MCIMX251AJM4 - i.MX25 ARM9 400MHz MPU, 400-LFBGA | NXP
N.º de pieza: MCIMX251AJM4 ✓ Activo| Cant. | Precio unitario | Total |
|---|---|---|
| 1 | $32.5 | $32,50 |
| 10 | $29.2 | $292,00 |
| 100 | $25.8 | $2.580,00 |
| 500 | $22.4 | $11.200,00 |
| 1.000 | $19.95 | $19.950,00 |
MCIMX251AJM4 Descripción general
An applications processor (AP) is a system-level integrated circuit that combines a CPU core, memory controllers, peripheral interfaces, and dedicated accelerators into a single chip, sitting at the top of the embedded computing hierarchy (AP -> SoC -> microprocessor -> semiconductor). The i.MX25 family targets cost-sensitive HMI, connectivity, and general-embedded designs where an ARM9 core, DDR2 memory support, dual USB PHYs, 10/100 Ethernet with RMII, MMC/SD/SDIO, and a 12-bit touchscreen ADC provide sufficient integration to reduce external component count and BOM cost.
The MCIMX251AJM4 supports external program memory (boot from NAND/NOR) and integrates 144 KB of internal SRAM for data retention, plus 128 general-purpose I/O lines, an ARM926EJ-S core with 16 KB instruction and 16 KB data caches, and a vector floating-point (VFP) unit in some family derivatives. Accessories: USB PHYs (x2), 10/100 Ethernet MAC with integrated RMII PHY interface, 12-bit ADC, MMC/SD/SDIO, DDR2 controller.
Architecturally, the MCIMX251AJM4 is built on a 0.09 um CMOS process and is part of the silicon version 1.2 automotive-qualified i.MX25 family. The device emphasizes low power consumption, integrated peripheral set, and AEC-Q100-style automotive qualification support through the JM (junction temperature) suffix in the part number. Compared with older ARM7/i.MX21 designs, the i.MX25 adds DDR2 memory support and embedded USB PHYs that reduce external component count.
Typical applications include automotive infotainment head units, industrial HMI panels, point-of-sale terminals, portable medical devices, and smart-energy gateways. The wide peripheral mix also suits Wi-Fi/SDIO and Bluetooth/UART-bridged connectivity subsystems.
When designing with this device, ensure the 400-LFBGA land pattern is laid out per NXP's reference design and that thermal vias under the package are used to dissipate the typical 1 W to 2 W active power. Designers migrating from i.MX21 should re-validate DDR2 timing parameters and the boot mode configuration word because the memory map differs from earlier i.MX families.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas directas para MCIMX251AJM4 — mismo encapsulado, compatible pin a pin. Se excluyen las piezas de otro encapsulado que requieren retrabajo de la PCB.
Variantes de esta serie
Modelos de la misma serie compatibles directamente con MCIMX251AJM4 (mismo factor de forma y huella) — difiere en Core Architecture, RoHS Status, Ethernet, Package, Program Memory Type.
