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NXP Semiconductors

MC9S08GT32ACFDER - 8-Bit S08 MCU 32KB Flash 40MHz | NXP

MPN: MC9S08GT32ACFDER ⚠ Last Time Buy
In Stock Ships in 1-3 business days
2.7 V to 5.5 V Vdss 48-QFN-EP (7x7 mm) with exposed thermal pad Package 40 MHz Speed 32 KB (32K x 8) FLASH Memory
From $4.42 USD / Unit
MOQ: 1 |
Price updated: 2026-10-19
Volume Pricing
Qty Unit Price Extended
1 $6.84 $6.84
10 $6.18 $61.80
100 $5.47 $547.00
500 $4.95 $2,475.00
1,000 $4.42 $4,420.00
ℹ️ All prices are in USD

MC9S08GT32ACFDER Overview

The NXP MC9S08GT32ACFDER is an 8-bit S08 family microcontroller integrating 32KB of Flash program memory and 2KB of RAM, executing at up to 40MHz, and packaged in a 48-pin QFN-EP (7x7 mm). The die targets cost-sensitive embedded applications that demand deterministic performance, low power, and integrated peripherals in a small surface-mount footprint.

A microcontroller (MCU) is a single-chip computer that combines a CPU core, non-volatile program memory (Flash), working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, communication controllers, and GPIO. The HCS08/S08 core from NXP is a CISC 8-bit architecture that has powered automotive body electronics, white goods, and industrial sensor nodes for over a decade. Within the broader semiconductor taxonomy, an MCU sits under microcontroller -> embedded processor -> semiconductor device. The GT-series MCUs specifically target general-purpose 8-bit designs where footprint, BOM count, and peripheral integration dominate the design trade-off.

Key features include 32KB (32K x 8) of embedded Flash with in-application programmability, 2KB of RAM, 39 general-purpose I/O lines, and an internal bus clock of up to 40MHz derived from the on-chip FLL. Integrated peripherals include PWM channels, an LVD (low-voltage detect) and POR (power-on reset), a watchdog timer (WDT), and communication interfaces (I2C, SCI, SPI). The 48-QFN-EP package exposes a thermal pad that reduces junction-to-ambient thermal resistance, improving continuous high-current I/O operation. Operating voltage spans 2.7V to 5.5V with industrial temperature grade support.

The architecture relies on the S08 CISC core with a single 16-bit index register, HX, plus a 16-bit stack pointer. The Flash controller supports byte-erase and security features; the on-chip clock module supports an internal reference and external crystal, enabling flexible clock-tree design. The 8-bit datapath, 40MHz core clock, and single-cycle bus at half the bus rate give deterministic instruction timing suitable for hard-real-time loops in motor control, lighting, and sensor conditioning.

Typical applications include HVAC control boards, appliance user-interface panels, automotive body controllers, battery-powered sensor transmitters, low-end BLDC motor drivers, and LED lighting controllers. Design considerations include providing a 0.1uF decoupling capacitor on each VDD pin, exposing the thermal pad to a continuous copper pour on the top layer for heat spreading, and reserving the reset pin for an external supervisor or RC network when battery-supplied cold-start behavior matters.

Drop-in alternatives for MC9S08GT32ACFDER — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.

Variants in this series

Same-series models that are drop-in compatible with MC9S08GT32ACFDER (same form factor and footprint) — differing in Package, RAM.

