最后一次采购通知: MCF5307AI66B 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MCF5307AI66B - ColdFire V3 32-bit 66MHz MCU | NXP

料号: MCF5307AI66B ✗ 停产
有现货 1-3 个工作日内发货
208-FQFP (28x28 mm) Package 66 MHz Speed ROMless Memory
低至 $36.49 USD / 件
最小起订量: 1 |
价格更新于: 2026-10-18
批量定价
数量 单价 小计
1 $36.49 $36.49
10 $36.49 $364.90
100 $36.49 $3,649.00
500 $36.49 $18,245.00
1,000 $36.49 $36,490.00
ℹ️ 所有价格均以 USD 计价

MCF5307AI66B 概述

The NXP Semiconductors MCF5307AI66B is a 32-bit ColdFire V3 microprocessor (MCU) running at 66 MHz with on-chip 4 KB SRAM and ROMless program memory, housed in a 208-pin FQFP (28x28 mm) surface-mount package.

A ColdFire microprocessor is a 32-bit embedded processor derived from the Motorola 68000 (M680x0) architecture. The ColdFire family spans the V1 through V4 core generations, sitting within the broader hierarchy of CISC-heritage embedded processors used in industrial control, networking, and instrumentation. The V3 core in the MCF5307 executes the ColdFire instruction set with a multiply-accumulate (MAC) module for DSP-style arithmetic, delivering approximately 70 MIPS of sustained performance for embedded control applications.

Key features of the MCF5307 include a highly integrated system-on-chip design combining the V3 core with a DRAM controller, a direct memory access (DMA) controller, programmable interrupt controller, timers, parallel interface, and serial interfaces including I2C and UART/USART. The 4 KB internal SRAM can be used as tightly-coupled scratchpad memory for time-critical code or data, reducing bus traffic on the external bus interface (EBI/EMI).

Technically, the MCF5307 is ROMless: program code executes from external flash or DRAM via the integrated DRAM controller and external bus interface. Peripherals include DMA, power-on reset (POR), and a watchdog timer (WDT). Sixteen general-purpose I/O lines are available, and the processor operates as a single-core 32-bit device at 66 MHz, offering a cost-effective balance of performance and integration for legacy embedded designs.

Typical applications include industrial embedded control systems, factory automation controllers, networking equipment line cards, and legacy instrumentation upgrades where existing ColdFire code bases must be maintained.

A key design consideration is that the MCF5307AI66B is designated End-of-Life by NXP and is Not Recommended for New Designs; new projects should evaluate ColdFire successors such as the MCF52xx or MCF53xx family variants, and existing designs should plan last-time-buy inventory strategies.

This page synthesizes distributor pricing, availability from multiple sources, and lifecycle status information not consolidated in the manufacturer product listing.

直接替换替代料: MCF5307AI66B ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MCF5307AI66B (相同外形与封装尺寸) ——差异在于 On-chip SRAM, Performance, Core, Data Bus Width, Operating Temperature.

NXP Semiconductors
On-chip SRAM: 4 KB
Core: ColdFire V3
Data Bus Width: 32 bit
对比 MCF5307AI66B →
NXP Semiconductors
On-chip SRAM: 4 KB (4K x 8)
Data Bus Width: 32-bit
对比 MCF5307AI66B →
NXP Semiconductors
On-chip SRAM: 4 KB
Performance: 316 Dhrystone MIPS
Core: ColdFire V4 (32-bit)
对比 MCF5307AI66B →

快速对比工具——选择替代料号进行并排对比:

MCF5307CAI66B

✅ 直接替换
NXP Semiconductors
📦 208-FQFP (28x28 mm)
ColdFire V3 · 32 bit · 66 MHz · 70 MIPS · ColdFire (variable-length RISC, 68k-derived) · 4 KB · ROMless · 3.3 V

✓ 有现货

$34.8 / 个

查看数据手册 →

MCF5307AI66B 最大额定值与电气特性

Core Processor ColdFire V3 (MCF530x)
Core Size 32-Bit
Maximum Clock Speed 66 MHz
Performance 70 MIPS
Program Memory Type ROMless
RAM Size 4 KB SRAM
Connectivity EBI/EMI, I2C, UART/USART
Peripherals DMA, POR, WDT
Number of I/O 16
DRAM Controller Yes (integrated)
MAC Module Yes (multiply-accumulate)
封装 208-FQFP (28x28 mm)
安装类型 Surface Mount
Part Status End of Life / Not For New Designs

