MC9S08SH8MFK - HCS08 8-bit MCU, 8KB Flash, QFN-24 | NXP
料号： MC9S08SH8MFK ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1 | $1.00 |
| 10 | $0.95 | $9.50 |
| 100 | $0.88 | $88.00 |
| 500 | $0.8 | $400.00 |
| 1,000 | $0.72 | $720.00 |
MC9S08SH8MFK 概述
An 8-bit microcontroller is a single-chip computer that integrates a processor core, program flash, RAM, and peripheral modules such as timers, serial interfaces, and analog converters on one die. Within the semiconductor hierarchy it sits under the microcontroller family, itself a branch of embedded processors, and is widely used where cost, low pin count, and reliability matter more than raw processing power.
Key features of the MC9S08SH8 family include the enhanced HCS08 CPU core, on-chip flash memory with in-circuit programming, low-voltage detection (LVD) for supply monitoring, and serial communication peripherals including SPI, as confirmed by distributor listings for this part. The compact 24-terminal no-lead QFN package saves board space while the exposed die-attach pad improves thermal and electrical performance.
The HCS08 architecture executes efficient 8-bit code with a rich instruction set and background debugging via a single-wire BDM interface, simplifying development without costly emulators. The LVD module protects against brown-out conditions, and internal oscillator options reduce external component count.
Typical applications include automotive body electronics, small motor control, sensor interfacing, battery chargers, and industrial control nodes where an SPI-linked MCU in a small footprint is required.
A key design consideration is flash memory headroom: at 8 KB, firmware size should be planned carefully, and larger family members (SH16/SH32) provide upgrade paths in the same package family.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： MC9S08SH8MFK ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MC9S08SH8MFK （相同外形与封装尺寸）.
快速对比工具——选择替代料号进行并排对比：
MC9S08SH4MFK
✅ 直接替换✓ 有现货
$2.15 / 个
查看数据手册 →MC9S08SH16MFK
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S08SH32MFK
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MC9S08SH8MTG
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$1.55 / 个
查看数据手册 →MC9S08SH8MFK 最大额定值与电气特性
| Core Processor | HCS08 (8-bit) |
| Flash Memory | 8 KB |
| 封装 | 24-pin QFN (HVQCCN), square, no-lead |
| Number of Terminals | 24 |
| Package Shape | Square |
| Terminal Form | No Lead |
| 工作温度 | -40C to +125C |
| Temperature Grade | Automotive |
| Special Features | Low Voltage Detect (LVD) |
| Communication Interfaces | SPI |
| 安装类型 | Surface Mount |
| Family | MC9S08SH8 (HCS08 Family) |
MC9S08SH8MFK square 引脚配置指南
MC9S08SH8MFK（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MC9S08SH8MFK.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MC9S08SH8MFK 适用于 6 应用s: Automotive Body Electronics, Small Motor and Fan Control, Sensor Interface Nodes, Battery Chargers and Power Management Helpers, Industrial Control and Actuator Nodes, Appliances and Consumer Control Boards.
Automotive Body Electronics
The MC9S08SH8MFK fits automotive body control nodes because its -40C to +125C automotive temperature grade tolerates cabin and near-engine environments, and its low-voltage detection guards against 12 V battery transients and cold-crank brown-outs. In a typical lamp or relay control module, the HCS08 core drives GPIO outputs through a high-side driver while the SPI bus links to diagnostic or watchdog devices. The 24-pin QFN no-lead package keeps the PCB compact enough for lamp housings and door modules. Its low cost (about $1.00) supports high-volume automotive builds where BOM pressure is intense.
推荐
Small Motor and Fan Control
For small DC or stepper motor control, the MC9S08SH8MFK provides an HCS08 core with timer modules to generate PWM signals at 8-bit resolution sufficient for speed and duty-cycle control of fans, pumps, and actuators. The -40C to +125C rating suits motor pods and fan trays where ambient temperature rises during operation. The MCU reads Hall or tachometer feedback on GPIO/counter inputs, closes a speed loop in firmware, and communicates status over SPI to a host controller. The 8 KB flash accommodates commutation, PWM, fault handling, and a simple command protocol within a small, low-cost footprint.
推荐
Sensor Interface Nodes
The MC9S08SH8MFK serves as a compact sensor acquisition node: its SPI interface streams readings from external ADCs or digital sensors, while low-voltage detection flags supply anomalies during sampling. In distributed industrial monitoring, one 24-pin QFN MCU per node digitizes temperature, pressure, or position sensors and forwards calibrated data over SPI/UART links, keeping the local loop deterministic. The -40C to +125C automotive range permits mounting near hot machinery or engine compartments. At roughly $1.00 per unit, deploying many MCU-per-sensor nodes is economically viable compared with one large MCU and long analog wiring.
