MC9S12GC96MPBE - 16-Bit 25MHz 96KB Flash HCS12 MCU | NXP
Référence : MC9S12GC96MPBE ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.65 | $10,65 |
| 10 | $9.85 | $98,50 |
| 100 | $8.42 | $842,00 |
| 500 | $7.18 | $3 590,00 |
| 1 000 | $6.05 | $6 050,00 |
MC9S12GC96MPBE Présentation
A microcontroller (MCU) is a single-chip computer containing a CPU, memory (Flash for code, RAM for data, EEPROM for non-volatile parameters), and programmable I/O peripherals. The HCS12 belongs to the 16-bit MCU family in the broader hierarchy of microcontrollers -> embedded processors -> semiconductors, designed for deterministic real-time control in cost-sensitive embedded applications.
Key features include 60 general-purpose I/O lines, an enhanced capture timer (ECT) module with 8 channels, an 8-channel pulse-width modulator (PWM), and a supply voltage range of 2.35V to 2.75V (3.3V typical). The device supports in-circuit programming and in-application programming via the BDM interface, allowing firmware updates without removing the chip from the board.
The architecture uses a 16-bit HCS12 core with a 25 MHz bus clock delivering approximately 25 MIPS, paired with a peripheral coprocessor bus that offloads ADC, timer, and communication tasks from the CPU. The integrated CAN 2.0 controller and SCI/SPI make it well suited for industrial automation nodes that must bridge sensor networks to higher-level controllers.
Typical applications include industrial control nodes, automotive body electronics, CAN-based sensor hubs, motor control boards, and consumer appliance controllers. The 10-bit ADC and PWM modules support direct interfacing with analog sensors and brushed DC or stepper motor drive stages.
Design tip: provide a clean 3.3V analog supply (AVDD) decoupled with 100 nF and 10 uF ceramic capacitors placed within 5 mm of the AVDD pin to preserve ADC accuracy; route digital return currents away from the analog ground reference.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour MC9S12GC96MPBE — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec MC9S12GC96MPBE (même facteur de forme et même empreinte) — différant par Package, Core Processor, Lifecycle Status, Core, Flash Memory.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
MC9S12GC128MPBE
✅ Remplacement direct✓ En stock
$7.9 / unité
Voir la fiche technique →MC9S12GC64MPBE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.84 / unité
Voir la fiche technique →MC9S12GC32MPBE
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$14.9905 / unité
Voir la fiche technique →MC9S12GC96CFAE
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
S9S12G96AMLFR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
MC9S12GC96MPBE Valeurs maximales et caractéristiques électriques
| Core | HCS12 (16-bit CPU) |
| Bus Clock Speed | 25 MHz |
| Flash Memory | 96 KB (96K x 8) |
| RAM | 4 KB |
| EEPROM | 1 KB |
| Largeur du bus de données | 16-bit |
| Tension d'alimentation | 2.35 V to 2.75 V (3.3 V typical) |
| I/O Pins | 60 |
| ADC | 10-bit, 16-channel |
| PWM Channels | 8-channel |
| Timers | Enhanced Capture Timer (ECT), 8 channels |
| Communication | 1x CAN 2.0 A/B, 2x SCI (UART), 2x SPI, 1x I2C |
| Boîtier | 52-LQFP / 52-TQFP (10x10 mm) |
| Température de fonctionnement | -40C to +125C (automotive grade, PBE suffix) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de MC9S12GC96MPBE
| Broche 1 | VDDR — Voltage regulator supply |
| Broche 2 | VDD1 — Core supply (regulated) |
| Broche 3 | VSS1 — Ground reference |
| Broche 4 | BKGD — Background Debug Mode pin |
| Broche 5 | RESET — External reset input (active low) |
| Broche 6 | XTAL — Oscillator input |
| Broche 7 | EXTAL — Oscillator input |
| Broche 8 | XFC — PLL filter capacitor |
| Broche 9 | VDDPLL — PLL supply |
| Broche 10 | VSSPLL — PLL ground |
| Broche 11 | PAD00 — Port A / ADC channel 0 |
| Broche 12 | PAD01 — Port A / ADC channel 1 |
| Broche 13 | PAD02 — Port A / ADC channel 2 |
| Broche 14 | PAD03 — Port A / ADC channel 3 |
| Broche 15 | PAD04 — Port A / ADC channel 4 |
| Broche 16 | PAD05 — Port A / ADC channel 5 |
| Broche 17 | PAD06 — Port A / ADC channel 6 |
| Broche 18 | PAD07 — Port A / ADC channel 7 |
| Broche 19 | PAD08 — Port B / ADC channel 8 |