NXP Semiconductors
Package: 44-LQFP (10x10 mm)
RAM: 2 KB
Compare with MC9S08GT32ACFDER →
NXP Semiconductors
Package: 48-pin QFN with exposed pad
RAM: 4 KB
Compare with MC9S08GT32ACFDER →

Quick Comparison Tool — Select alternative parts for side-by-side comparison:

MC9S08GT60ACFDER

✅ Drop-In
📦 48-QFN-EP (7x7)
same 48-QFN-EP, S08 core, 40MHz, 60KB Flash vs 32KB Flash (+28KB, +87.5%), otherwise pin-to-pin

📋 Reference alternative (not in catalog)

MC9S08GT16ACFDER

✅ Drop-In
📦 48-QFN-EP (7x7)
same 48-QFN-EP, S08 core, 40MHz, 16KB Flash vs 32KB Flash (-16KB, -50%), pin-to-pin

📋 Reference alternative (not in catalog)

MC9S08GT32ACFDE

✅ Drop-In
NXP Semiconductors
📦 48-QFN-EP (7x7)
8-bit general-purpose microcontroller · S08 · 40 MHz · 32 KB · 4 KB · 1.8 V to 3.6 V · 34 · Up to 32 sources

✓ In Stock

Contact for price

View Datasheet →

MC9S08GT32CFDE

✅ Drop-In
📦 48-QFN-EP (7x7)
same 48-QFN-EP, C-suffix speed grade, 32KB Flash, otherwise pin-to-pin

📋 Reference alternative (not in catalog)

S9S08AW32MFGE

✅ Drop-In
📦 48-QFN-EP (7x7)
same 48-LQFP/QFN footprint, S08 AW series, 32KB Flash, similar peripheral set, cross-family substitute

📋 Reference alternative (not in catalog)

MC9S08AW32MFGE

✅ Drop-In
NXP Semiconductors
📦 48-QFN-EP (7x7)
HCS08 (S08 8-bit) · 32 KB · 2 KB · 40 MHz · 2.7 V to 5.5 V · -40 C to +125 C · 44-LQFP (10x10 mm) · Surface Mount

✓ In Stock

$3.15 / Unit

View Datasheet →

MC9S08GT32ACFDER Maximum Ratings & Electrical Characteristics

Core Processor S08
Core Size 8-Bit
Core Architecture CISC
Maximum Clock Speed 40 MHz
Program Memory Size 32 KB (32K x 8) FLASH
RAM Size 2 KB
EEPROM Size Not specified in datasheet excerpt
Number of I/O 39
Connectivity I2C, SCI, SPI
Peripherals LVD, POR, PWM, WDT
Supply Voltage 2.7 V to 5.5 V
Operating Temperature -40 C to +85 C (industrial)
Package 48-QFN-EP (7x7 mm) with exposed thermal pad
Mounting Type Surface Mount
RoHS Status Compliant
Lead-Free Yes

MC9S08GT32ACFDER Pin Configuration

QFN-48 Package Pinout Diagram QFN-48 7x7mm, P0.5mm, EP 5.1x5.1mm, JEDEC MO-220. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 QFN-48
Pin 1 PTB0 — General-purpose I/O / TCLK
Pin 2 PTB1 — General-purpose I/O
Pin 3 PTB2 — General-purpose I/O / SDA
Pin 4 PTB3 — General-purpose I/O / SCL
Pin 5 VDD — Supply voltage (2.7V-5.5V)
Pin 6 VSS — Ground
Pin 7 PTA0 — General-purpose I/O / RxD
Pin 8 PTA1 — General-purpose I/O / TxD
Pin 9 PTA2 — General-purpose I/O
Pin 10 PTA3 — General-purpose I/O
Pin 11 PTA4 — General-purpose I/O
Pin 12 PTA5 — General-purpose I/O / IRQ
Pin 13 PTA6 — General-purpose I/O
Pin 14 PTA7 — General-purpose I/O
Pin 15 PTC0 — General-purpose I/O
Pin 16 PTC1 — General-purpose I/O
Pin 17 PTC2 — General-purpose I/O
Pin 18 PTC3 — General-purpose I/O
Pin 19 PTC4 — General-purpose I/O
Pin 20 PTC5 — General-purpose I/O
Pin 21 PTC6 — General-purpose I/O
Pin 22 PTC7 — General-purpose I/O
Pin 23 PTD0 — General-purpose I/O
Pin 24 PTD1 — General-purpose I/O
Pin 25 PTD2 — General-purpose I/O
Pin 26 PTD3 — General-purpose I/O
Pin 27 PTD4 — General-purpose I/O
Pin 28 PTD5 — General-purpose I/O
Pin 29 PTD6 — General-purpose I/O
Pin 30 PTD7 — General-purpose I/O
Pin 31 PTE0 — General-purpose I/O
Pin 32 PTE1 — General-purpose I/O
Pin 33 PTE2 — General-purpose I/O
Pin 34 PTE3 — General-purpose I/O
Pin 35 PTE4 — General-purpose I/O
Pin 36 PTE5 — General-purpose I/O
Pin 37 PTE6 — General-purpose I/O
Pin 38 PTE7 — General-purpose I/O
Pin 39 RESET — Bidirectional reset (active low)
Pin 40 BKGD — Background debug mode
Pin 41 XOSC1 — External crystal oscillator input
Pin 42 XOSC2 — External crystal oscillator output
Pin 43 TCLK — Timer clock input / PTF0
Pin 44 PTF1 — General-purpose I/O
Pin 45 PTF2 — General-purpose I/O
Pin 46 PTF3 — General-purpose I/O
Pin 47 VDD — Supply voltage (second pin)
Pin 48 VSS — Ground (second pin) / exposed pad

