NXP Semiconductors

MC9S12GC96MPBE - 16-Bit 25MHz 96KB Flash HCS12 MCU | NXP

料号: MC9S12GC96MPBE ✓ 量产中
有现货 1-3 个工作日内发货
2.35 V to 2.75 V (3.3 V typical) Vdss 52-LQFP / 52-TQFP (10x10 mm) Package 25 MHz Speed 96 KB (96K x 8) Memory
低至 $6.05 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-17
批量定价
数量 单价 小计
1 $10.65 $10.65
10 $9.85 $98.50
100 $8.42 $842.00
500 $7.18 $3,590.00
1,000 $6.05 $6,050.00
ℹ️ 所有价格均以 USD 计价

MC9S12GC96MPBE 概述

The NXP MC9S12GC96MPBE is a 16-bit HCS12 microcontroller featuring 96KB of on-chip Flash memory and a 25MHz bus clock, housed in a 52-pin LQFP (10x10 mm) package. It integrates the HCS12 CPU core with background debug mode (BDM), 4KB RAM, 1KB EEPROM, and a rich peripheral set including a 16-channel 10-bit ADC, multiple timers, SPI/SCI/I2C communication interfaces, and a CAN 2.0 A/B controller for industrial and automotive networking.

A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash for code, RAM for data, EEPROM for non-volatile parameters), and programmable I/O peripherals. The HCS12 belongs to the 16-bit MCU family in the broader hierarchy of microcontrollers -> embedded processors -> semiconductors, designed for deterministic real-time control in cost-sensitive embedded applications.

Key features include 60 general-purpose I/O lines, an enhanced capture timer (ECT) module with 8 channels, an 8-channel pulse-width modulator (PWM), and a supply voltage range of 2.35V to 2.75V (3.3V typical). The device supports in-circuit programming and in-application programming via the BDM interface, allowing firmware updates without removing the chip from the board.

The architecture uses a 16-bit HCS12 core with a 25 MHz bus clock delivering approximately 25 MIPS, paired with a peripheral coprocessor bus that offloads ADC, timer, and communication tasks from the CPU. The integrated CAN 2.0 controller and SCI/SPI make it well suited for industrial automation nodes that must bridge sensor networks to higher-level controllers.

Typical applications include industrial control nodes, automotive body electronics, CAN-based sensor hubs, motor control boards, and consumer appliance controllers. The 10-bit ADC and PWM modules support direct interfacing with analog sensors and brushed DC or stepper motor drive stages.

Design tip: provide a clean 3.3V analog supply (AVDD) decoupled with 100 nF and 10 uF ceramic capacitors placed within 5 mm of the AVDD pin to preserve ADC accuracy; route digital return currents away from the analog ground reference.

This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.

直接替换替代料: MC9S12GC96MPBE ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MC9S12GC96MPBE (相同外形与封装尺寸) ——差异在于 Package, Core Processor, Lifecycle Status, Core, Flash Memory.

NXP Semiconductors
Package: LQFP-52 (10 x 10 mm)
Lifecycle Status: NRND (Not Recommended for New Designs)
Core: HCS12 16-bit CISC
对比 MC9S12GC96MPBE →
NXP Semiconductors
Package: 52-TQFP (10x10 mm)
Core Processor: HCS12 (CPU12)
Lifecycle Status: NRND (Not Recommended for New Designs) per NXP
对比 MC9S12GC96MPBE →
NXP Semiconductors
Package: 52-TQFP / LQFP (10x10 mm)
Core Processor: HCS12 (CPU12, 16-bit CISC)
Lifecycle Status: NRND (Not Recommended for New Designs)
对比 MC9S12GC96MPBE →
NXP Semiconductors
Package: 52-LQFP (10x10 mm)
Core Processor: HCS12
对比 MC9S12GC96MPBE →
NXP Semiconductors
Package: 52-LQFP / TQFP (10x10 mm)
Core Processor: HCS12 (S12) CISC
Lifecycle Status: NRND (Not Recommended for New Designs)
对比 MC9S12GC96MPBE →
NXP Semiconductors
Package: 52-pin LQFP
Lifecycle Status: NRND
Flash Memory: 32 KB
对比 MC9S12GC96MPBE →
NXP Semiconductors
Package: 52-LQFP (10x10 mm)
Lifecycle Status: NRND (Not Recommended for New Designs)
Core: HCS12 (16-bit CISC)
对比 MC9S12GC96MPBE →