MCF5307AI66B 208-fqfp (28x28 mm) 引脚配置指南

MCF5307AI66B(208-fqfp (28x28 mm) 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MCF5307AI66B 的 208-fqfp (28x28 mm) 封装引脚图

暂无详细引脚数据: MCF5307AI66B.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MCF5307AI66B 适用于 6 应用s: Industrial Embedded Control, Networking Equipment, Test and Measurement Instrumentation, Legacy System Sustainment and Repair, Motor Control and Automation Nodes, Building Automation and Access Control.

🏭

Industrial Embedded Control

The MCF5307AI66B was purpose-built for embedded control: according to NXP, it is a high-performance, cost-effective, highly integrated microprocessor delivering approximately 70 MIPS at 66 MHz. The integrated DRAM controller and external bus interface allow a minimal two-chip solution (processor plus DRAM/flash), while the DMA controller offloads data movement between UART and memory, keeping the ColdFire V3 core free for control-loop computation. In industrial controllers that already run ColdFire V3 code bases, replacing the MCF5307AI66B with the same part preserves the software investment entirely. The watchdog timer and power-on reset provide the supervision needed in unattended factory equipment. Because the part is now End-of-Life, industrial users should secure stock for the remaining service life of their controller platforms.

🌐

Networking Equipment

The MCF5307AI66B suits board-level management and line-card control in networking equipment such as routers, switches, and hubs. Its external bus interface (EBI/EMI) drives external memory and peripheral ASICs, while dual UARTs and I2C connect to management PHYs, EEPROM, and console ports. The DMA controller moves packet-status data without core intervention, and the MAC module accelerates checksum-style arithmetic. The 4 KB internal SRAM serves as a scratchpad for interrupt service routines, keeping deterministic response times for management traffic. Since the device is ROMless, firmware boots from external flash, enabling remote field updates of management images. For designs sustaining legacy networking hardware, the 208-FQFP footprint and 66 MHz speed remain familiar and well-characterized, though End-of-Life status mandates last-time-buy planning for field-service spares.

🔧

Test and Measurement Instrumentation

Bench and rack instrumentation benefits from the MCF5307AI66B's balanced mix of processing power and integration: 70 MIPS of ColdFire V3 throughput handles instrument state machines, front-panel logic, and calibration math, while the multiply-accumulate module speeds filtering and averaging of sampled data. The parallel interface and 16 I/O lines interface to display drivers, keypads, and ADC/DAC control logic; I2C reaches temperature sensors and configuration EEPROM. The integrated DRAM controller supports the larger program and data memory that measurement firmware typically requires, and the watchdog timer guarantees recovery from firmware hangs during long unattended acquisition runs. Legacy instrument manufacturers maintaining ColdFire-based platforms continue to source this EOL device through remaining distributor stock, as the software and board ecosystem cannot be replicated without a full redesign.

🖥️

Legacy System Sustainment and Repair

The primary ongoing use of the MCF5307AI66B is sustaining and repairing systems designed in the 1990s and 2000s around the ColdFire architecture. Military, aerospace, medical, and industrial OEMs frequently freeze hardware designs after qualification; in these cases the 208-FQFP 28x28 mm footprint, pin map, and 66 MHz ColdFire V3 timing must be preserved exactly, making the original part the only valid repair component. Distributors and brokers such as Heisener (7,648 pieces in stock as of 2026-10-18) and ExcessChip supply remaining inventory, and Rochester Electronics offers licensed continued-manufacturing paths for EOL NXP processors. Procurement teams should verify date codes, purchase from traceable sources, and buy sufficient quantity to cover the product's remaining field-service life, since no pin-compatible successors exist.

