MCIMX251AJM4A - i.MX25 400MHz ARM9 Automotive MPU | NXP
MPN: MCIMX251AJM4A ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $34.58 | $34.58 |
| 10 | $31.12 | $311.20 |
| 100 | $27.66 | $2,766.00 |
| 500 | $24.21 | $12,105.00 |
| 1,000 | $22.48 | $22,480.00 |
MCIMX251AJM4A Overview
An applications processor (AP) is a system-on-chip (SoC) that integrates a CPU core, memory interfaces, peripheral controllers, and accelerator blocks into a single device targeting embedded product designs. APs sit at the top of the embedded hierarchy below the SoC level, combining the function of a microprocessor (MPU) with rich peripheral integration. The i.MX25 family is part of NXP's automotive-qualified Arm9 line, providing lower power consumption than Arm11/Cortex-A parts while still delivering sufficient performance for entry-level automotive HMI, telematics, and industrial HMI applications.
Key features include the ARM926EJ-S core with 16 KB instruction cache and 16 KB data cache, a maximum CPU clock of 400 MHz, an operating voltage range tied to 1.2V silicon, automotive temperature grade, and a 12-bit successive-approximation ADC. The integrated LCD controller supports STN/TFT panels and the Image Processing Unit (IPU) handles image scaling and color-space conversion. The two on-chip USB PHYs enable dual-USB designs without external transceiver ICs.
Typical applications include automotive infotainment entry-level head units, telematics control units (TCUs), instrument clusters, body controllers, industrial HMI panels, and point-of-sale terminals. The combination of LCD controller, touch-screen ADC, Ethernet, and USB provides a single-chip platform for these cost-optimized designs.
When designing with the MCIMX251AJM4A, ensure the PCB land pattern is the 400-ball MAP-BGA at 0.8 mm pitch, and verify DDR2 memory compatibility against the i.MX25 hardware reference manual. The automotive-grade silicon requires run-in-test and PCN awareness for long-lifecycle programs.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for MCIMX251AJM4A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with MCIMX251AJM4A (same form factor and footprint) — differing in LCD Controller, Data Cache, Instruction Cache, Mounting Type, RoHS Status.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
MCIMX251AJM4
✅ Drop-In✓ In Stock
$19.95 / Unit
View Datasheet →MCIMX257DJM4A
✅ Drop-In✓ In Stock
$16.54 / Unit
View Datasheet →MCIMX253DJM4A
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX251CJM4A
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX255DJM4A
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX251AJM4A Maximum Ratings & Electrical Characteristics
| Core Architecture | ARM926EJ-S |
| Core Count | 1 |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 400 MHz |
| Silicon Version | 1.2 |
| Instruction Cache | 16 KB |
| Data Cache | 16 KB |
| Operating Supply Voltage | -0.5 V to +1.52 V (core rail, see datasheet) |
| Maximum Operating Temperature | +85 C |
| Package | 400-ball MAP-BGA, 17x17 mm, 0.8 mm pitch |
| Mounting Type | Surface Mount |
| Packaging | Tray |
| Automotive Grade | Yes (AEC-Q100 qualified, automotive temperature) |
| Integrated USB PHYs | 2 |
| On-chip ADC | 12-bit |
| Ethernet | 10/100 with RMII |
| Memory Interface | DDR2, LPDDR, MMC/SD/SDIO |
| LCD Controller | Yes (STN/TFT) |
| RoHS Status | Compliant (per NXP product page) |
MCIMX251AJM4A 400-ball map-bga, 17x17 mm, 0.8 mm pitch Pin Configuration Guide
Pin configuration for MCIMX251AJM4A (400-ball map-bga, 17x17 mm, 0.8 mm pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX251AJM4A.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX251AJM4A is suitable for 6 applications: Automotive Infotainment Entry-Level Head Unit, Telematics Control Unit (TCU), Industrial HMI Panel, Body Control Module (BCM), Point-of-Sale (POS) Terminal, Portable Data Logger.
Automotive Infotainment Entry-Level Head Unit
The MCIMX251AJM4A fits automotive infotainment entry-level head units because its ARM926EJ-S core at 400 MHz and integrated peripherals deliver enough throughput for basic audio, radio, and Bluetooth hands-free while keeping BOM cost low. The integrated LCD controller directly drives STN/TFT panels used in monochrome or low-resolution color displays, eliminating the need for an external graphics controller. With two on-chip USB PHYs, the design can support USB media playback plus USB debug simultaneously, and the 10/100 Ethernet with RMII enables connected-car telematics overlays. AEC-Q100 qualification ensures reliable operation under the -40C to +85C automotive temperature range and vehicle EMI stress.
Recommended
Telematics Control Unit (TCU)
The MCIMX251AJM4A suits telematics control units because its 400 MHz Arm9 core runs TCP/IP stacks and cellular-modem management code with low power consumption. The 10/100 Ethernet with RMII interface provides a deterministic backhaul link to gateway ECUs, while the two USB PHYs support cellular modem and Wi-Fi/Bluetooth module attachments. The 12-bit ADC reads battery voltage and ignition state directly, removing the need for external monitoring ICs. AEC-Q100 and +85C automotive temperature qualification meet TCU deployment requirements in cabin and under-hood environments.