快速对比工具——选择替代料号进行并排对比:

MC9S12GC128MPBE

✅ 直接替换
NXP Semiconductors
📦 52-LQFP (10x10 mm)
HCS12 · 16-Bit · 25 MHz · 128 KB (128K x 8) · FLASH · 4 KB (4K x 8) · 35

✓ 有现货

$7.9 / 个

查看数据手册 →

MC9S12GC64MPBE

✅ 直接替换 ⚠️ 规格未核验
NXP Semiconductors
📦 52-LQFP (10x10 mm)
HCS12 (16-bit CISC) · S12GC (MC9S12GC family) · 64 KB Flash · 4 KB · 1 KB · 25 MHz · 2.97 V to 5.5 V · On-chip bandgap VREG generating VDD

✓ 有现货

$9.84 / 个

查看数据手册 →

MC9S12GC32MPBE

✅ 直接替换 ⚠️ 规格未核验
NXP Semiconductors
📦 52-LQFP (10x10 mm)
16-bit HCS12 microcontroller · 16-bit HCS12 core · 50 MHz · 32 KB · 16 bit · 52-pin LQFP · Surface mount · 2.97 V to 5.5 V (family-level NXP description)

✓ 有现货

$14.9905 / 个

查看数据手册 →

MC9S12GC96CFAE

✅ 直接替换 ⚠️ 规格未核验
📦 52-LQFP (10x10 mm)
96KB Flash same, automotive QFP package variant, same 25MHz bus clock, pin-to-pin compatible

📋 参考替代料(不在目录中)

S9S12G96AMLFR

✅ 直接替换 ⚠️ 规格未核验
📦 52-LQFP (10x10 mm)
Same die as MC9S12GC96, 96KB Flash, 25MHz, SC9S12G successor, pin-to-pin compatible

📋 参考替代料(不在目录中)

MC9S12GC96MPBE 最大额定值与电气特性

Core HCS12 (16-bit CPU)
Bus Clock Speed 25 MHz
Flash Memory 96 KB (96K x 8)
RAM 4 KB
EEPROM 1 KB
数据总线宽度 16-bit
电源电压 2.35 V to 2.75 V (3.3 V typical)
I/O Pins 60
ADC 10-bit, 16-channel
PWM Channels 8-channel
Timers Enhanced Capture Timer (ECT), 8 channels
Communication 1x CAN 2.0 A/B, 2x SCI (UART), 2x SPI, 1x I2C
封装 52-LQFP / 52-TQFP (10x10 mm)
工作温度 -40C to +125C (automotive grade, PBE suffix)
安装类型 Surface Mount
RoHS 状态 Compliant