⚙️

Motor Control and Automation Nodes

Distributed automation nodes, motor-drive supervisory controllers, and protocol gateways historically used the MCF5307AI66B for its combination of a 32-bit core, DMA-driven serial I/O, and external memory expansion. The DMA controller sustains UART communication with a fieldbus controller without core loading, the timers generate PWM-adjacent control signals or time-stamp encoder events, and the MAC module handles scaling and control-law arithmetic. The integrated watchdog enforces fail-safe shutdown in drive systems, and power-on reset guarantees defined startup of the external DRAM boot sequence. At 66 MHz the device delivers headroom for Modbus, PROFIBUS-style protocol stacks in ColdFire C code. Because NXP has ended production, new automation node designs should select actively supported ColdFire or ARM parts, reserving the MCF5307AI66B for existing-installation spares.

🏢

Building Automation and Access Control

Panel controllers for building automation, HVAC supervisory units, and access-control boards adopted the MCF5307AI66B because its 70 MIPS core comfortably runs protocol stacks and scheduling logic while the I2C bus reads sensors and real-time clocks, and UARTs link to modems or RS-485 transceivers. The 4 KB SRAM buffers communication frames, and the external bus interface attaches the flash and DRAM needed for logging applications. The watchdog timer supports the continuous unattended operation these panels demand, and the industrial-grade AI suffix variant covers non-conditioned spaces such as mechanical rooms. As the part is End-of-Life, integrators repairing installed bases should source remaining stock now, while new panel designs should move to supported 32-bit MCUs; the 208-FQFP footprint has no cross-brand pin-compatible replacement in current production.

