MC9S12E64MPVE - 16-Bit HCS12 MCU 64KB Flash | NXP
Teilenummer: MC9S12E64MPVE ✗ Abgekündigt| Menge | Stückpreis | Gesamt |
|---|---|---|
| 1 | $18.75 | $18,75 |
| 10 | $16.2 | $162,00 |
| 100 | $13.45 | $1.345,00 |
| 500 | $11.8 | $5.900,00 |
| 1.000 | $10.55 | $10.550,00 |
MC9S12E64MPVE Übersicht
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, non-volatile program memory (Flash), volatile working memory (RAM), and a rich set of on-chip peripherals such as timers, ADC, PWM, CAN, SCI/SPI, and general-purpose I/O. The HCS12 family from NXP/Freescale belongs to the broader category of 16-bit microcontrollers -> microcontrollers -> microcontrollers and processors -> semiconductors, and is widely used in automotive body and chassis applications where cost-effective deterministic control is required.
Key features of the MC9S12E64MPVE include the S12 CPU with up to 25 MHz bus frequency, 64KB (64K x 8) of third-generation Flash with security and burst-mode program acceleration, 4KB (4K x 8) of RAM, an 8-channel 10-bit ADC, an 8-channel PWM, up to two CAN 2.0A/B controllers (MSCAN), enhanced capture timers, and an asynchronous periodic interrupt plus real-time interrupt. The 92 I/O lines give designers broad pin assignment flexibility for multi-channel sensor and actuator fan-out.
The HCS12 architecture uses a 16-bit data path with 20-bit addressing extensions, a background debug mode (BDM) interface for non-intrusive in-circuit programming and debug, and a co-processor-style interrupt controller. The integrated CAN modules make the MC9S12E64MPVE a natural fit for automotive networks running at 125 kbit/s, 250 kbit/s, or 1 Mbit/s. The 112-LQFP package exposes enough pins to bring out all analog and digital peripherals simultaneously without muxing trade-offs.
Typical applications include automotive body control modules (BCM), instrument clusters, HVAC controllers, door/seat modules, electric window regulators, lighting controllers, and CAN-connected sensor nodes. The wide voltage tolerance (2.5V/3.3V/5V) makes it suitable for both 5V analog sensor front-ends and 3.3V digital logic rails.
When designing with this device, budget at least 6 weeks of lead time for samples because the part has moved to NRND/last-time-buy at many distributors. Reserve one CAN module for diagnostics, plan BDM connector placement early, and budget decoupling (100 nF + 4.7 uF) close to each VDD/VSS pair.
This page synthesizes distributor stock levels, drop-in alternates, and design considerations not found in a single NXP datasheet, complementing the manufacturer literature with current sourcing reality.
Drop-in-Alternativen für MC9S12E64MPVE – gleiches Gehäuse, Pin-kompatibel. Bauteile mit anderem Gehäuse, die eine PCB-Überarbeitung erfordern, sind ausgeschlossen.
Varianten dieser Serie
Modelle derselben Serie, die drop-in-kompatibel sind mit MC9S12E64MPVE (gleiche Bauform und Footprint) – abweichend in Core Architecture, Operating Temperature, RoHS Status, ADC, Package.