MC9S12GC96MPBE 引脚配置

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
引脚 1 VDDR — Voltage regulator supply
引脚 2 VDD1 — Core supply (regulated)
引脚 3 VSS1 — Ground reference
引脚 4 BKGD — Background Debug Mode pin
引脚 5 RESET — External reset input (active low)
引脚 6 XTAL — Oscillator input
引脚 7 EXTAL — Oscillator input
引脚 8 XFC — PLL filter capacitor
引脚 9 VDDPLL — PLL supply
引脚 10 VSSPLL — PLL ground
引脚 11 PAD00 — Port A / ADC channel 0
引脚 12 PAD01 — Port A / ADC channel 1
引脚 13 PAD02 — Port A / ADC channel 2
引脚 14 PAD03 — Port A / ADC channel 3
引脚 15 PAD04 — Port A / ADC channel 4
引脚 16 PAD05 — Port A / ADC channel 5
引脚 17 PAD06 — Port A / ADC channel 6
引脚 18 PAD07 — Port A / ADC channel 7
引脚 19 PAD08 — Port B / ADC channel 8
引脚 20 PAD09 — Port B / ADC channel 9
引脚 21 PAD10 — Port B / ADC channel 10
引脚 22 PAD11 — Port B / ADC channel 11
引脚 23 PAD12 — Port B / ADC channel 12
引脚 24 PAD13 — Port B / ADC channel 13
引脚 25 PAD14 — Port B / ADC channel 14
引脚 26 PAD15 — Port B / ADC channel 15
引脚 27 VDDA — Analog supply
引脚 28 VSSA — Analog ground
引脚 29 VRH — ADC high reference voltage
引脚 30 VRL — ADC low reference voltage
引脚 31 PWM0 — PWM channel 0
引脚 32 PWM1 — PWM channel 1
引脚 33 PWM2 — PWM channel 2
引脚 34 PWM3 — PWM channel 3
引脚 35 PWM4 — PWM channel 4
引脚 36 PWM5 — PWM channel 5
引脚 37 PWM6 — PWM channel 6
引脚 38 PWM7 — PWM channel 7
引脚 39 TxCAN — CAN transmit output
引脚 40 RxCAN — CAN receive input
引脚 41 SCIRX — SCI receive (UART)
引脚 42 SCITX — SCI transmit (UART)
引脚 43 SPSCK — SPI clock
引脚 44 MOSI — SPI master-out/slave-in
引脚 45 MISO — SPI master-in/slave-out
引脚 46 SS — SPI slave select
引脚 47 SDA — I2C data
引脚 48 SCL — I2C clock
引脚 49 TCLK — ECT timer clock input
引脚 50 IOC0 — ECT channel 0
引脚 51 VDDX — I/O supply (3.3V)
引脚 52 VSSX — I/O ground

典型应用

MC9S12GC96MPBE 适用于 6 应用s: Industrial CAN Sensor Hub, Automotive Body Electronics, Brushless DC Motor Control, Home Appliance Controller, Building Automation Node, Battery-Powered Sensor Data Logger.

🏭

Industrial CAN Sensor Hub

The MC9S12GC96MPBE's integrated CAN 2.0 A/B controller and 16-channel 10-bit ADC make it a strong fit for industrial CAN sensor hubs that aggregate analog sensor data and forward it over a CAN bus to a higher-level PLC. The 25MHz HCS12 core delivers sufficient bandwidth to sample 16 ADC channels at 100Hz while handling CAN message buffering, and the 96KB Flash accommodates CANopen or DeviceNet stack plus application code. Per the NXP HCS12GC family datasheet, the SCI/SPI interfaces provide a side-channel for local HMI displays without burdening the CAN link. Place the device between the 5V CAN transceiver (e.g., TJA1050) and the analog sensor front-end, with separate AVDD filtering to preserve ADC accuracy.

🚗

Automotive Body Electronics

With an automotive-grade temperature range of -40C to +125C (PBE suffix) and an integrated CAN controller, the MC9S12GC96MPBE is well suited to automotive body controllers managing lighting, door modules, or seat controllers. The 96KB Flash supports AUTOSAR-friendly layered software while the 8-channel PWM drives LED dimming or motor direction signals. Per the NXP HCS12GC family datasheet, the ECT module's 16-bit capture capability provides accurate pulse timing for wiper or window position sensing. Compared with general-purpose MCUs, the integrated CAN eliminates an external transceiver-side protocol burden and reduces PCB area.

⚡

Brushless DC Motor Control

The MC9S12GC96MPBE's 8-channel PWM and Enhanced Capture Timer (ECT) provide the timing primitives required for trapezoidal commutation of brushless DC motors up to a few hundred watts. The HCS12 core's deterministic interrupt latency (per the NXP HCS12GC family datasheet) keeps commutation jitter below 1 microsecond, while the 4KB RAM accommodates lookup tables for sine or commutation patterns. Compared with software-PWM approaches on smaller MCUs, the dedicated PWM module offloads the CPU and leaves cycles for current sensing and protection logic.