What is the MCF5307AI66B microprocessor?
The MCF5307AI66B is a 32-bit ColdFire V3 microprocessor from NXP Semiconductors (originally Motorola/Freescale) running at 66 MHz with 4 KB of on-chip SRAM in a 208-pin FQFP package. According to the NXP product page, it delivers approximately 70 MIPS and integrates a DRAM controller, DMA controller, timers, I2C, and UART interfaces for embedded control applications. It is ROMless, so code executes from external memory.
Is MCF5307AI66B still in production?
No, the MCF5307AI66B is designated End-of-Life by NXP and is categorized as Not For New Designs. According to the NXP product page, the device is no longer recommended for new projects. Remaining inventory is available through authorized and independent distributors; engineers with legacy designs should execute a last-time-buy strategy or plan a migration to a supported ColdFire-family device.
What is the price of MCF5307AI66B?
The MCF5307AI66B is listed at approximately $36.49 per unit (as of 2026-10-18) at independent distributor Heisener, with 7,648 pieces in stock and immediate shipment available. Because the part is End-of-Life, pricing varies significantly between distributors and stock turns; quantity discounts are typically limited, and buyers should request quotations from multiple sources before committing to volume orders.
Where can I buy MCF5307AI66B online?
The MCF5307AI66B can be purchased online through distributors including DigiKey Marketplace, Mouser, and Heisener, as well as excess-inventory brokers such as ExcessChip. Heisener reported 7,648 pieces in stock at approximately $36.49 per unit (as of 2026-10-18). Since the part is End-of-Life, availability is limited to remaining stock; verify date codes and authenticity certificates when buying from independent distributors.
What is the difference between MCF5307AI66B and MCF5307CAI66B?
The MCF5307AI66B and MCF5307CAI66B share the same ColdFire V3 core, 66 MHz speed, 4 KB SRAM, and 208-FQFP package; the difference lies in the temperature-grade letter. The 'A' suffix denotes the industrial temperature grade while 'C' denotes the commercial grade, per the NXP MCF5307 ordering-information scheme. Both are pin-to-pin compatible in the same 208-FQFP footprint, making the C-grade a drop-in candidate where the commercial range is acceptable.
Is MCF5307AI66B the same as MCF5272VM66R2?
No, the MCF5307AI66B and MCF5272VM66R2 are different devices within NXP's ColdFire family. The MCF5307AI66B uses the ColdFire V3 core at 66 MHz with a DRAM controller in a 208-FQFP package, while the MCF5272 is a V2-core integrated microcontroller with a different peripheral set and package. They are not pin-compatible, and the MCF5272 cannot serve as a drop-in replacement for the MCF5307.
What is the best drop-in replacement for MCF5307AI66B?
The closest drop-in replacement is the MCF5307CAI66B, which shares the identical 208-FQFP footprint, ColdFire V3 core, 66 MHz clock, and 4 KB SRAM, differing only in commercial versus industrial temperature grade. No cross-brand pin-compatible equivalents are documented in distributor cross-reference data. Because the entire MCF5307 family is End-of-Life, long-term supply requires last-time-buy sourcing or board redesign to a supported processor.
What can replace MCF5307AI66B in a new design?
For new designs, NXP recommends newer ColdFire-family parts such as the MCF52xx series, though none are pin-compatible with the 208-FQFP MCF5307 footprint. Since the MCF5307AI66B is Not For New Designs, engineers typically migrate to a supported 32-bit MCU family and port the ColdFire code base, or use Rochester Electronics as a licensed source of continued manufacturing for the original device.
What are the key specifications of MCF5307AI66B that engineers should know?
The MCF5307AI66B is a 32-bit ColdFire V3 processor at 66 MHz delivering 70 MIPS, with 4 KB on-chip SRAM and ROMless program memory in a 208-pin FQFP (28x28 mm) package. Connectivity includes EBI/EMI, I2C, and UART/USART; peripherals include DMA, power-on reset, and a watchdog timer; 16 I/O lines are provided. It integrates a DRAM controller and MAC module, and carries End-of-Life status from NXP.
Where to download the MCF5307AI66B datasheet PDF?
The MCF5307AI66B datasheet is available as the MCF5307 Integrated Microprocessor User's Manual from the NXP product page at nxp.com/part/MCF5307AI66B. Mirror copies are hosted on archive sites such as Alldatasheet (a 484-page manual, approximately 5.7 MB, originally published by Motorola). For the authoritative and latest revision, always download directly from the NXP website documentation section.
Where can I find the MCF5307AI66B pinout?
The full 208-pin FQFP pinout for the MCF5307AI66B is documented in the MCF5307 Integrated Microprocessor User's Manual available on the NXP product page. The manual includes pin connection diagrams, signal descriptions, and package mechanical drawings for the 208-pin FQFP (28x28 mm). Distributors such as Veswin also provide pinout support; a complete pin table is not reproduced on third-party product pages.
Is the MCF5307AI66B suitable for a new industrial design?
No, the MCF5307AI66B is not suitable for new industrial designs because NXP has designated it End-of-Life and Not For New Designs. While it remains purchasable from remaining distributor stock (Heisener listed 7,648 pieces as of 2026-10-18), long-term supply cannot be guaranteed. For new industrial products, choose an actively supported 32-bit MCU; use the MCF5307AI66B only to sustain existing legacy systems.
When should I choose the MCF5307AI66B over a modern 32-bit MCU?
Choose the MCF5307AI66B only when you must maintain a legacy ColdFire-based product without board redesign: it preserves binary-compatible ColdFire V3 code execution, the 208-FQFP footprint, and the integrated DRAM controller, minimizing engineering cost. For any new development, a modern Cortex-M-based MCU offers lower power, better availability, and active vendor support. The trade-off is EOL supply risk versus zero-redesign convenience for service and repair volumes.
Is there a cross-brand equivalent for the MCF5307AI66B?
No cross-brand pin-compatible equivalent is documented in the available cross-reference data. Related comparisons such as MCF5307AI66B versus the MC68EC060RC50 (a 68060 processor in a 206-PGA package) show different cores and entirely different packages, so they are not drop-in substitutes. The only viable same-footdrop-in option remains within the NXP/Freescale MCF5307 family itself, such as the MCF5307CAI66B commercial-grade variant.
How much SRAM does the MCF5307AI66B have and how is it used?
The MCF5307AI66B contains 4 KB of on-chip SRAM. According to the NXP product description, this SRAM is typically used as tightly-coupled scratchpad memory for time-critical code or data, reducing accesses on the external bus. Because the device is ROMless, the main program image resides in external flash or DRAM controlled by the integrated DRAM controller, with the 4 KB SRAM reserved for latency-sensitive routines such as interrupt handlers or DSP inner loops.
What interfaces and peripherals does the MCF5307AI66B include?
The MCF5307AI66B integrates EBI/EMI (external bus interface), I2C, and UART/USART serial interfaces, along with DMA, power-on reset (POR), and watchdog timer (WDT) peripherals, per the NXP datasheet listing. It also includes a DRAM controller, a multiply-accumulate (MAC) module for DSP arithmetic, timers, and parallel interface support, with 16 general-purpose I/O lines available on the 208-FQFP package.