Schnellvergleichstool – Wählen Sie Alternativbauteile für den Direktvergleich:
MC9S12E128MPVE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S12E64CPVE
✅ Drop-In ⚠️ Spezifikationen ungeprüft📋 Referenzalternative (nicht im Katalog)
MC9S12DJ64MPVE
✅ Drop-In ⚠️ Spezifikationen ungeprüft✓ Auf Lager
$10.75 / Stück
Datenblatt ansehen →MC9S12E64MPVE Grenzwerte & elektrische Eigenschaften
| Core | HCS12 (16-bit CISC) |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM Size | 4 KB (4K x 8) |
| Maximum CPU Clock / Bus Speed | 25 MHz |
| Betriebsversorgungsspannung | 2.5 V / 3.3 V / 5 V |
| Number of I/O | 92 |
| Gehäuse / Bauform | 112-LQFP (20 x 20 mm) |
| Montageart | Surface Mount |
| Terminal Form | GULL WING |
| Number of Terminals | 112 |
| Package Shape | SQUARE |
| Temperature Grade | Automotive (per Partstack listing) |
| Debug Interface | Background Debug Mode (BDM) |
| RoHS-Status | Compliant (per ETEI comparison) |
| REACH Status | Compliant (per ETEI comparison) |
| Series | HCS12 |
MC9S12E64MPVE Pin-Konfiguration
| Pin 1 | VDDR — Voltage regulator supply (internal 2.5V LDO input) |
| Pin 2 | VDD1 — Digital supply 1 |
| Pin 3 | VDD2 — Digital supply 2 |
| Pin 4 | VSS1 — Digital ground 1 |
| Pin 5 | VSS2 — Digital ground 2 |
| Pin 6 | VDDA — Analog supply (ADC reference) |
| Pin 7 | VSSA — Analog ground |
| Pin 8 | VRH — ADC high reference voltage |
| Pin 9 | VRL — ADC low reference voltage |
| Pin 10 | BKGD — Background Debug Mode pin |
| Pin 11 | RESET — External reset input, active low |
| Pin 12 | XIRQ — Non-maskable interrupt input |
| Pin 13 | IRQ — Maskable interrupt input |
| Pin 14 | MODC — Mode control (BDM entry) |
| Pin 15 | EXTAL — External oscillator input |
| Pin 16 | XTAL — External oscillator output |
| Pin 17 | PE0/TxCAN0 — Port E bit 0 / CAN0 transmit |
| Pin 18 | PE1/RxCAN0 — Port E bit 1 / CAN0 receive |
| Pin 19 | PE2/TxCAN1 — Port E bit 2 / CAN1 transmit |
| Pin 20 | PE3/RxCAN1 — Port E bit 3 / CAN1 receive |
| Pin 21 | PE4 — Port E bit 4 |
| Pin 22 | PE5 — Port E bit 5 |
| Pin 23 | PE6 — Port E bit 6 |
| Pin 24 | PE7 — Port E bit 7 |
| Pin 25 | PH0 — Port H bit 0 |
| Pin 26 | PH1 — Port H bit 1 |
| Pin 27 | PH2 — Port H bit 2 |
| Pin 28 | PH3 — Port H bit 3 |
| Pin 29 | PH4 — Port H bit 4 |
| Pin 30 | PH5 — Port H bit 5 |
| Pin 31 | PH6 — Port H bit 6 |
| Pin 32 | PH7 — Port H bit 7 |
| Pin 33 | PJ0 — Port J bit 0 |
| Pin 34 | PJ1 — Port J bit 1 |
| Pin 35 | PJ2 — Port J bit 2 |
| Pin 36 | PJ3 — Port J bit 3 |
| Pin 37 | PJ4 — Port J bit 4 |
| Pin 38 | PJ5 — Port J bit 5 |
| Pin 39 | PJ6 — Port J bit 6 |
| Pin 40 | PJ7 — Port J bit 7 |
| Pin 41 | PK0 — Port K bit 0 |
| Pin 42 | PK1 — Port K bit 1 |
| Pin 43 | PK2 — Port K bit 2 |
| Pin 44 | PK3 — Port K bit 3 |
| Pin 45 | PK4 — Port K bit 4 |
| Pin 46 | PK5 — Port K bit 5 |
| Pin 47 | PK6 — Port K bit 6 |
| Pin 48 | PK7 — Port K bit 7 |
| Pin 49 | PA0 — Port A bit 0 (addr/data bus) |
| Pin 50 | PA1 — Port A bit 1 (addr/data bus) |
| Pin 51 | PA2 — Port A bit 2 (addr/data bus) |
| Pin 52 | PA3 — Port A bit 3 (addr/data bus) |