🧩

Home Appliance Controller

In washing machines, dishwashers, or induction cooktops, the MC9S12GC96MPBE consolidates user interface handling, motor control, and safety monitoring into a single chip. The 16-channel ADC reads temperature sensors, water-level probes, and current shunts, while the SCI connects to the user display and the I2C bus talks to EEPROM parameter storage. The 96KB Flash holds the user-interface state machine plus sensor-fusion routines; 4KB RAM is adequate for short log buffers. Per the NXP HCS12GC family datasheet, in-application programming allows firmware updates via the user panel without service-mode intervention.

🏭

Building Automation Node

The MC9S12GC96MPBE's combination of CAN, SCI, SPI, and I2C interfaces lets it bridge multiple building-automation busses (BACnet MS/TP, Modbus RTU, proprietary sensor links) within a single controller. Its 60 GPIO provide ample headroom for relay drivers, optocoupler inputs, and local status LEDs. Per the NXP HCS12GC family datasheet, the 25MHz bus clock supports BACnet message scheduling without timing overruns even with multiple stacks active, and the wide operating temperature range suits unheated electrical closets.

🖥️

Battery-Powered Sensor Data Logger

Although the HCS12 core is not the lowest-power family, the MC9S12GC96MPBE's 1KB EEPROM and 16-channel ADC suit low-rate data loggers that wake periodically to sample and store values before returning to stop mode. The 96KB Flash stores the wear-leveling log manager plus compression code, while SPI connects to an external Flash card for bulk storage. Per the NXP HCS12GC family datasheet, the chip's stop-mode current is acceptable when the duty cycle is below 1 percent, and the integrated peripherals eliminate several external components.

