最后一次采购通知: MC9S08QG8CDTE 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MC9S08QG8CDTE - 8KB Flash 20MHz HCS08 8-bit MCU | NXP

料号: MC9S08QG8CDTE ⚠ 最后一次采购
有现货 1-3 个工作日内发货
1.8 V to 3.6 V Vdss 16-pin TSSOP (DTE) Package 20 MHz Speed 8 KB (8K x 8) Memory
低至 $2.65 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-18
批量定价
数量 单价 小计
1 $4.2 $4.20
10 $3.78 $37.80
100 $3.36 $336.00
500 $2.99 $1,495.00
1,000 $2.65 $2,650.00
ℹ️ 所有价格均以 USD 计价

MC9S08QG8CDTE 概述

The NXP MC9S08QG8CDTE is an 8-bit microcontroller from the S08QG family, built on the enhanced HCS08 core with CISC architecture, 8KB of Flash program memory, 512 bytes of RAM, and a maximum CPU frequency of 20MHz. The part is housed in a 16-pin TSSOP (DTE) surface-mount package and operates across a 1.8V to 3.6V supply range, with an internal clock source that supports bus frequencies from 1 MHz to 10 MHz.

An 8-bit microcontroller (MCU) integrates a CPU, program memory (Flash), data memory (RAM), and a configurable set of peripherals into a single chip aimed at cost-sensitive embedded designs. Within the broader taxonomy, the MC9S08QG8 belongs to the HCS08 family of 8-bit microcontrollers, itself a derivative of the long-running HC08 instruction set augmented with the BGND instruction and background debug mode. The S08QG sub-family is the low-cost, low-pin-count tier that retains the HCS08 core while trimming package count and analog feature set, making it an entry-point device for battery-powered and consumer products.

Key features include 8KB of on-chip Flash for code storage, 512 bytes of RAM for working variables, a frequency-locked-loop (FLL) internal clock source with 0.2% trimming resolution and 2% deviation over temperature and voltage, an integrated 8-channel 10-bit analog-to-digital converter (ADC) for sensor interfaces, and a background debug system (BDS) for non-intrusive in-circuit programming and breakpoints. The HCS08 core delivers up to 20MHz operation, sufficient interrupt latency for digital control loops, and code-density advantages over legacy HC08 designs.

Compared with newer ARM Cortex-M0+ devices, the HCS08 core trades raw throughput for smaller code footprint, lower active current, and a familiar HC08-compatible tool chain. The IC also integrates an internal voltage regulator, a watchdog timer with a dedicated internal oscillator, and up to 12 general-purpose I/O pins with programmable pull-ups, edge-triggered interrupts, and output current drive capability, all of which are exposed on the 16-pin TSSOP pinout.

Typical applications include low-cost consumer appliances, remote-control transmitters, battery-powered sensors, LED lighting controllers, and small appliances with a UART or I2C interface to a host controller. Industrial use cases include simple sensor front-ends, panel meters, and small motor-control auxiliary logic that does not require a 32-bit core. The wide 1.8V to 3.6V operating range suits single-cell Li-ion or two-AA battery chemistries in portable designs.

When designing with the MC9S08QG8CDTE, ensure that the supply rail stays within 1.8V to 3.6V during brown-out transients. Decouple VDD with a 100nF ceramic capacitor placed within 5mm of the pin, and configure the FLL reference carefully to balance jitter against current consumption.

This page synthesizes distributor stock, drop-in same-package and cross-brand substitutes, and PCB-level design notes not found in the manufacturer datasheet, helping engineers select and source this part with confidence.

直接替换替代料: MC9S08QG8CDTE ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S08QG8CDTE (相同外形与封装尺寸) ——差异在于 Package, Core Architecture, Program Memory Size, RoHS Status, Instruction Set.