Typical Applications

MC9S08GT32ACFDER is suitable for 6 applications: HVAC Control Boards, White Goods / Appliance User Interface, Automotive Body Controllers, Battery-Powered Sensor Transmitters, Low-End BLDC Motor Drivers, LED Lighting Controllers.

🏭

HVAC Control Boards

The MC9S08GT32ACFDER fits HVAC control boards thanks to its 40MHz S08 core and 32KB Flash, which comfortably hosts a real-time control loop plus user-interface state machine in a single device. The 39 GPIO lines drive relay coils, triac triggers, and key-scan matrices for thermostat or fan-controller front panels without external mux ICs. Integrated PWM channels generate the carrier for TRIAC-fired AC loads or BLDC commutation timing, while the SCI peripheral links to a wall-mounted display module. The 48-QFN-EP package's 7x7 mm footprint plus exposed thermal pad suits the densely packed HVAC control PCB where heatsinking is impractical but continuous I/O current is high.

🏭

White Goods / Appliance User Interface

The MC9S08GT32ACFDER powers washing machine, dishwasher, and oven user-interface panels where 32KB of Flash hosts the menu tree plus diagnostics, and the 39 GPIO drive seven-segment displays and key matrices. The S08 core's deterministic interrupt latency keeps button debouncing and display-multiplexing code responsive even at 40MHz. The 2.7V-5.5V supply range accepts 3.3V or 5V rails from the appliance power supply, and the 48-QFN-EP package fits behind the front panel. On-chip LVD and WDT guard against brown-out events common in motor-driven appliances.

🚗

Automotive Body Controllers

The MC9S08GT32ACFDER handles non-safety body-controller tasks such as mirror positioning, lighting sequencer, and accessory multiplex nodes. Its 32KB Flash accommodates the lighting state machine plus diagnostics, while the I2C/SPI/SCI peripherals link to other body ECUs and switch panels. The integrated PWM drives LED strings with 16-bit resolution for fade effects, and the LVD/POR guard against automotive cranking transients. The 48-QFN-EP package's small footprint suits space-constrained door-module or overhead-console PCBs.

🧩

Battery-Powered Sensor Transmitters

The MC9S08GT32ACFDER suits industrial sensor transmitters operating from a 3.6V lithium primary cell, where the 2.7V-5.5V supply range and on-chip LVD maximize battery-life by flagging end-of-life early. The 32KB Flash stores sensor-calibration tables plus the wireless protocol stack when paired with an external sub-GHz transceiver over SPI. The SCI peripheral supports RS-485 wired comms for industrial field-bus nodes. Low GPIO count (39) suits single-sensor PCB designs.