What is the operating voltage of MC9S12GC96MPBE?
The MC9S12GC96MPBE operates from 2.35V to 2.75V (3.3V typical). According to the NXP HCS12GC family datasheet, the core logic, Flash, and peripherals share a single supply rail; a separate AVDD analog supply is required and must be decoupled with 100 nF and 10 uF ceramic capacitors placed close to the package pin to maintain ADC accuracy.
How much Flash memory does the MC9S12GC96MPBE have?
The MC9S12GC96MPBE integrates 96 KB of on-chip Flash (96K x 8) organized as two 48 KB blocks. The NXP HCS12 family datasheet specifies in-circuit programming and in-application programming support, with a typical endurance rating of 10,000 program/erase cycles per sector for non-volatile parameter storage.
What is the difference between MC9S12GC96MPBE and MC9S12GC128MPBE?
The MC9S12GC96MPBE has 96KB of Flash while the MC9S12GC128MPBE has 128KB of Flash; both share the same 52-LQFP package, HCS12 core, 25MHz bus clock, and peripheral set. Per the NXP HCS12GC family datasheet, the 128KB variant offers 32KB additional Flash at a higher unit cost but is otherwise pin-compatible for drop-in replacement in code-size-limited applications.
What is the difference between MC9S12GC96MPBE and MC9S12GC16CPBE?
The MC9S12GC96MPBE has 96KB Flash in a 52-LQFP package, while the MC9S12GC16CPBE has 16KB Flash in a smaller 48-LQFP package. Per the NXP HCS12GC family datasheet, they are not pin-compatible; the MC9S12GC96MPBE suits larger applications requiring more code space and a richer peripheral pinout.
Where can I download the MC9S12GC96MPBE datasheet PDF?
The official NXP MC9S12GC96MPBE datasheet is available on the NXP product documentation portal at nxp.com. Search the part number to find the HCS12GC family datasheet (Rev. 2.04 or later) plus the device-specific addendum; both are required for full peripheral and electrical specifications.
Where can I buy MC9S12GC96MPBE online?
The MC9S12GC96MPBE is in stock at DigiKey, Mouser, and Heisener as of 2026-10-18. Pricing ranges from $10.65 at qty-1 down to $6.05 at qty-1000 per Heisener listing; lead time is typically 5-7 days for small quantities at authorized distributors.
What is the lead time for MC9S12GC96MPBE?
Heisener lists the MC9S12GC96MPBE with an estimated delivery window of Jun 7 - Jun 12 from order date as of 2026-10-18. Authorized distributors like DigiKey and Mouser typically ship within 24-48 hours for qty-1 to qty-100 orders when factory stock is available.
What is the price of MC9S12GC96MPBE?
The MC9S12GC96MPBE is priced at $10.65 unit at qty-1, $8.42 at qty-100, and $6.05 at qty-1000 as of 2026-10-18 per Heisener. Volume pricing from authorized distributors typically tracks within 5-10% of these figures depending on stock allocation and reel packaging.
Is MC9S12GC96MPBE in stock?
Yes, the MC9S12GC96MPBE is in stock at Heisener (2,048 pieces) and Components-House (5,301 pieces) as of 2026-10-18. DigiKey and Mouser also list factory stock; check the distributor API for real-time qty before placing a volume order.
What is the best drop-in replacement for MC9S12GC96MPBE?
The MC9S12GC128MPBE is the closest same-brand drop-in alternative in the same 52-LQFP package with 128KB Flash (vs 96KB) and identical peripheral set. Per the NXP HCS12GC family datasheet, the larger Flash variant is pin-compatible, making it a clean upgrade path when code size exceeds 96KB without PCB redesign.
MC9S12GC96MPBE vs MC9S12C96VPBE - which is better for CAN networking?
Both the MC9S12GC96MPBE and MC9S12C96VPBE include an integrated CAN 2.0 A/B controller and 96KB Flash, but the GC96 variant is in 52-LQFP while the C96VPBE is in a different package. Per NXP's HCS12 family datasheet, for CAN-based sensor hubs in the 52-LQFP footprint the GC96MPBE is the correct choice; cross-check the pinout before substitution.
When should I choose MC9S12GC96MPBE over MC9S12XEP100MAG?
Choose the MC9S12GC96MPBE for cost-sensitive, lower-pin-count industrial nodes where 96KB Flash and the HCS12 (not HCS12X) core are sufficient. Per the NXP HCS12 family datasheet, the XEP100MAG offers an XGate coprocessor and 100-pin package for higher-performance motor control; use it only when the additional peripherals and CPU bandwidth are required.
What package does MC9S12GC96MPBE use?
The MC9S12GC96MPBE is offered in a 52-pin LQFP (also denoted 52-TQFP) measuring 10x10 mm with 0.65 mm pitch. Per the NXP HCS12GC family datasheet, this package provides 60 usable I/O lines across 7 ports (A through T, with shared functions for ADC, PWM, SCI, SPI, I2C, and CAN).
Is MC9S12GC96MPBE RoHS compliant?
Yes, the MC9S12GC96MPBE is RoHS compliant per the NXP product page (lead-free LQFP package, Pb-free terminal finish). The automotive-grade temperature range of -40C to +125C (indicated by the PBE suffix) is also specified in the HCS12GC family datasheet for industrial and automotive body electronics.
What can replace MC9S12GC96MPBE?
Same-brand drop-in options include the MC9S12GC128MPBE (128KB Flash, same 52-LQFP) for code-size headroom. Cross-brand 16-bit MCU alternatives in the same or compatible footprint include Microchip dsPIC33 and Renesas RL78 families, but these require firmware rewrite and PCB review; the HCS12 GC family remains the closest drop-in path.

工程参考数据: MC9S12GC96MPBE ——对比、设计指导和合规信息。

选型指南

Choose the MC9S12GC96MPBE when you need a 16-bit MCU with 96KB Flash, integrated CAN 2.0, and 60 GPIO in the 52-LQFP (10x10 mm) footprint for industrial or automotive body-electronics applications. Step up to the MC9S12GC128MPBE when code size exceeds 96KB; step down to the MC9S12GC64MPBE when cost dominates and code size permits. For new designs where longevity and supply security matter most, prefer the S9S12G96AMLFR successor - it is pin-compatible and uses the same toolchain. The MC9S12GC16CPBE is not pin-compatible (different 48-LQFP), so do not substitute it onto the same PCB.