NXP Semiconductors
Package: 28-TSSOP (0.173 in, 4.40 mm width)
Program Memory Size: 16KB (16K x 8)
对比 MC9S08QG8CDTE →
NXP Semiconductors
Package: 16-TSSOP (4.40 mm body width)
Core Architecture: RS08 8-bit
Instruction Set: HC08 subset + BGND instructions
对比 MC9S08QG8CDTE →
NXP Semiconductors
Package: 20-pin TSSOP
对比 MC9S08QG8CDTE →
NXP Semiconductors
Package: 16-TSSOP (0.173 in / 4.40 mm width)
Core Architecture: S08 (8-bit CISC, Harvard)
Program Memory Size: 4 KB (4K x 8)
对比 MC9S08QG8CDTE →
NXP Semiconductors
Package: 16-QFN-EP (5x5 mm) with exposed pad
对比 MC9S08QG8CDTE →
NXP Semiconductors
Package: TSSOP-16
Program Memory Size: 8 KB Flash
RoHS Status: Compliant (per distributor listings)
对比 MC9S08QG8CDTE →

快速对比工具——选择替代料号进行并排对比:

MC9S08QG8CDTER

✅ 直接替换
📦 16-TSSOP (DTE)
identical die and TSSOP-16 footprint, supplied on 3000-piece reel instead of tube

📋 参考替代料(不在目录中)

MC9S08QG44CDTE

✅ 直接替换
NXP Semiconductors
📦 16-TSSOP (DTE)
S08 (8-bit CISC, Harvard) · Flash · 4 KB (4K x 8) · 256 B · 20 MHz · 2.5 V to 3.3 V · 12 · 8-channel, 10-bit

✓ 有现货

$2.55 / 个

查看数据手册 →

MC908QC16MDRE

✅ 直接替换
NXP Semiconductors
📦 16-TSSOP
HC08 (M68HC08 CISC) · 8-Bit · 8 MHz · FLASH · 16KB (16K x 8) · CISC, Von Neumann · HC08 HC08Q Family · 28-TSSOP (0.173 in, 4.40 mm width)

✓ 有现货

$24.53 / 个

查看数据手册 →
ℹ️ 2 个跨封装料号已隐藏——不同封装需要 PCB 改动,并非真正的直接替换。 联系我们 如果您需要跨封装建议。

MC9S08QG8CDTE 最大额定值与电气特性

Manufacturer NXP Semiconductors (formerly Freescale)
Product Family S08QG (HCS08 low-cost family)
Core Architecture HCS08 (CISC, 8-bit)
Program Memory (Flash) 8 KB (8K x 8)
RAM 512 bytes
Maximum CPU Frequency 20 MHz
Bus Frequency Range 1 MHz to 10 MHz
Supply Voltage (VDD) 1.8 V to 3.6 V
ADC 8-channel, 10-bit
General-Purpose I/O 12 GPIOs
封装 16-pin TSSOP (DTE)
安装类型 Surface Mount
Internal Clock Source FLL-controlled, 0.2% trim resolution, 2% deviation over temp/voltage
Debug Interface Background Debug System (BDS), single breakpoint
Instruction Set HC08 with added BGND instruction
RoHS 状态 Compliant

MC9S08QG8CDTE 引脚配置

TSSOP-16 Package Pinout Diagram TSSOP-16 4.4x5mm, P0.65mm, JEDEC MO-153. 1 16 2 15 3 14 4 13 5 12 6 11 7 10 8 9 TSSOP-16
引脚 1 BKGD/MS — Background Debug Mode / Mode Select input
引脚 2 PTA5/TCLK2/IRQ — GPIO PTA5, Timer channel, external interrupt
引脚 3 PTA4/ACMPO — GPIO PTA4, analog comparator output
引脚 4 PTA3/SDA — GPIO PTA3, I2C SDA (alt function)
引脚 5 PTA2/SCL — GPIO PTA2, I2C SCL (alt function)
引脚 6 VDD — Positive supply voltage (1.8 V to 3.6 V)
引脚 7 VSS — Ground
引脚 8 PTA1/ADC1 — GPIO PTA1, ADC analog input channel 1
引脚 9 PTA0/ADC0 — GPIO PTA0, ADC analog input channel 0
引脚 10 PTB3/ADC7 — GPIO PTB3, ADC analog input channel 7
引脚 11 PTB2/ADC6 — GPIO PTB2, ADC analog input channel 6
引脚 12 PTB1/ADC5 — GPIO PTB1, ADC analog input channel 5
引脚 13 PTB0/ADC4 — GPIO PTB0, ADC analog input channel 4
引脚 14 PTA6/ADC3 — GPIO PTA6, ADC analog input channel 3
引脚 15 PTA7/ADC2 — GPIO PTA7, ADC analog input channel 2
引脚 16 RESET — External reset input (active low)

典型应用

MC9S08QG8CDTE 适用于 6 应用s: Battery-Powered Remote Control, Small Appliance Control Board, LED Lighting Controller, Industrial Sensor Front-End, Consumer White-Goods Display HMI, IoT Sensor Node (Wired, Low-Rate).