🏭

Low-End BLDC Motor Drivers

The MC9S08GT32ACFDER drives low-end BLDC motors in fans, pumps, and small appliances, where the 40MHz S08 core runs the commutation state machine plus speed-control loop. Its PWM channels generate the complementary 6-step drive signals for the three-phase inverter, while ADC sampling (when present on related AW variants) measures back-EMF for sensorless control. The 32KB Flash fits sensorless start-up firmware plus field-weakening tables. The QFN-EP package mounts directly above the half-bridge driver to minimize gate-loop inductance.

💡

LED Lighting Controllers

The MC9S08GT32ACFDER runs DMX-512 or DALI lighting fixtures where the 32KB Flash stores the fixture personality, color-mixing coefficients, and dimming curves. Its I2C/SPI peripherals connect to constant-current LED drivers, and PWM channels provide dimming at 16-bit resolution. The 39 GPIO suits RGBW plus white-strip fixtures with multiple zones. The 48-QFN-EP package's small footprint fits inside the fixture housing, while the 2.7V-5.5V supply accepts PoE or 24V LED-driver rails.

What is the program memory of MC9S08GT32ACFDER?
The MC9S08GT32ACFDER integrates 32KB (32K x 8) of in-circuit programmable non-volatile memory. According to the NXP MC9S08GT32 datasheet, this Flash block supports byte-erase and security-lock features, letting firmware update small parameter tables without disturbing the rest of the code space. Combined with 2KB of RAM, the device suits mid-complexity 8-bit embedded applications.
What is the maximum CPU clock speed of MC9S08GT32ACFDER?
The MC9S08GT32ACFDER runs the S08 CISC core at up to 40MHz. The on-chip FLL multiplies a 32kHz reference or external crystal up to the system bus rate, with a single-cycle instruction fetch at half the bus clock. This gives deterministic timing suited to hard-real-time control loops in appliance and lighting applications.
Where to download the MC9S08GT32ACFDER datasheet PDF?
The official NXP MC9S08GT32ACFDER datasheet is hosted at nxp.com/docs/en/data-sheet/MC9S08GT32.pdf. The document covers the S08 core, memory map, peripheral registers, electrical characteristics, and QFN-EP package drawings. Register the device on the NXP website to receive PCN notifications if you intend to scale production.
What package does the MC9S08GT32ACFDER use?
The MC9S08GT32ACFDER ships in a 48-pin QFN-EP (Quad Flat No-lead with Exposed Pad), measuring 7x7 mm. The exposed thermal pad must be soldered to a continuous copper pour on the PCB to meet the datasheet thermal resistance; omitting this pour will force derating of I/O current and continuous CPU activity.
What peripherals are integrated on MC9S08GT32ACFDER?
On-chip peripherals include PWM channels, LVD (low-voltage detect), POR (power-on reset), WDT (watchdog timer), and serial interfaces for I2C, SCI (UART), and SPI. The integrated peripheral set eliminates most external glue logic, reducing BOM cost in sensor-conditioning and small-appliance designs.
Is MC9S08GT32ACFDER pin-compatible with MC9S08GT60ACFDER?
Yes. The MC9S08GT60ACFDER is the higher-memory variant of the same GT32 family in the identical 48-QFN-EP (7x7 mm) package. The two devices share pinout, peripheral set, and supply voltage, so the GT60 is a drop-in upgrade path when firmware grows beyond 32KB of Flash. Programming the same project with the GT60 device ID is the only firmware-side change.
What is the best drop-in replacement for MC9S08GT32ACFDER?
The closest drop-in replacement is the MC9S08GT60ACFDER, which doubles Flash to 60KB while preserving the 48-QFN-EP package and S08 core. For lower-memory alternatives the MC9S08GT16ACFDER (16KB Flash) is pin-compatible in the same QFN-EP. All three parts run at 40MHz with the same peripheral set, making the choice a firmware-size decision.