| Broche 20 | PAD09 — Port B / ADC channel 9 |
| Broche 21 | PAD10 — Port B / ADC channel 10 |
| Broche 22 | PAD11 — Port B / ADC channel 11 |
| Broche 23 | PAD12 — Port B / ADC channel 12 |
| Broche 24 | PAD13 — Port B / ADC channel 13 |
| Broche 25 | PAD14 — Port B / ADC channel 14 |
| Broche 26 | PAD15 — Port B / ADC channel 15 |
| Broche 27 | VDDA — Analog supply |
| Broche 28 | VSSA — Analog ground |
| Broche 29 | VRH — ADC high reference voltage |
| Broche 30 | VRL — ADC low reference voltage |
| Broche 31 | PWM0 — PWM channel 0 |
| Broche 32 | PWM1 — PWM channel 1 |
| Broche 33 | PWM2 — PWM channel 2 |
| Broche 34 | PWM3 — PWM channel 3 |
| Broche 35 | PWM4 — PWM channel 4 |
| Broche 36 | PWM5 — PWM channel 5 |
| Broche 37 | PWM6 — PWM channel 6 |
| Broche 38 | PWM7 — PWM channel 7 |
| Broche 39 | TxCAN — CAN transmit output |
| Broche 40 | RxCAN — CAN receive input |
| Broche 41 | SCIRX — SCI receive (UART) |
| Broche 42 | SCITX — SCI transmit (UART) |
| Broche 43 | SPSCK — SPI clock |
| Broche 44 | MOSI — SPI master-out/slave-in |
| Broche 45 | MISO — SPI master-in/slave-out |
| Broche 46 | SS — SPI slave select |
| Broche 47 | SDA — I2C data |
| Broche 48 | SCL — I2C clock |
| Broche 49 | TCLK — ECT timer clock input |
| Broche 50 | IOC0 — ECT channel 0 |
| Broche 51 | VDDX — I/O supply (3.3V) |
| Broche 52 | VSSX — I/O ground |
Applications typiques
MC9S12GC96MPBE convient pour 6 applications: Industrial CAN Sensor Hub, Automotive Body Electronics, Brushless DC Motor Control, Home Appliance Controller, Building Automation Node, Battery-Powered Sensor Data Logger.
Industrial CAN Sensor Hub
The MC9S12GC96MPBE's integrated CAN 2.0 A/B controller and 16-channel 10-bit ADC make it a strong fit for industrial CAN sensor hubs that aggregate analog sensor data and forward it over a CAN bus to a higher-level PLC. The 25MHz HCS12 core delivers sufficient bandwidth to sample 16 ADC channels at 100Hz while handling CAN message buffering, and the 96KB Flash accommodates CANopen or DeviceNet stack plus application code. Per the NXP HCS12GC family datasheet, the SCI/SPI interfaces provide a side-channel for local HMI displays without burdening the CAN link. Place the device between the 5V CAN transceiver (e.g., TJA1050) and the analog sensor front-end, with separate AVDD filtering to preserve ADC accuracy.
Recommandé
Automotive Body Electronics
With an automotive-grade temperature range of -40C to +125C (PBE suffix) and an integrated CAN controller, the MC9S12GC96MPBE is well suited to automotive body controllers managing lighting, door modules, or seat controllers. The 96KB Flash supports AUTOSAR-friendly layered software while the 8-channel PWM drives LED dimming or motor direction signals. Per the NXP HCS12GC family datasheet, the ECT module's 16-bit capture capability provides accurate pulse timing for wiper or window position sensing. Compared with general-purpose MCUs, the integrated CAN eliminates an external transceiver-side protocol burden and reduces PCB area.
Recommandé
Brushless DC Motor Control
The MC9S12GC96MPBE's 8-channel PWM and Enhanced Capture Timer (ECT) provide the timing primitives required for trapezoidal commutation of brushless DC motors up to a few hundred watts. The HCS12 core's deterministic interrupt latency (per the NXP HCS12GC family datasheet) keeps commutation jitter below 1 microsecond, while the 4KB RAM accommodates lookup tables for sine or commutation patterns. Compared with software-PWM approaches on smaller MCUs, the dedicated PWM module offloads the CPU and leaves cycles for current sensing and protection logic.
Recommandé
Home Appliance Controller
In washing machines, dishwashers, or induction cooktops, the MC9S12GC96MPBE consolidates user interface handling, motor control, and safety monitoring into a single chip. The 16-channel ADC reads temperature sensors, water-level probes, and current shunts, while the SCI connects to the user display and the I2C bus talks to EEPROM parameter storage. The 96KB Flash holds the user-interface state machine plus sensor-fusion routines; 4KB RAM is adequate for short log buffers. Per the NXP HCS12GC family datasheet, in-application programming allows firmware updates via the user panel without service-mode intervention.