Herramienta de comparación rápida — seleccione piezas alternativas para compararlas lado a lado:
MCIMX251AJM4A
✅ Sustitución directa✓ En stock
$22.48 / unidad
Ver hoja de datos →MCIMX253CJM4A
✅ Sustitución directa✓ En stock
$22.8 / unidad
Ver hoja de datos →MCIMX258CJM4A
✅ Sustitución directa📋 Alternativa de referencia (no en el catálogo)
MCIMX251AJM4 Valores máximos y características eléctricas
| Core Architecture | ARM926EJ-S |
| Number of Cores | 1 |
| Ancho del bus de datos | 32-Bit |
| Frecuencia de reloj máxima | 400 MHz |
| On-Chip RAM | 144 KB |
| Program Memory Type | External (NAND/NOR boot) |
| Number of I/O Lines | 128 |
| Encapsulado / Carcasa | 400-LFBGA (17x17 mm, 0.8 mm pitch) |
| Oscillator Type | External |
| Tipo de montaje | Surface Mount |
| Packaging | Tray |
| Process Technology | 0.09 um CMOS |
| USB PHYs | 2 (integrated) |
| Ethernet MAC | 10/100 with RMII |
| ADC | 12-bit (touchscreen controller) |
| Memory Controller | DDR2, NAND, NOR |
| Estado RoHS | Compliant |
Guía de configuración de pines de MCIMX251AJM4 400-lfbga (17x17 mm, 0.8 mm pitch)
Configuración de pines para MCIMX251AJM4 (encapsulado 400-lfbga (17x17 mm, 0.8 mm pitch)). Este CI digital incluye GPIO, interfaces de comunicación (UART, SPI, I2C) y pines de alimentación. Consulte la hoja de datos del fabricante para conocer las funciones alternativas de los pines y las opciones de configuración. Esencial para el diseño de sistemas embebidos y el diseño de PCB.
No hay datos detallados de patillaje disponibles para MCIMX251AJM4.
Consulte la hoja de datos para ver la configuración completa de patillas.
Aplicaciones típicas
MCIMX251AJM4 es adecuado para 6 aplicacións: Automotive Infotainment Head Unit, Industrial HMI Panel, Point-of-Sale Terminal, Portable Medical Device, Smart Energy Gateway, Connected Embedded IoT Edge Node.
Automotive Infotainment Head Unit
The MCIMX251AJM4 fits automotive infotainment head-unit designs through its 400 MHz ARM926EJ-S compute headroom, integrated 12-bit ADC with touchscreen controller, dual USB PHYs, and DDR2 memory controller. The 144 KB on-chip SRAM accelerates boot-loader and HMI runtime tasks while the external DDR2 interface supports larger media buffers. With 128 GPIO lines, designers can drive TFT displays, button matrices, and rotary encoders without external I/O expanders. The integrated 10/100 Ethernet MAC with RMII also enables connected-vehicle telematics modules that share the same PCB.
Recomendado
Industrial HMI Panel
For industrial HMI panels, the MCIMX251AJM4 provides the right balance of ARM9 processing throughput, integrated peripherals, and low BOM cost. Its 12-bit ADC supports touch input without an external controller, while the LCD controller (in family derivatives) interfaces directly to TFT panels. The 400 MHz clock enables responsive multi-widget interfaces on QVGA and WVGA displays. The 400-LFBGA package allows compact PCB layouts suitable for panel-mount enclosures, and NXP's long-term silicon supply supports industrial product life cycles of 10+ years.
Recomendado
Point-of-Sale Terminal
Point-of-sale terminals benefit from the MCIMX251AJM4's integrated peripheral set: dual USB PHYs for barcode scanners and receipt printers, 10/100 Ethernet for IP-based payment terminals, and the 12-bit ADC for keypad scanning. The 400 MHz ARM9 core runs Linux and SSL/TLS stacks with sufficient throughput for EMV chip-card transaction times under 2 seconds. The 144 KB on-chip SRAM holds the secure boot-loader and PIN-pad firmware in tamper-responsive designs. NXP's automotive-grade pedigree also supports retail kiosks requiring wide temperature tolerance.
Recomendado
Portable Medical Device
Portable medical devices such as patient monitors and diagnostic handhelds use the MCIMX251AJM4 for its low-power ARM9 core, integrated USB PHYs for PC connectivity, and 12-bit ADC for sensor signal acquisition. The 144 KB on-chip SRAM supports real-time OS kernels and small DSP filters without external memory pressure. The 400 MHz clock headroom enables ECG/EEG waveform processing at clinical sampling rates, while the LFBGA package supports compact handheld form factors. The automotive temperature envelope also tolerates clinical and field-deployed environments.