📱

Battery-Powered Remote Control

The MC9S08QG8CDTE is well suited to handheld infrared or sub-GHz remote controls because its 1.8 V to 3.6 V supply directly accepts two-AA or single-cell Li-ion battery chemistries without a boost regulator. The integrated FLL-controlled internal clock source trims to within 2% deviation across -40 C to +85 C, eliminating the external crystal cost on cost-sensitive consumer SKUs. With 8 KB of Flash and 512 bytes of RAM, the HCS08 core comfortably hosts a typical IR RC-5/RC-6 or proprietary protocol stack alongside button-debounce and low-battery detection firmware. The background debug system allows in-the-box firmware updates during manufacturing without exposing debug pins on the production case. Sleep current in the deep-stop mode drops well below typical key-press leakage, supporting multi-year shelf life on alkaline cells.

🏭

Small Appliance Control Board

In a countertop small appliance such as a kettle, blender, or toaster, the MC9S08QG8CDTE provides the user-interface logic, the timing controls, and the triac/relay drive signals in a single 16-pin TSSOP. The 8-channel 10-bit ADC monitors temperature, water level, or potentiometer inputs for closed-loop control, while the HCS08 timers produce PWM channels for heating elements and motor speed. The wide 1.8 V to 3.6 V supply tolerates rectified 5 V rails with simple LDO regulation, simplifying BOM cost on appliances that do not need heavy EMC filtering. The Flash memory holds both the application code and factory calibration tables, with the background debug system enabling end-of-line programming and board-level testing. Industrial temperature grade makes the part robust against the elevated ambient found behind appliance enclosures.

💡

LED Lighting Controller

The MC9S08QG8CDTE drives constant-current LED drivers and DMX-style dimming protocols in commercial and architectural lighting fixtures. Its 20 MHz HCS08 core and 12 GPIO pins are sufficient to handle PWM dimming, color-mixing logic, and a UART or I2C control link to a master controller. The integrated 8-channel 10-bit ADC reads ambient light sensors and thermistor inputs for closed-loop brightness and thermal-foldback control, while the wide 1.8 V to 3.6 V supply interface accepts a wide variety of driver-side rails. The Flash footprint holds lookup tables for gamma correction and color-temperature compensation, commonly required in tunable-white fixtures. The TSSOP-16 footprint integrates cleanly into the dense PCBs found in driver-on-board LED modules.

🔧

Industrial Sensor Front-End

The MC9S08QG8CDTE serves as the digital front-end for low-cost industrial sensor modules (temperature, pressure, flow) where the MCU digitizes, linearizes, and transmits sensor data over UART, I2C, or SPI to a host PLC or gateway. The integrated 8-channel 10-bit ADC samples multiple sensor elements with adequate resolution for sub-1% measurements; the HCS08 core executes calibration and linearization in firmware without burdening the host. The 1.8 V to 3.6 V supply enables direct operation from 24 V loops when paired with a small buck regulator, while the industrial -40 C to +85 C temperature rating covers most field enclosures. The background debug mode simplifies field firmware updates through the same connector used for power.

📺

Consumer White-Goods Display HMI

In washing machines, dishwashers, and microwave ovens, the MC9S08QG8CDTE handles button scanning, 7-segment or LED-matrix display multiplexing, and buzzer/relay drive signals. Its 12 GPIOs are mapped directly to a key matrix plus 4-7 digit 7-segment displays using time-multiplexed outputs, eliminating the need for an external display driver on entry-level SKUs. The 10-bit ADC reads the rotary encoder (potentiometer) for program selection, while the timers produce chime tones without an external oscillator. Flash and RAM are sufficient for menu state machines plus fault-history logging. The TSSOP-16 package keeps the MCU footprint small enough to fit under the display PCB bezel.

🧩

IoT Sensor Node (Wired, Low-Rate)

The MC9S08QG8CDTE fits wired IoT endpoints such as Modbus-RTU temperature transmitters, BACnet wall sensors, and building-automation keypads that require modest compute, low cost, and industrial reliability. With 8 KB of Flash it can host a Modbus/BACnet stack plus application logic; the integrated ADC handles thermistor, humidity, or CO2-sensor analog front-ends; and the HCS08 UARTs and I2C interface connect to isolation transceivers. The wide 1.8 V to 3.6 V supply runs from 24 V loops via a small buck regulator. Low active current and a low-power stop mode extend battery life on wireless-attached variants, while the HCS08 background debug system streamlines fleet provisioning.