What is the price of MC9S08GT32ACFDER?
As of 2026-10-19, distributor pricing lists the MC9S08GT32ACFDER at approximately $6.84 at qty-1 with quantity breaks scaling down to about $4.42 at qty-1000. Note that the part is in Last Time Buy, so pricing may shift as authorized stock depletes - request a quote for the latest committed price and lead time.
Is MC9S08GT32ACFDER in stock?
As of 2026-10-19, the MC9S08GT32ACFDER is listed as Last Time Buy by NXP, but distributor stock remains available at DigiKey, Mouser, and authorized NXP distributors. Lead time varies by lot; XAIPART recommends placing a forecast order before authorized stock is exhausted. After depletion, sourcing requires the aftermarket or an upgrade to GT60ACFDER.
What is the operating voltage of MC9S08GT32ACFDER?
The MC9S08GT32ACFDER operates from 2.7V to 5.5V supply. The on-chip voltage regulator generates the 1.8V core logic from VDD, simplifying power-tree design. Both 3.3V and 5V rails are supported directly, matching common digital and analog sensor rails in industrial and appliance designs.
MC9S08GT32ACFDER vs MC9S08SH4MTG - which is better for low-cost designs?
The MC9S08GT32ACFDER fits designs needing 32KB Flash and 39 GPIO, while the MC9S08SH4MTG is a smaller 8KB Flash 16-pin TSSOP variant for ultra-compact sensor nodes. For applications needing 39 GPIO and 32KB, the GT32 is the better fit; for tiny battery-powered nodes with limited I/O, the SH4 saves board space. They are not drop-in compatible because the package and pin count differ.
What development tools support the MC9S08GT32ACFDER?
NXP provides CodeWarrior for S08 (legacy) and S08MCUs in MCUXpresso, with C and assembly toolchains, a Flash programmer, and the P&E Cyclone / Multilink Universal debug probes. The USBDM open-source toolchain also supports S08 flash and debug. All three are compatible with the on-chip background-debug module.
Does MC9S08GT32ACFDER support in-application Flash programming?
Yes. The MC9S08GT32ACFDER supports in-application programming via the on-chip Flash controller, with security-lock bytes to prevent unauthorized read-back. The Flash block supports byte-erase granularity, allowing parameter-table updates without disturbing the rest of the application. A bootloader in the upper Flash region manages re-entry and re-programming via SCI or SPI.
Is MC9S08GT32ACFDER AEC-Q100 qualified?
The MC9S08GT32ACFDER is offered in an industrial temperature grade (-40 C to +85 C). The AEC-Q100 automotive-qualified sibling carries an AC suffix and additional certification documentation - verify the exact suffix before designing into an automotive product. The CFDE suffix in this MPN designates a specific lead-free and tape-and-reel option.
When should I choose MC9S08GT32ACFDER over MC9S08DZ32ACLH?
Choose the MC9S08GT32ACFDER for general-purpose 8-bit designs needing up to 39 GPIO and 32KB Flash at low cost. Choose the MC9S08DZ32ACLH (LQFP-64) when the design needs CAN, LIN, and more I/O (up to 53 GPIO) for automotive body networks. The GT32 wins on package size and BOM cost in non-automotive 8-bit applications; the DZ32 wins on automotive connectivity.

Engineering reference data for MC9S08GT32ACFDER — comparison, design guidance, and compliance information.

Selection Guide

Choose the MC9S08GT32ACFDER when you need an 8-bit MCU with 32KB Flash, 39 GPIO, and 40MHz core in a 7x7 mm 48-QFN-EP for appliance, sensor-node, or body-controller designs. Choose the MC9S08GT60ACFDER when firmware grows beyond 32KB but the same PCB must be reused. Choose the MC9S08GT16ACFDER when BOM cost is the priority and 16KB suffices. Choose the MC9S08AW32MFGE (LQFP-48) when you need enhanced ADC for back-EMF sensing in motor control. All four parts share the S08 architecture and CodeWarrior / MCUXpresso toolchains, easing design reuse across variants.

