MCIMX251AJM4 - i.MX25 ARM9 400MHz MPU, 400-LFBGA | NXP
料号： MCIMX251AJM4 ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $32.5 | $32.50 |
| 10 | $29.2 | $292.00 |
| 100 | $25.8 | $2,580.00 |
| 500 | $22.4 | $11,200.00 |
| 1,000 | $19.95 | $19,950.00 |
MCIMX251AJM4 概述
An applications processor (AP) is a system-level integrated circuit that combines a CPU core, memory controllers, peripheral interfaces, and dedicated accelerators into a single chip, sitting at the top of the embedded computing hierarchy (AP -> SoC -> microprocessor -> semiconductor). The i.MX25 family targets cost-sensitive HMI, connectivity, and general-embedded designs where an ARM9 core, DDR2 memory support, dual USB PHYs, 10/100 Ethernet with RMII, MMC/SD/SDIO, and a 12-bit touchscreen ADC provide sufficient integration to reduce external component count and BOM cost.
The MCIMX251AJM4 supports external program memory (boot from NAND/NOR) and integrates 144 KB of internal SRAM for data retention, plus 128 general-purpose I/O lines, an ARM926EJ-S core with 16 KB instruction and 16 KB data caches, and a vector floating-point (VFP) unit in some family derivatives. Accessories: USB PHYs (x2), 10/100 Ethernet MAC with integrated RMII PHY interface, 12-bit ADC, MMC/SD/SDIO, DDR2 controller.
Architecturally, the MCIMX251AJM4 is built on a 0.09 um CMOS process and is part of the silicon version 1.2 automotive-qualified i.MX25 family. The device emphasizes low power consumption, integrated peripheral set, and AEC-Q100-style automotive qualification support through the JM (junction temperature) suffix in the part number. Compared with older ARM7/i.MX21 designs, the i.MX25 adds DDR2 memory support and embedded USB PHYs that reduce external component count.
Typical applications include automotive infotainment head units, industrial HMI panels, point-of-sale terminals, portable medical devices, and smart-energy gateways. The wide peripheral mix also suits Wi-Fi/SDIO and Bluetooth/UART-bridged connectivity subsystems.
When designing with this device, ensure the 400-LFBGA land pattern is laid out per NXP's reference design and that thermal vias under the package are used to dissipate the typical 1 W to 2 W active power. Designers migrating from i.MX21 should re-validate DDR2 timing parameters and the boot mode configuration word because the memory map differs from earlier i.MX families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： MCIMX251AJM4 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MCIMX251AJM4 （相同外形与封装尺寸） ——差异在于 Core Architecture, RoHS Status, Ethernet, Package, Program Memory Type.
快速对比工具——选择替代料号进行并排对比：
MCIMX251AJM4A
✅ 直接替换✓ 有现货
$22.48 / 个
查看数据手册 →MCIMX253CJM4A
✅ 直接替换✓ 有现货
$22.8 / 个
查看数据手册 →MCIMX258CJM4A
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX251AJM4 最大额定值与电气特性
| Core Architecture | ARM926EJ-S |
| Number of Cores | 1 |
| 数据总线宽度 | 32-Bit |
| 最大时钟频率 | 400 MHz |
| On-Chip RAM | 144 KB |
| Program Memory Type | External (NAND/NOR boot) |
| Number of I/O Lines | 128 |
| 封装 / 外壳 | 400-LFBGA (17x17 mm, 0.8 mm pitch) |
| Oscillator Type | External |
| 安装类型 | Surface Mount |
| Packaging | Tray |
| Process Technology | 0.09 um CMOS |
| USB PHYs | 2 (integrated) |
| Ethernet MAC | 10/100 with RMII |
| ADC | 12-bit (touchscreen controller) |
| Memory Controller | DDR2, NAND, NOR |
| RoHS 状态 | Compliant |
MCIMX251AJM4 400-lfbga (17x17 mm, 0.8 mm pitch) 引脚配置指南
MCIMX251AJM4（400-lfbga (17x17 mm, 0.8 mm pitch) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX251AJM4.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX251AJM4 适用于 6 应用s: Automotive Infotainment Head Unit, Industrial HMI Panel, Point-of-Sale Terminal, Portable Medical Device, Smart Energy Gateway, Connected Embedded IoT Edge Node.
Automotive Infotainment Head Unit
The MCIMX251AJM4 fits automotive infotainment head-unit designs through its 400 MHz ARM926EJ-S compute headroom, integrated 12-bit ADC with touchscreen controller, dual USB PHYs, and DDR2 memory controller. The 144 KB on-chip SRAM accelerates boot-loader and HMI runtime tasks while the external DDR2 interface supports larger media buffers. With 128 GPIO lines, designers can drive TFT displays, button matrices, and rotary encoders without external I/O expanders. The integrated 10/100 Ethernet MAC with RMII also enables connected-vehicle telematics modules that share the same PCB.