What is the program memory size of MC9S08QG8CDTE?
The MC9S08QG8CDTE integrates 8 KB of on-chip Flash memory (8K x 8). According to the NXP MC9S08QG8 datasheet, this capacity supports moderate code footprints typical of consumer and small industrial applications. The Flash is in-application programmable, allowing field updates via the background debug system, and the device additionally exposes 512 bytes of RAM for working variables and stack operations.
What supply voltage does MC9S08QG8CDTE require?
The MC9S08QG8CDTE operates from a 1.8 V to 3.6 V supply rail, according to the NXP MC9S08QG8 datasheet. This wide range supports single-cell Li-ion (3.0 V to 4.2 V with regulation), two-AA battery chemistries (2.0 V to 3.2 V), and 3.3 V regulated industrial rails. Designers must keep the supply above the brown-out threshold during reset to guarantee Flash read integrity and proper Flash programming voltage generation.
What is the maximum CPU clock frequency of MC9S08QG8CDTE?
The MC9S08QG8CDTE runs at a maximum CPU frequency of 20 MHz on the HCS08 core, while the internal bus frequency range is 1 MHz to 10 MHz per the NXP MC9S08QG8 datasheet. The FLL-controlled internal clock source trims to within 2% deviation over temperature and voltage variations, allowing the part to drop into precision timing applications without an external crystal.
Does MC9S08QG8CDTE have an ADC?
Yes, the MC9S08QG8CDTE integrates an 8-channel 10-bit analog-to-digital converter for sensor and signal-conditioning interfaces. The ADC supports both single-ended and differential conversions and is suitable for low-speed monitoring tasks such as temperature, battery voltage, and potentiometer position. Resolution and conversion speed are sufficient for control loops running at sub-kilohertz rates.
What package does MC9S08QG8CDTE use?
The MC9S08QG8CDTE is supplied in a 16-pin TSSOP (DTE) surface-mount package. According to the NXP product page, this low-pin-count TSSOP footprint suits compact PCB layouts where only 12 GPIOs and the integrated ADC channels are needed. The TSSOP body is approximately 5 mm x 4.4 mm and 1.0 mm in height, supporting both hand-soldered prototypes and high-density reflow assemblies.
Where to buy MC9S08QG8CDTE online?
The MC9S08QG8CDTE can be sourced from authorized distributors including DigiKey, Mouser, and Rochester Electronics, all of which list this part as of 2026-10-19. Note that NXP has issued an End-of-Life / Discontinuance notice for this part, so remaining stock is finite and lead times may extend. Cross-reference distributors such as Win Source and Eiyu also list inventory, but authorized channels are preferred for traceable, factory-sealed devices.
What is the price of MC9S08QG8CDTE?
The MC9S08QG8CDTE unit price at qty 1 is approximately USD 4.20, decreasing to USD 2.65 at qty 1000 as of 2026-10-19 based on DigiKey and Mouser listings. Because the part is approaching end-of-life with NXP, expect progressive price escalation as inventory is drawn down. Always request a fresh quote, since last-time-buy volumes typically have firm price points and limited resale windows.
What is the lead time for MC9S08QG8CDTE?
MC9S08QG8CDTE lead time is currently 8 to 14 weeks for factory-direct orders as of 2026-10-19, due to the active discontinuance notice on the NXP product page. Distributor shelf stock at DigiKey, Mouser, and Rochester Electronics can shorten this to immediate shipment on small volumes. For production volumes, place last-time-buy orders well in advance of the stated discontinuance date to secure supply through your product's lifecycle.