Recomendado
Smart Energy Gateway
Smart energy gateways aggregate data from smart meters, HVAC controllers, and load-management devices. The MCIMX251AJM4's 10/100 Ethernet MAC with RMII interfaces directly to the home-area-network PHY, while the integrated USB and serial peripherals connect to Wi-Fi/Bluetooth modules for mesh networking. The 400 MHz ARM9 core runs MQTT, TLS, and DLMS/COSEM stacks for utility-grade metering protocols. The 144 KB on-chip SRAM buffers transient network bursts, and the DDR2 controller supports larger protocol stacks in flash-less builds.
Recomendado
Connected Embedded IoT Edge Node
For connected IoT edge nodes, the MCIMX251AJM4 integrates the connectivity peripherals (USB, Ethernet, SDIO) typically required to bridge Wi-Fi/Bluetooth modules to a local sensor bus. The 400 MHz ARM9 core runs lightweight edge-analytics workloads (TLS handshake, JSON parsing, simple thresholding) at <50 mW active power. The 400-LFBGA package supports compact edge-node PCBs, and NXP's longevity commitment aligns with industrial IoT deployment horizons. Designers can also leverage the i.MX25 Linux BSP for rapid prototyping.
Recomendado
Resumen de productos recomendados
Datos de referencia de ingeniería para MCIMX251AJM4 — comparación, orientación de diseño e información de cumplimiento.
Guía de selección
Comparación con alternativas
| Parámetro | Este producto | MCIMX251AJM4A | MCIMX253CJM4A | MCIMX258CJM4A |
|---|---|---|---|---|
| Package | 400-LFBGA (17x17 mm, 0.8 mm pitch) | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same | 400-LFBGA (17x17 mm, 0.8 mm pitch) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum Clock Frequency | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| On-Chip RAM | 144 KB | 144 KB | 144 KB | 144 KB |
| Number of I/O Lines | 128 | 128 | 128 | 128 |
| CAN Bus | No (i.MX251 sub-family) | No (i.MX251 sub-family) | Yes (i.MX253 sub-family adds CAN) | Yes (i.MX258 sub-family) |
| Enhanced Security | Standard | Standard | Standard | Enhanced (i.MX258 sub-family) |
| Silicon Revision | 1.2 | 1.2A (updated) | 1.2A | 1.2A |
Diferenciadores clave
- Original silicon revision vs updated A-suffix (frente a MCIMX251AJM4A)
- CAN bus integration (frente a MCIMX253CJM4A)
- Enhanced security features (frente a MCIMX258CJM4A)
Notas de diseño
The 400-LFBGA package at 0.8 mm pitch requires a minimum of 4 PCB routing layers and 0.4 mm via-in-pad geometry with NSMD landing pads. Thermal vias (0.3 mm drill, 1.0 mm pitch array) under the die-attach paddle are mandatory to dissipate the typical 1 W to 2 W active power envelope. Per NXP's reference design, use 0.8 mm solder ball openings with solder-mask-defined pads to reduce tombstoning during reflow.
The MCIMX251AJM4 requires separate core and I/O supply rails with power-up sequencing per the i.MX25 datasheet. Estimated: at 400 MHz active, core current draw is approximately 300 mA to 500 mA depending on workload; I/O rail at 3.3 V draws another 100 mA under typical GPIO loading. Designers should budget a 1.5x margin for inrush and transient loads. Decoupling capacitors must be placed within 1 mm of each supply ball pair.
When replacing the MCIMX251AJM4 with the MCIMX251AJM4A (or other i.MX25 sub-family members), verify the boot mode configuration word because some peripherals (CAN, security) are absent on i.MX251 but present on i.MX253/i.MX258. Estimated: typical 0.09 um CMOS process quiescent current is <5 mA in deep-sleep mode; failing to disable unused peripherals can increase standby current by 20x. Always consult the latest silicon errata document for the specific lot under consideration.
Información de cumplimiento
AEC-Q100 qualification referenced in i.MX25 family datasheet for automotive products suffix. RoHS and REACH compliance per distributor listings (DigiKey/Mouser).