推荐
Industrial HMI Panel
For industrial HMI panels, the MCIMX251AJM4 provides the right balance of ARM9 processing throughput, integrated peripherals, and low BOM cost. Its 12-bit ADC supports touch input without an external controller, while the LCD controller (in family derivatives) interfaces directly to TFT panels. The 400 MHz clock enables responsive multi-widget interfaces on QVGA and WVGA displays. The 400-LFBGA package allows compact PCB layouts suitable for panel-mount enclosures, and NXP's long-term silicon supply supports industrial product life cycles of 10+ years.
推荐
Point-of-Sale Terminal
Point-of-sale terminals benefit from the MCIMX251AJM4's integrated peripheral set: dual USB PHYs for barcode scanners and receipt printers, 10/100 Ethernet for IP-based payment terminals, and the 12-bit ADC for keypad scanning. The 400 MHz ARM9 core runs Linux and SSL/TLS stacks with sufficient throughput for EMV chip-card transaction times under 2 seconds. The 144 KB on-chip SRAM holds the secure boot-loader and PIN-pad firmware in tamper-responsive designs. NXP's automotive-grade pedigree also supports retail kiosks requiring wide temperature tolerance.
推荐
Portable Medical Device
Portable medical devices such as patient monitors and diagnostic handhelds use the MCIMX251AJM4 for its low-power ARM9 core, integrated USB PHYs for PC connectivity, and 12-bit ADC for sensor signal acquisition. The 144 KB on-chip SRAM supports real-time OS kernels and small DSP filters without external memory pressure. The 400 MHz clock headroom enables ECG/EEG waveform processing at clinical sampling rates, while the LFBGA package supports compact handheld form factors. The automotive temperature envelope also tolerates clinical and field-deployed environments.
推荐
Smart Energy Gateway
Smart energy gateways aggregate data from smart meters, HVAC controllers, and load-management devices. The MCIMX251AJM4's 10/100 Ethernet MAC with RMII interfaces directly to the home-area-network PHY, while the integrated USB and serial peripherals connect to Wi-Fi/Bluetooth modules for mesh networking. The 400 MHz ARM9 core runs MQTT, TLS, and DLMS/COSEM stacks for utility-grade metering protocols. The 144 KB on-chip SRAM buffers transient network bursts, and the DDR2 controller supports larger protocol stacks in flash-less builds.
推荐
Connected Embedded IoT Edge Node
For connected IoT edge nodes, the MCIMX251AJM4 integrates the connectivity peripherals (USB, Ethernet, SDIO) typically required to bridge Wi-Fi/Bluetooth modules to a local sensor bus. The 400 MHz ARM9 core runs lightweight edge-analytics workloads (TLS handshake, JSON parsing, simple thresholding) at <50 mW active power. The 400-LFBGA package supports compact edge-node PCBs, and NXP's longevity commitment aligns with industrial IoT deployment horizons. Designers can also leverage the i.MX25 Linux BSP for rapid prototyping.
推荐
推荐产品汇总
工程参考数据： MCIMX251AJM4 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX251AJM4A | MCIMX253CJM4A | MCIMX258CJM4A |
|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm, 0.8 mm pitch) | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum Clock Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| On-Chip RAM | 144 KB | 144 KB | 144 KB | 144 KB |
| Number of I/O Lines | 128 | 128 | 128 | 128 |
| CAN Bus | No (i.MX251 sub-family) | No (i.MX251 sub-family) | Yes (i.MX253 sub-family adds CAN) | Yes (i.MX258 sub-family) |
| Enhanced Security | Standard | Standard | Standard | Enhanced (i.MX258 sub-family) |
| Silicon Revision | 1.2 | 1.2A (updated) | 1.2A | 1.2A |
关键差异点
- Original silicon revision vs updated A-suffix （对比 MCIMX251AJM4A)
- CAN bus integration （对比 MCIMX253CJM4A)
- Enhanced security features （对比 MCIMX258CJM4A)
设计说明
The 400-LFBGA package at 0.8 mm pitch requires a minimum of 4 PCB routing layers and 0.4 mm via-in-pad geometry with NSMD landing pads. Thermal vias (0.3 mm drill, 1.0 mm pitch array) under the die-attach paddle are mandatory to dissipate the typical 1 W to 2 W active power envelope. Per NXP's reference design, use 0.8 mm solder ball openings with solder-mask-defined pads to reduce tombstoning during reflow.
The MCIMX251AJM4 requires separate core and I/O supply rails with power-up sequencing per the i.MX25 datasheet. Estimated: at 400 MHz active, core current draw is approximately 300 mA to 500 mA depending on workload; I/O rail at 3.3 V draws another 100 mA under typical GPIO loading. Designers should budget a 1.5x margin for inrush and transient loads. Decoupling capacitors must be placed within 1 mm of each supply ball pair.
When replacing the MCIMX251AJM4 with the MCIMX251AJM4A (or other i.MX25 sub-family members), verify the boot mode configuration word because some peripherals (CAN, security) are absent on i.MX251 but present on i.MX253/i.MX258. Estimated: typical 0.09 um CMOS process quiescent current is <5 mA in deep-sleep mode; failing to disable unused peripherals can increase standby current by 20x. Always consult the latest silicon errata document for the specific lot under consideration.
合规信息
AEC-Q100 qualification referenced in i.MX25 family datasheet for automotive products suffix. RoHS and REACH compliance per distributor listings (DigiKey/Mouser).