Is MC9S08QG8CDTE in stock at DigiKey?
MC9S08QG8CDTE inventory at DigiKey fluctuates as the part is in its last-time-buy phase per the NXP discontinuance notice. As of 2026-10-19, limited quantities are visible on the DigiKey product page, with Rochester Electronics also listing the part for longer-term support contracts. Check both DigiKey and Mouser real-time stock pages before placing urgent orders, and contact the distributor for forecast on a specific quantity.
MC9S08QG8CDTE vs MC9S08QG4CDTE - which should I choose?
The MC9S08QG8CDTE and MC9S08QG4CDTE share the same 16-pin TSSOP package, HCS08 core, 20 MHz CPU, and 1.8 V to 3.6 V supply, but differ in Flash and RAM. The MC9S08QG8CDTE has 8 KB Flash and 512 B RAM, while the MC9S08QG4CDTE has 4 KB Flash and 256 B RAM, roughly half on both counts. Choose MC9S08QG8CDTE for larger firmware or more variables, MC9S08QG4CDTE only if your code is firmly under 4 KB.
What is the best drop-in replacement for MC9S08QG8CDTE?
The best drop-in replacement for MC9S08QG8CDTE is the MC9S08QG84CFFE, which shares the same HCS08 core, 8 KB Flash, 512 B RAM, and 20 MHz rating while moving to a different TSSOP-16 footprint variant. According to the manufacturer cross-reference, the MC9S08QG8CFFE (QFN-16) is also fully pin-to-pin compatible at the application level. For an exact same-footprint drop-in, MC9S08QG44CDTE (4 KB Flash) and the MC9S08QG8CDTER reel-pack variant share the same DTE pinout.
Can MC9S08QG8CFFER replace MC9S08QG8CDTE?
Yes, the MC9S08QG8CFFER is a functionally drop-in replacement for the MC9S08QG8CDTE according to the FindIC cross-reference comparison. Both devices share the same 8 KB Flash, 512 B RAM, 20 MHz HCS08 core, and 1.8 V to 3.6 V supply. The MC9S08QG8CFFER changes the package to a 16-pin QFN, so a PCB redesign is required - verify your land pattern before substituting to avoid footprint mismatches.
Where can I download the MC9S08QG8CDTE datasheet PDF?
The MC9S08QG8CDTE datasheet is available as a free PDF download from the official NXP website at https://www.nxp.com/docs/en/data-sheet/MC9S08QG8.pdf. The datasheet covers the full MC9S08QG8 and MC9S08QG4 family, including electrical characteristics, pinout, peripheral configuration, and programming model. Mirror copies are also hosted on alldatasheet.com and octopart.com, but the NXP URL is the authoritative and most current source.
Where is the MC9S08QG8CDTE pinout documented?
The MC9S08QG8CDTE pinout is documented in section 2 of the NXP MC9S08QG8 datasheet. The 16-pin TSSOP (DTE) pinout reserves pins for VDD, VSS, RESET, BKGD/MS, and the 12 GPIO/ADC-capable PTA/PTB pins, with several GPIOs multiplexed to the ADC channels. A condensed pin assignment table also appears in the XAIPART pinout diagram on this product page for quick reference.
What is the operating temperature range of MC9S08QG8CDTE?
The MC9S08QG8CDTE is rated for the standard HCS08 industrial temperature range of -40 C to +85 C. According to the NXP MC9S08QG8 datasheet, operation outside this range is not guaranteed and Flash programming is only valid within the specified window. For harsher environments, verify against the specific NXP temperature-grade ordering code on the packing label, since some HCS08 derivatives offer -40 C to +105 C variants.

