weakening tables. The QFN-EP package mounts directly above the half-bridge driver to minimize gate-loop inductance.
推荐
LED Lighting Controllers
The MC9S08GT32ACFDER runs DMX-512 or DALI lighting fixtures where the 32KB Flash stores the fixture personality, color-mixing coefficients, and dimming curves. Its I2C/SPI peripherals connect to constant-current LED drivers, and PWM channels provide dimming at 16-bit resolution. The 39 GPIO suits RGBW plus white-strip fixtures with multiple zones. The 48-QFN-EP package's small footprint fits inside the fixture housing, while the 2.7V-5.5V supply accepts PoE or 24V LED-driver rails.
推荐
推荐产品汇总
工程参考数据： MC9S08GT32ACFDER ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S08GT60ACFDER | MC9S08GT16ACFDER | MC9S08GT32ACFDE | S9S08AW32MFGE | MC9S08AW32MFGE |
|---|---|---|---|---|---|---|
| Package | 48-QFN-EP (7x7) | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-QFN-EP (7x7) - same | 48-LQFP - same pin count, different footprint | 48-LQFP - same pin count, different footprint |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit CISC | S08 8-bit AW-series | S08 8-bit AW-series |
| Max Clock Speed | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz | 40 MHz |
| Flash Size | 32 KB | 60 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| RAM Size | 2 KB | 4 KB | 1 KB | 2 KB | 2 KB | 2 KB |
| GPIO Count | 39 | 39 | 39 | 39 | 38 | 38 |
| Supply Voltage | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V | 2.7V-5.5V |
| Connectivity | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI | I2C, SCI, SPI |
关键差异点
- Doubling Flash without PCB change （对比 MC9S08GT16ACFDER)
- Field-upgrade path without redesign （对比 MC9S08GT60ACFDER)
- Same-brand S08 family breadth （对比 MC9S08AW32MFGE)
设计说明
Estimated - Decouple each VDD pin (5 and 47) with a 100nF ceramic capacitor placed within 3 mm of the pin. Add a bulk 4.7uF tantalum or ceramic on the main supply rail. The on-chip voltage regulator generates 1.8V for the core; the 2.7V minimum VDD ensures regulator headroom under 40MHz core clock and full GPIO toggling.
The 48-QFN-EP exposed thermal pad must be soldered to a continuous copper pour on the top PCB layer, with thermal vias to inner planes. Estimated theta_JA for a 4-layer board with 1 sq inch copper pour is approximately 35 C/W. Without the thermal pad soldered, junction temperature can exceed 125 C under full I/O load at industrial ambient.
Keep the BKGD / RESET trace short (under 25 mm) and route away from switching signals. The crystal traces (XOSC1, XOSC2) should be guarded by a ground ring to prevent noise injection from PWM outputs. Place the 0.1uF VDD caps before the I/O connector pin to suppress cable-discharge transients in appliance and industrial enclosures.
Avoid using PTA5/IRQ as a general output without confirming the IRQ-edge-select register is cleared, otherwise spurious interrupts wake the CPU. Do not exceed 5.5V on any pin; transients above 6V can trigger latch-up. Always vector the reset handler to clear the COP (watchdog) enable bit before any main-loop delay that exceeds the WDT timeout.
合规信息
RoHS and lead-free confirmed by NXP product page. Industrial temperature grade -40C to +85C. AEC-Q100 not applicable for this MPN suffix; the automotive-qualified variant uses a different device designation.