推荐
Battery Chargers and Power Management Helpers
In battery charging systems, the MC9S08SH8MFK supervises charge state: timer modules implement phase timing, ADC/external monitor inputs track voltage and current, and low-voltage detection protects against supply dips. The MCU modulates a PWM output that drives the charger power stage, implements termination criteria in firmware, and reports status via SPI to a display or host. The -40C to +125C automotive grade covers vehicle chargers and outdoor equipment where charging electronics sit in hot enclosures. The 8 KB flash is ample for state machines for Li-ion, NiMH, or lead-acid charging algorithms plus fault logging.
推荐
Industrial Control and Actuator Nodes
On factory floors, the MC9S08SH8MFK acts as a low-cost distributed control node reading switches and sensors, sequencing relays and actuators through GPIO, and exchanging setpoints with a PLC-grade host over SPI-linked fieldbus transceivers. The extended -40C to +125C operation survives panel and machine enclosures, while low-voltage detection enables orderly shutdown during power anomalies. The enhanced HCS08 core executes control loops and protocol stacks comfortably within 8 KB of flash. The 24-pin QFN no-lead package reduces PCB area in dense I/O cards, and the single-wire background debug interface allows in-field firmware updates without removing the board.
推荐
Appliances and Consumer Control Boards
In white goods and small appliances, the MC9S08SH8MFK implements user interfaces, timer sequencing, and simple closed-loop control: the HCS08 core scans buttons, drives LED or LCD indication, times heating elements via PWM, and supervises door locks and safety switches. The -40C to +125C range handles oven-adjacent and compressor-compartment environments, and low-voltage detection maintains safe behavior during mains sags. Its approximately $1.00 cost point and 24-pin QFN footprint allow tight, two-layer control boards at consumer price targets. SPI links rotary encoders, EEPROMs for user settings, or external display drivers as needed.
推荐
推荐产品汇总
工程参考数据： MC9S08SH8MFK ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MC9S08SH4MFK | MC9S08SH16MFK | MC9S08SH32MFK |
|---|---|---|---|---|
| Package | 24-pin QFN (MFK) | 24-pin QFN (MFK) - same | 24-pin QFN (MFK) - same | 24-pin QFN (MFK) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit | HCS08 8-bit |
| Flash Memory | 8 KB | 4 KB | 16 KB | 32 KB |
| Operating Temperature | -40C to +125C (automotive) | -40C to +125C | -40C to +125C | -40C to +125C |
| SPI Interface | Yes | Yes | Yes | Yes |
| Low Voltage Detect | Yes | Yes | Yes | Yes |
| Relative Cost | Medium (~$1.00 qty 1) | Lowest in family | Moderately higher | Highest in family |
关键差异点
- 8 KB flash - middle of the SH family （对比 MC9S08SH4MFK)
- Automotive temperature grade in a compact no-lead package （对比 MC9S08SH16MFK)
- Mature HCS08 ecosystem with single-wire debug （对比 MC9S08SH32MFK)
设计说明
The 24-pin QFN (HVQCCN) no-lead package requires a well-defined land pattern with an exposed center pad. Connect the center pad to a grounded copper pour with an array of thermal vias (typically 4-6, 0.3 mm drill) to improve heat dissipation and anchor the die. Use the package-migration addendum on the NXP MC9S08SH8 datasheet page, since the SH8 family transitioned to a new QFN footprint - verify your footprint revision before ordering stencils, as old and new QFN land patterns may differ.
Apply standard HCS08 supply practice: a 0.1 uF ceramic decoupling capacitor placed within 5 mm of the VDD/VSS pair, plus a bulk 4.7-10 uF capacitor near the module supply entry. The integrated low-voltage detect (LVD) resets the MCU during brown-outs, but ensure the supply ramp is monotonic so reset release is clean. Estimated: at typical HCS08 run currents in the low-mA range, dissipation is negligible and no heatsinking is needed beyond the ground pour.
Budget flash carefully: 8 KB holds a control loop, SPI driver, and a small protocol, but not a full protocol stack plus bootloader. Plan for the MC9S08SH16MFK/SH32MFK as foot-compatible upgrades if code size may grow. When swapping from SH8 to SH4, verify vector table and flash page sizes differ. Always program the security byte settings per the reference manual before mass production to avoid locking devices during in-circuit programming.
合规信息
Distributor data classifies the part as AUTOMOTIVE temperature grade; formal AEC-Q100 and RoHS/REACH compliance statuses were not stated in the provided web data - verify on the NXP product page.