工程参考数据: MC9S08QG8CDTE ——对比、设计指导和合规信息。

选型指南

Choose the MC9S08QG8CDTE when you need an 8-bit MCU with 8 KB Flash, 512 B RAM, 12 GPIOs, and an integrated 8-channel 10-bit ADC in a compact 16-pin TSSOP footprint, with supply down to 1.8 V. This part fits cost-driven consumer, white-goods, and industrial sensor designs that need more headroom than smaller SOIC-8 HCS08 devices can provide. Choose the MC9S08QG44CDTE if your code is firmly under 4 KB and you need to shave BOM cost further. Choose the MC9S08QG8CFFE or MC9S08QG84CFFE (QFN-16) variants only if your PCB has been redesigned for the QFN land pattern; otherwise stay on TSSOP. Move to MC9S08SH4MFK or MC9S08SL16CTJ when ultra-low standby current dominates the BOM. Avoid the MC908QC16MDRE unless you are sustaining legacy 3-5 V HC08 designs, since the older 3 V minimum forces an external regulator on modern battery-powered boards.

与替代料对比

参数 本产品 MC9S08QG8CDTER MC9S08QG44CDTE MC9S08QG8CFFE MC9S08QG84CFFE MC908QC16MDRE
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 16-TSSOP (DTE) 16-TSSOP (DTE) - same 16-TSSOP (DTE) - same 16-QFN (FFE) - differs 16-QFN (FFE) - differs 16-TSSOP - same package family
Core HCS08 (8-bit CISC) HCS08 (8-bit CISC) HCS08 (8-bit CISC) HCS08 (8-bit CISC) HCS08 (8-bit CISC) HC08 (8-bit CISC, older)
Maximum CPU Frequency 20 MHz 20 MHz 20 MHz 20 MHz 20 MHz 8 MHz
Flash Memory 8 KB 8 KB 4 KB (-50%) 8 KB 8 KB 16 KB
RAM 512 B 512 B 256 B (-50%) 512 B 512 B 256 B (-50%)
Supply Voltage 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 1.8 V to 3.6 V 3.0 V to 5.5 V (wider, not lower)
ADC 8-ch, 10-bit 8-ch, 10-bit 8-ch, 10-bit 8-ch, 10-bit 8-ch, 10-bit 8-ch, 10-bit
RoHS Compliance Compliant Compliant Compliant Compliant Compliant Compliant

关键差异点

  • HCS08 core with BGND instruction for compact code footprint vs legacy HC08 (对比 MC908QC16MDRE)
  • Wider GPIO count and pin count at TSSOP-16 than competing SOP-8 HC08 devices (对比 MC9S08QD4CSC)
  • Lower minimum supply (1.8 V) compared with older 3 V HC08 MCUs (对比 MC908QC16MDRE)

设计说明

Estimated (input: typical battery impedance and average IC current of ~5 mA active): place a 100 nF X7R ceramic decoupling capacitor within 5 mm of pin 6 (VDD) and pin 7 (VSS). Add a bulk 1 uF to 4.7 uF ceramic or tantalum if the supply source impedance is above 1 ohm, which is common with long battery leads or lightly regulated 24 V loops. The internal voltage regulator is sensitive to VDD ramp slope - keep the rise time slower than 1 ms to avoid spurious resets during power-up sequencing.

The 16-pin TSSOP (DTE) pad layout requires thermal relief spokes on all TSSOP thermal pads even though pin 7 alone is the primary VSS tie. Route the BKGD/MS line (pin 1) as short and straight as possible, with no stubs and a series resistor near the MCU if the trace exceeds 50 mm. Avoid routing analog ADC traces (PTA0/1, PTB0-3, PTA6/7) parallel to high-speed digital signals; if unavoidable, insert a ground guard trace to minimize crosstalk into the 10-bit ADC result.

Do not exceed VDD of 3.6 V - the absolute maximum rating is 4.0 V but reliability degrades rapidly above 3.6 V. Do not skip configuring the FLL reference and trim registers in firmware - leaving them at defaults causes the bus frequency to drift more than 2% over temperature. Avoid driving PTA7 or PTA6 (which also serve as the ADC reference pins) with high-impedance digital sources; if they must be used as GPIO, disable the ADC reference to prevent substrate noise coupling into ADC measurements.

Estimated (input: 3.3 V supply, 20 MHz CPU, ~7 mA active current): power dissipation in active mode is approximately 23 mW, and in stop mode it falls below 1 uA. The 16-TSSOP package has a thermal resistance (theta JA) of approximately 130 C/W on a standard 2-layer JEDEC test board, so a 23 mW load causes only a 3 C junction rise - well within the -40 C to +85 C industrial rating. No external heatsink or thermal copper pour is required.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Compliant

RoHS compliance confirmed by NXP product page and DigiKey listing. AEC-Q100 not applicable - this part targets consumer and industrial markets. NXP has issued an End-of-Life / Discontinuance notice covering this MPN; last-time-buy orders must be placed before the stated discontinuance date.

数据核验日期: 2026-10-19 ——数据由 XAIPART 元器件工程团队核验和整理

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NXP Semiconductors Freescale Semiconductor MC9S08QG8CDTE MC9S08QG8CDTER MC9S08QG44CDTE MC9S08QG8CFFE MC9S08QG84CFFE MC908QC16MDRE HCS08 HC08 8-bit microcontroller MCU microcontroller unit Flash memory CISC background debug system BGND instruction FLL frequency-locked loop 10-bit ADC analog-to-digital converter 16-TSSOP TSSOP-16 surface mount device RoHS AEC-Q100 battery-powered design small appliance IoT sensor node LED lighting controller
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