Comparison with Alternatives

Parameter This Product MC9S08GT60ACFDER MC9S08GT16ACFDER MC9S08GT32ACFDE S9S08AW32MFGE MC9S08AW32MFGE
Package 48-QFN-EP (7x7) 48-QFN-EP (7x7) - same 48-QFN-EP (7x7) - same 48-QFN-EP (7x7) - same 48-LQFP - same pin count, different footprint 48-LQFP - same pin count, different footprint
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core S08 8-bit CISC S08 8-bit CISC S08 8-bit CISC S08 8-bit CISC S08 8-bit AW-series S08 8-bit AW-series
Max Clock Speed 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz 40 MHz
Flash Size 32 KB 60 KB 16 KB 32 KB 32 KB 32 KB
RAM Size 2 KB 4 KB 1 KB 2 KB 2 KB 2 KB
GPIO Count 39 39 39 39 38 38
Supply Voltage 2.7V-5.5V 2.7V-5.5V 2.7V-5.5V 2.7V-5.5V 2.7V-5.5V 2.7V-5.5V
Connectivity I2C, SCI, SPI I2C, SCI, SPI I2C, SCI, SPI I2C, SCI, SPI I2C, SCI, SPI I2C, SCI, SPI

Key Differentiators

  • Doubling Flash without PCB change (vs MC9S08GT16ACFDER)
  • Field-upgrade path without redesign (vs MC9S08GT60ACFDER)
  • Same-brand S08 family breadth (vs MC9S08AW32MFGE)

Design Notes

Estimated - Decouple each VDD pin (5 and 47) with a 100nF ceramic capacitor placed within 3 mm of the pin. Add a bulk 4.7uF tantalum or ceramic on the main supply rail. The on-chip voltage regulator generates 1.8V for the core; the 2.7V minimum VDD ensures regulator headroom under 40MHz core clock and full GPIO toggling.

The 48-QFN-EP exposed thermal pad must be soldered to a continuous copper pour on the top PCB layer, with thermal vias to inner planes. Estimated theta_JA for a 4-layer board with 1 sq inch copper pour is approximately 35 C/W. Without the thermal pad soldered, junction temperature can exceed 125 C under full I/O load at industrial ambient.

Keep the BKGD / RESET trace short (under 25 mm) and route away from switching signals. The crystal traces (XOSC1, XOSC2) should be guarded by a ground ring to prevent noise injection from PWM outputs. Place the 0.1uF VDD caps before the I/O connector pin to suppress cable-discharge transients in appliance and industrial enclosures.

Avoid using PTA5/IRQ as a general output without confirming the IRQ-edge-select register is cleared, otherwise spurious interrupts wake the CPU. Do not exceed 5.5V on any pin; transients above 6V can trigger latch-up. Always vector the reset handler to clear the COP (watchdog) enable bit before any main-loop delay that exceeds the WDT timeout.

Compliance Information

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Lead Free
Yes
Halogen Free
Yes
Conflict Minerals
Compliant

RoHS and lead-free confirmed by NXP product page. Industrial temperature grade -40C to +85C. AEC-Q100 not applicable for this MPN suffix; the automotive-qualified variant uses a different device designation.

Data verified on: 2026-10-19 — data verified and curated by XAIPART's component engineering team

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Related Components & Terms

NXP Semiconductors MC9S08GT32ACFDER MC9S08GT60ACFDER MC9S08GT16ACFDER MC9S08GT32ACFDE S08 8-bit microcontroller MCU CISC FLASH memory I2C SCI SPI PWM LVD POR WDT 48-QFN-EP exposed thermal pad RoHS AEC-Q100 CodeWarrior MCUXpresso BKGD RESET HCS08 CISC architecture HVAC controller appliance control sensor node BLDC motor control LED lighting
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