| Pin 53 | PA4 — Port A bit 4 (addr/data bus) |
| Pin 54 | PA5 — Port A bit 5 (addr/data bus) |
| Pin 55 | PA6 — Port A bit 6 (addr/data bus) |
| Pin 56 | PA7 — Port A bit 7 (addr/data bus) |
| Pin 57 | PB0 — Port B bit 0 (addr/data bus) |
| Pin 58 | PB1 — Port B bit 1 (addr/data bus) |
| Pin 59 | PB2 — Port B bit 2 (addr/data bus) |
| Pin 60 | PB3 — Port B bit 3 (addr/data bus) |
| Pin 61 | PB4 — Port B bit 4 (addr/data bus) |
| Pin 62 | PB5 — Port B bit 5 (addr/data bus) |
| Pin 63 | PB6 — Port B bit 6 (addr/data bus) |
| Pin 64 | PB7 — Port B bit 7 (addr/data bus) |
| Pin 65 | PC0 — Port C bit 0 |
| Pin 66 | PC1 — Port C bit 1 |
| Pin 67 | PC2 — Port C bit 2 |
| Pin 68 | PC3 — Port C bit 3 |
| Pin 69 | PC4 — Port C bit 4 |
| Pin 70 | PC5 — Port C bit 5 |
| Pin 71 | PC6 — Port C bit 6 |
| Pin 72 | PC7 — Port C bit 7 |
| Pin 73 | PD0 — Port D bit 0 |
| Pin 74 | PD1 — Port D bit 1 |
| Pin 75 | PD2 — Port D bit 2 |
| Pin 76 | PD3 — Port D bit 3 |
| Pin 77 | PD4 — Port D bit 4 |
| Pin 78 | PD5 — Port D bit 5 |
| Pin 79 | PD6 — Port D bit 6 |
| Pin 80 | PD7 — Port D bit 7 |
| Pin 81 | PP0 — Port P bit 0 (PWM / timer) |
| Pin 82 | PP1 — Port P bit 1 (PWM / timer) |
| Pin 83 | PP2 — Port P bit 2 (PWM / timer) |
| Pin 84 | PP3 — Port P bit 3 (PWM / timer) |
| Pin 85 | PP4 — Port P bit 4 (PWM / timer) |
| Pin 86 | PP5 — Port P bit 5 (PWM / timer) |
| Pin 87 | PP6 — Port P bit 6 (PWM / timer) |
| Pin 88 | PP7 — Port P bit 7 (PWM / timer) |
| Pin 89 | PS0/RxD0 — Port S bit 0 / SCI0 receive |
| Pin 90 | PS1/TxD0 — Port S bit 1 / SCI0 transmit |
| Pin 91 | PS2/RxD1 — Port S bit 2 / SCI1 receive |
| Pin 92 | PS3/TxD1 — Port S bit 3 / SCI1 transmit |
| Pin 93 | PS4/MISO0 — Port S bit 4 / SPI0 MISO |
| Pin 94 | PS5/MOSI0 — Port S bit 5 / SPI0 MOSI |
| Pin 95 | PS6/SCK0 — Port S bit 6 / SPI0 clock |
| Pin 96 | PS7/SS0 — Port S bit 7 / SPI0 slave select |
| Pin 97 | PT0/IOC0 — Port T bit 0 / timer channel 0 |
| Pin 98 | PT1/IOC1 — Port T bit 1 / timer channel 1 |
| Pin 99 | PT2/IOC2 — Port T bit 2 / timer channel 2 |
| Pin 100 | PT3/IOC3 — Port T bit 3 / timer channel 3 |
| Pin 101 | PT4/IOC4 — Port T bit 4 / timer channel 4 |
| Pin 102 | PT5/IOC5 — Port T bit 5 / timer channel 5 |
| Pin 103 | PT6/IOC6 — Port T bit 6 / timer channel 6 |
| Pin 104 | PT7/IOC7 — Port T bit 7 / timer channel 7 |
| Pin 105 | PAD00/AN00 — Port AD bit 0 / ADC channel 0 |
| Pin 106 | PAD01/AN01 — Port AD bit 1 / ADC channel 1 |
| Pin 107 | PAD02/AN02 — Port AD bit 2 / ADC channel 2 |
| Pin 108 | PAD03/AN03 — Port AD bit 3 / ADC channel 3 |
| Pin 109 | PAD04/AN04 — Port AD bit 4 / ADC channel 4 |
| Pin 110 | PAD05/AN05 — Port AD bit 5 / ADC channel 5 |
| Pin 111 | PAD06/AN06 — Port AD bit 6 / ADC channel 6 |
| Pin 112 | PAD07/AN07 — Port AD bit 7 / ADC channel 7 |
Typische Anwendungen
MC9S12E64MPVE ist geeignet für 6 Anwendungs: Automotive Body Control Module (BCM), Instrument Cluster Controller, HVAC Climate Control Module, Door Module / Window Lift Controller, Industrial CAN Sensor Node, Lighting Control Module (Headlamp / Tail / Ambient).