工程参考数据: MCF5307AI66B ——对比、设计指导和合规信息。

选型指南

Choose the MCF5307AI66B only to sustain existing ColdFire V3 systems whose 208-FQFP design is frozen and whose operating environment requires industrial temperature ratings; it is the only option that preserves the footprint, pinout, and binary-compatible code base with zero redesign. Choose the MCF5307CAI66B as a drop-in substitute only when the application is in a controlled commercial environment (0C to +70C class), since it shares the identical die and package but is commercial-grade. Do not choose either part for new designs: NXP designates the whole MCF5307 family as End-of-Life. The MC68EC060RC50 sometimes appears in parametric comparisons but uses a 206-PGA package and a different core, so it is not a replacement. For new development, migrate to a supported 32-bit MCU family and budget for code porting.

与替代料对比

参数 本产品 MCF5307CAI66B
Package 208-FQFP (28x28 mm) 208-FQFP (28x28 mm) - same
Brand NXP Semiconductors NXP Semiconductors
Core ColdFire V3 ColdFire V3
Clock Speed 66 MHz 66 MHz
RAM Size 4 KB SRAM 4 KB SRAM
Program Memory ROMless ROMless
Temperature Grade Industrial (A) Commercial (C)
Lifecycle Status End-of-Life / Not For New Designs End-of-Life / Not For New Designs

关键差异点

  • Industrial temperature grade availability (对比 MCF5307CAI66B)
  • Integrated DRAM controller (对比 MC68EC060RC50)
  • Trade-off: End-of-Life status (对比 MCF5307CAI66B)

设计说明

The MCF5307AI66B is End-of-Life and Not For New Designs per the NXP product page. Any new schematic capture using this part creates immediate supply risk. For legacy designs, perform a last-time-buy analysis: Heisener listed 7,648 pieces in stock as of 2026-10-18 at approximately $36.49 per unit, but EOL stock is finite and pricing from brokers can rise sharply. Confirm date codes and request authenticity documentation when purchasing from independent distributors, as EOL processors are a frequent target for counterfeit parts.

Because the MCF5307 is ROMless, boot code must reside in external non-volatile memory, and the integrated DRAM controller must be correctly configured during reset initialization. Verify DRAM timing parameters (refresh rate, CAS latency, and bus turnaround) against the specific DRAM devices in your design using the MCF5307 Integrated Microprocessor User's Manual available from NXP. Incorrect DRAM initialization is the most common cause of boot failure on this family; use the manufacturer's reference initialization sequence as the starting point.

The 208-pin FQFP (28x28 mm, 0.5 mm pitch) requires careful PCB footprint accuracy; verify the land pattern against the mechanical drawing in the NXP user manual before fabrication. Keep the external bus interface (EBI/EMI) traces to DRAM and flash short and length-matched where practical to preserve signal integrity at 66 MHz bus operation. Provide solid ground return paths under the address/data buses and place decoupling capacitors at all supply pins of the package per standard high-pin-count QFP practice.

合规信息

RoHS
Unknown
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Unknown
无卤
Unknown
冲突矿物
Unknown

Compliance data was not present in the provided web data. The NXP product page includes an Environmental Quality section, but its contents were not retrieved; verify RoHS/REACH status on the official NXP part page before procurement.

数据核验日期: 2026-10-18 ——数据由 XAIPART 元器件工程团队核验和整理

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相关元器件 & 术语

NXP Semiconductors Motorola Freescale Semiconductor MCF5307AI66B MCF5307CAI66B MCF5307 ColdFire V3 ColdFire architecture M680x0 68000 microprocessor microprocessor microcontroller embedded control 208-FQFP QFP package family surface mount EBI/EMI external bus interface DMA controller DRAM controller I2C UART watchdog timer Rochester Electronics End-of-Life
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