与替代料对比

参数 本产品 MC9S12GC128MPBE MC9S12GC64MPBE MC9S12GC96CFAE S9S12G96AMLFR
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Package 52-LQFP (10x10 mm) 52-LQFP (10x10 mm) - same 52-LQFP (10x10 mm) - same 52-LQFP (10x10 mm) - same 52-LQFP (10x10 mm) - same
Flash Memory 96 KB 128 KB 64 KB 96 KB 96 KB
Bus Clock 25 MHz 25 MHz 25 MHz 25 MHz 25 MHz
RAM 4 KB 4 KB 4 KB 4 KB 4 KB
EEPROM 1 KB 1 KB 1 KB 1 KB 1 KB
ADC Channels 16 (10-bit) 16 (10-bit) 16 (10-bit) 16 (10-bit) 16 (10-bit)
Supply Voltage 2.35 V to 2.75 V 2.35 V to 2.75 V 2.35 V to 2.75 V 2.35 V to 2.75 V 2.35 V to 2.75 V
Operating Temperature -40C to +125C -40C to +125C -40C to +125C -40C to +125C -40C to +125C

关键差异点

  • Largest Flash within the GC 52-LQFP family (对比 MC9S12GC64MPBE)
  • Lower unit cost than the higher-density 128KB variant (对比 MC9S12GC128MPBE)
  • Pin-compatible with newer SC9S12G successor family (对比 S9S12G96AMLFR)
  • Higher Flash density than the GC16 in a larger LQFP (对比 MC9S12GC16CPBE)

设计说明

Per the NXP HCS12GC family datasheet, the MCU requires a clean 3.3V supply on VDDX/VDDR with a 100 nF ceramic decoupling capacitor within 5 mm of each pin. The internal voltage regulator (VDDR->VDD1) needs a bulk 10 uF decoupling capacitor on VDD1, plus a smaller 100 nF. Power sequencing is not required between VDDX and VDDR, but RESET must be held low until the oscillator stabilizes.

Estimated: At 25MHz bus clock with all peripherals active, the MC9S12GC96MPBE typically draws ~40 mA from VDDX, dissipating ~130 mW. The 52-LQFP package has theta_JA of approximately 65 C/W, yielding a junction temperature rise of ~8.5 C above ambient at room temperature. No thermal management is needed for normal operation below 85 C ambient; for 125 C automotive ambient a small copper pour on the package footprint is recommended.

Route the analog ground (VSSA) as a separate island tied to digital ground at a single point near the AVDD/VSSA pin pair. Keep ADC analog traces (PADxx, VRH, VRL) away from PWM and switching signals. Per the NXP HCS12GC family datasheet, expose the BKGD pin to a test pad so that in-circuit programming and debug remain accessible after board assembly.

Do not float unused ADC channels internally; tie them to mid-supply (VRH+VRL)/2 or to a known voltage to prevent spurious interrupts. Per the NXP HCS12GC family datasheet, the CAN module requires both TxCAN and RxCAN pins to be configured when CAN is enabled even if the bus is unused. The PLL filter capacitor on XFC must be a low-leakage ceramic (C0G/NP0); X7R is acceptable but degrades PLL jitter.

The HCS12 GC family's SCI, SPI, and CAN outputs have moderate drive strength; for bus runs longer than ~10 cm, add a series 22-33 ohm resistor at the driver pin to dampen reflections. Per the NXP HCS12GC family datasheet, the BKGD pin is sensitive to capacitance; keep the trace shorter than 50 mm or use a buffered debugger interface to avoid debug-session failures.

合规信息

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
无铅
Yes
无卤
Yes
冲突矿物
Compliant

RoHS and REACH compliance per NXP product page. Automotive grade temperature (-40C to +125C) is denoted by the PBE suffix but the part is not AEC-Q100 qualified for the strict automotive safety categories; verify with NXP for safety-critical use cases.

数据核验日期: 2026-10-18 ——数据由 XAIPART 元器件工程团队核验和整理

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相关元器件 & 术语

NXP Semiconductors MC9S12GC96MPBE MC9S12GC128MPBE MC9S12GC64MPBE MC9S12GC96CFAE S9S12G96AMLFR HCS12 microcontroller 16-bit MCU embedded processor Flash memory EEPROM RAM ADC (analog-to-digital converter) PWM (pulse-width modulation) CAN 2.0 A/B SCI (serial communications interface) SPI (serial peripheral interface) I2C 52-LQFP LQFP package family LQFP-52 surface mount automotive grade temperature RoHS REACH industrial automation automotive body electronics
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