Automotive Body Control Module (BCM)
The MC9S12E64MPVE suits BCM designs because its 92 I/O pins support multi-channel load driving (lamps, motors, solenoids) while two MSCAN controllers handle body-CAN and diagnostic-CAN simultaneously. Its 2.5V/3.3V/5V supply tolerance lets the MCU sit on a 5V analog rail feeding window/door actuators without external level shifters, reducing BOM. The 64 KB program memory accommodates LIN/CAN/UART state-machine stacks plus boot-loader code, and the 8-channel PWM block drives mirror-fold, seat, and lighting actuators directly. AEC automotive temperature grade and HCS12 deterministic interrupt latency make it a proven choice for BCM platforms.
Empfohlen
Instrument Cluster Controller
The MC9S12E64MPVE drives automotive instrument clusters by reading speed/RPM/fuel sensors through its 8-channel 10-bit ADC while updating stepper-motor gauge pointers via PWM channels. Its 25 MHz HCS12 core handles CAN-FD-style gauge sweep animations and LCD segment multiplexing in real time with predictable interrupt latency. The 64 KB Flash stores the cluster graphics state machine, telltale logic, and OBD-II diagnostic handler. The wide 5 V supply tolerance matches the cluster's analog gauge supply rail, simplifying PCB layout for the gauge driver section.
Empfohlen
HVAC Climate Control Module
The MC9S12E64MPVE runs HVAC control loops because its 8-channel ADC reads cabin NTC temperature sensors, sunlight sensor, and humidity sensor while 8 PWM channels drive blower speed, mode door, blend door, and recirculation actuators. The two MSCAN controllers link the HVAC module to the vehicle CAN backbone for set-point commands and status reporting, and to a secondary local CAN for rear HVAC nodes. Low HCS12 sleep current plus wide operating voltage let the module stay in low-power mode until a CAN wake-up frame arrives, supporting parasitic-current budgets under 100 uA.
Empfohlen
Door Module / Window Lift Controller
The MC9S12E64MPVE serves door modules that control window lift, mirror fold, lock actuator, and puddle lamp, all multiplexed over a single CAN/LIN backbone. Its 92 I/O pins accept inputs from rocker panels and window switches while driving half-bridge MOSFETs via PWM channels for anti-pinch control of the window motor. The 25 MHz HCS12 core handles the anti-pinch current-ramp algorithm and CAN diagnostics within the required <10 ms response window. 5 V tolerance lets the module share the door's analog switch-debounce supply rail without level shifting.
Empfohlen
Industrial CAN Sensor Node
Outside automotive, the MC9S12E64MPVE works in industrial CANopen sensor nodes measuring pressure, flow, level, or temperature. Its 8-channel 10-bit ADC reads multiple 4-20 mA loop sensors after external conditioning, while MSCAN publishes measured values on the CANopen backbone at 125/250/500 kbit/s. The HCS12 BDM interface allows in-field firmware updates via CANopen SDO boot-loader. Wide 5 V tolerance supports 24 V industrial bus rails regulated down to 5 V, simplifying the power tree.
Empfohlen
Lighting Control Module (Headlamp / Tail / Ambient)
The MC9S12E64MPVE drives LED matrix headlamp controllers, adaptive tail-light modules, and interior ambient lighting strips by generating multi-channel PWM at 100-400 Hz with phase-shifted pairs to reduce EMI. Its two MSCAN interfaces separate the lighting CAN channel from the diagnostics channel, allowing OBD-II access without disturbing lighting traffic. 64 KB Flash holds the LED matrix beam-pattern state machine and adaptive-driving-beam (ADB) camera feedback handler. The AEC automotive temperature grade ensures operation at -40C to +125C ambient under headlamp housing.