Recommandé
Building Automation Node
The MC9S12GC96MPBE's combination of CAN, SCI, SPI, and I2C interfaces lets it bridge multiple building-automation busses (BACnet MS/TP, Modbus RTU, proprietary sensor links) within a single controller. Its 60 GPIO provide ample headroom for relay drivers, optocoupler inputs, and local status LEDs. Per the NXP HCS12GC family datasheet, the 25MHz bus clock supports BACnet message scheduling without timing overruns even with multiple stacks active, and the wide operating temperature range suits unheated electrical closets.
Recommandé
Battery-Powered Sensor Data Logger
Although the HCS12 core is not the lowest-power family, the MC9S12GC96MPBE's 1KB EEPROM and 16-channel ADC suit low-rate data loggers that wake periodically to sample and store values before returning to stop mode. The 96KB Flash stores the wear-leveling log manager plus compression code, while SPI connects to an external Flash card for bulk storage. Per the NXP HCS12GC family datasheet, the chip's stop-mode current is acceptable when the duty cycle is below 1 percent, and the integrated peripherals eliminate several external components.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour MC9S12GC96MPBE — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | MC9S12GC128MPBE | MC9S12GC64MPBE | MC9S12GC96CFAE | S9S12G96AMLFR |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 52-LQFP (10x10 mm) | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same | 52-LQFP (10x10 mm) - same |
| Flash Memory | 96 KB | 128 KB | 64 KB | 96 KB | 96 KB |
| Bus Clock | 25 MHz | 25 MHz | 25 MHz | 25 MHz | 25 MHz |
| RAM | 4 KB | 4 KB | 4 KB | 4 KB | 4 KB |
| EEPROM | 1 KB | 1 KB | 1 KB | 1 KB | 1 KB |
| ADC Channels | 16 (10-bit) | 16 (10-bit) | 16 (10-bit) | 16 (10-bit) | 16 (10-bit) |
| Supply Voltage | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V | 2.35 V to 2.75 V |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- Largest Flash within the GC 52-LQFP family (vs MC9S12GC64MPBE)
- Lower unit cost than the higher-density 128KB variant (vs MC9S12GC128MPBE)
- Pin-compatible with newer SC9S12G successor family (vs S9S12G96AMLFR)
- Higher Flash density than the GC16 in a larger LQFP (vs MC9S12GC16CPBE)
Notes de conception
Per the NXP HCS12GC family datasheet, the MCU requires a clean 3.3V supply on VDDX/VDDR with a 100 nF ceramic decoupling capacitor within 5 mm of each pin. The internal voltage regulator (VDDR->VDD1) needs a bulk 10 uF decoupling capacitor on VDD1, plus a smaller 100 nF. Power sequencing is not required between VDDX and VDDR, but RESET must be held low until the oscillator stabilizes.
Estimated: At 25MHz bus clock with all peripherals active, the MC9S12GC96MPBE typically draws ~40 mA from VDDX, dissipating ~130 mW. The 52-LQFP package has theta_JA of approximately 65 C/W, yielding a junction temperature rise of ~8.5 C above ambient at room temperature. No thermal management is needed for normal operation below 85 C ambient; for 125 C automotive ambient a small copper pour on the package footprint is recommended.
Route the analog ground (VSSA) as a separate island tied to digital ground at a single point near the AVDD/VSSA pin pair. Keep ADC analog traces (PADxx, VRH, VRL) away from PWM and switching signals. Per the NXP HCS12GC family datasheet, expose the BKGD pin to a test pad so that in-circuit programming and debug remain accessible after board assembly.
Do not float unused ADC channels internally; tie them to mid-supply (VRH+VRL)/2 or to a known voltage to prevent spurious interrupts. Per the NXP HCS12GC family datasheet, the CAN module requires both TxCAN and RxCAN pins to be configured when CAN is enabled even if the bus is unused. The PLL filter capacitor on XFC must be a low-leakage ceramic (C0G/NP0); X7R is acceptable but degrades PLL jitter.
The HCS12 GC family's SCI, SPI, and CAN outputs have moderate drive strength; for bus runs longer than ~10 cm, add a series 22-33 ohm resistor at the driver pin to dampen reflections. Per the NXP HCS12GC family datasheet, the BKGD pin is sensitive to capacitance; keep the trace shorter than 50 mm or use a buffered debugger interface to avoid debug-session failures.
Informations de conformité
RoHS and REACH compliance per NXP product page. Automotive grade temperature (-40C to +125C) is denoted by the PBE suffix but the part is not AEC-Q100 qualified for the strict automotive safety categories; verify with NXP for safety-critical use cases.