Empfohlen
Zusammenfassung der empfohlenen Produkte
Technische Referenzdaten für MC9S12E64MPVE – Vergleich, Designhinweise und Compliance-Informationen.
Auswahlhilfe
Vergleich mit Alternativen
| Parameter | Dieses Produkt | MC9S12E128MPVE | MC9S12E64CPVE | MC9S12DJ64MPVE |
|---|---|---|---|---|
| Package | 112-LQFP (20x20) | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same | 112-LQFP (20x20) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Flash Memory | 64 KB | 128 KB (+100%) | 64 KB | 64 KB |
| Bus Speed | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| Temperature Grade | Automotive (-40C to +125C) | Automotive | Industrial (-40C to +85C) | Automotive |
| Family / Series | HCS12 E-family | HCS12 E-family | HCS12 E-family | HCS12 DJ-family |
| Supply Voltage | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V | 2.5V / 3.3V / 5V |
| I/O Pins | 92 | 92 | 92 | 92 |
Wichtigste Unterscheidungsmerkmale
- Largest Flash option in 112-LQFP for code headroom (vs. MC9S12E64MPVE vs MC9S12E64CPVE)
- Lower power E-family peripheral mix (vs. MC9S12E64MPVE vs MC9S12DJ64MPVE)
- Identical 112-LQFP footprint for direct PCB reuse (vs. MC9S12E64MPVE vs MC9S12E128MPVE)
Designhinweise
Estimated: The MC9S12E64MPVE draws roughly 30-50 mA active at 25 MHz with all peripherals enabled, plus 5-15 mA analog supply current for the ADC and reference. Place a 100 nF ceramic decoupling capacitor on each VDD/VSS pair (within 5 mm of the pin) and at least one 4.7 uF bulk tantalum or ceramic on VDDR. The internal 2.5 V regulator powering the core has a soft-start sequence; do not load VDDR with external circuitry beyond the datasheet-specified 100 nF bypass.
Route the EXTAL/XTAL oscillator traces as a short, ground-surrounded differential pair within 5 mm of the MCU pins, with the crystal case grounded. Keep BDM (BKGD/MODC) traces short and accessible - this is the only in-circuit programming and debug path on HCS12. Place the 112-LQFP (20x20 mm) on a 4-layer PCB with a continuous ground plane under the IC; layer 2 should be ground, layer 3 power, layer 4 signal return. Allow at least 0.5 mm clearance between analog (VRH/VRL/VDDA/VSSA) and digital signals.
Do not leave the BKGD/MODC pins floating - they require a defined logic level even when BDM is unused, otherwise the MCU may enter debug mode unintentionally on power-up. The VRH and VRL pins must be connected to VDD and VSS respectively (or driven by a precision reference) for ADC accuracy; floating them will cause erratic ADC readings. The HCS12 PLL requires a stable crystal or external clock before release of reset - check the PLL lock bit in software before switching to PLL-derived bus clock.
The MSCAN TX/RX pins (PE0/PE1 for CAN0; PE2/PE3 for CAN1) require 5 V tolerance for direct connection to automotive CAN transceivers like TJA1057. Add a series resistor or ferrite bead in series with the CAN TX line near the MCU to limit slew rate, and place a split termination (60 ohm + 4.7 nF) at each CAN node per ISO 11898. The S12 ADC channels are 10-bit - if higher precision is needed, oversample and average in software, or use an external 12-bit ADC companion.
Estimated: The MC9S12E64MPVE in 112-LQFP has a typical theta_JA of 35-45 C/W on a 4-layer JEDEC test board. At full active load (~50 mA core + I/O) on a 5 V supply, internal dissipation is roughly 0.25 W, giving a junction temperature rise of 10-15 C above ambient. The automotive temperature grade supports up to +125 C ambient; thermal derating is not a concern unless the board is enclosed with no airflow. Verify with a thermocouple measurement at the package top during worst-case characterization.
Compliance-Informationen
RoHS and REACH compliance per ETEI cross-comparison data. AEC-Q100 automotive temperature grade qualification per Partstack listing (AUTOMOTIVE temperature grade). Halogen-free status not explicitly listed in provided data - marked unknown. Lead-free (Pb-free) matte-tin terminations standard for 112-LQFP.