Recommended
Industrial HMI Panel
The MCIMX251AJM4A is a strong fit for industrial HMI panels because the integrated LCD controller supports STN/TFT panels up to VGA-class resolution, and the 12-bit ADC digitizes 4-wire resistive touch screens without an external touch controller. The 400 MHz ARM926EJ-S core handles LVGL or embedded Qt graphical stacks at 30+ fps for machine status UIs. Two USB ports allow simultaneous Wi-Fi/Bluetooth dongle and USB stick data logging, while the MMC/SD/SDIO interface supports firmware update media in the field. Although qualified to automotive standards, the temperature range and reliability profile also suit factory-floor HMIs.
Recommended
Body Control Module (BCM)
The MCIMX251AJM4A serves body control modules because its rich GPIO, CAN, LIN, and Ethernet mix consolidates multiple domain functions into one MPU. The 400 MHz core runs AUTOSAR-compatible RTOS instances for body, lighting, and door-zone controllers, while the ADC channels read switch inputs and the PWM timers drive LED loads. Two USB PHYs provide service-diagnostic ports alongside the in-vehicle network. Automotive qualification and long-life NXP silicon supply make this part suitable for BCM designs spanning 10+ year production runs.
Recommended
Point-of-Sale (POS) Terminal
The MCIMX251AJM4A is well matched to point-of-sale terminals because the ARM926EJ-S core at 400 MHz runs embedded Linux with payment stacks, the LCD controller drives the operator TFT, and the 12-bit ADC reads the resistive touch overlay. The two USB PHYs accept a magnetic-stripe reader and a receipt printer simultaneously, and the 10/100 Ethernet enables back-office connectivity. The on-chip SRAM reduces external memory cost, helping hit aggressive POS BOM targets in retail deployments.
Recommended
Portable Data Logger
The MCIMX251AJM4A fits portable data loggers because its ARM9 architecture consumes lower power than Cortex-A equivalents at idle, extending battery life in field-deployed loggers. The 12-bit ADC and MMC/SD/SDIO interface allow direct sensor reading and removable storage without glue logic. The USB PHY supports charging and data offload through a single port. Automotive-grade silicon tolerance to temperature and vibration also benefits industrial logging applications in harsh environments.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX251AJM4A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX251AJM4 | MCIMX257DJM4A | MCIMX253DJM4A | MCIMX251CJM4A | MCIMX255DJM4A |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | MAP-BGA-400 (17x17 mm) | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same | MAP-BGA-400 (17x17 mm) - same |
| Core | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S | ARM926EJ-S |
| Maximum CPU Clock | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz | 400 MHz |
| Silicon Version | 1.2 | Pre-1.2 | 1.2 | 1.2 | 1.2 | 1.2 |
| Automotive Grade | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | Yes (AEC-Q100) | No (commercial) | Yes (AEC-Q100) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | 0C to +70C | -40C to +85C |
| Peripheral Highlight | Dual USB + LCD + Ethernet | Dual USB + LCD + Ethernet | Adds security extensions | Lower peripheral mix | Same as A, commercial temp | Enhanced graphics accelerator |
Key Differentiators
- Silicon version 1.2 with latest errata fixes (vs MCIMX251AJM4)
- Higher peripheral integration than i.MX253 (vs MCIMX253DJM4A)
- Automotive AEC-Q100 temperature grade vs commercial (vs MCIMX251CJM4A)
Design Notes
Use a 400-ball MAP-BGA land pattern at 0.8 mm pitch with at least 6 layers to route DDR2 cleanly. Match trace lengths for DDR2 byte lanes per the i.MX25 hardware design guide (IMX25HDG) and provide a continuous ground reference plane under the BGA. Decouple every VDD core ball with a 100 nF X7R placed within 2 mm of the ball, and bulk-decouple the 1.38V rail with at least 22 uF total ceramic + 47 uF tantalum. The BGA thermal pad requires stitching vias to inner ground planes for heat dissipation at 400 MHz operation.
Estimated: at 400 MHz full CPU load with both USB PHYs active and DDR2 traffic, the silicon power dissipation is approximately 1.2 W (core) plus 0.4 W (I/O), totaling ~1.6 W. With theta_JA in the range of 18-22 C/W for the MAP-BGA-400 on a 6-layer JEDEC board, junction-to-ambient rise is approximately 30-35 C above ambient. At +85 C automotive ambient this gives ~120 C junction - within automotive limits, but a bottom-side thermal pad with stitched vias is required to stay within Tj_max. Add a heat spreader for continuous full-CPU workloads.
Do not confuse silicon version 1.2 (MCIMX251AJM4A) with the pre-1.2 revision (MCIMX251AJM4): boot mode handling and errata differ. Do not exceed the absolute maximum core voltage of 1.52V listed in the verified web data - automotive 12V transients on the input rail require a pre-regulator and TVS clamp. Always strap the boot mode pins through 10 kohm pull resistors to known states; floating BOOT pins cause unpredictable boot behavior on the first power-on.
Compliance Information
RoHS compliance per NXP product page; AEC-Q100 qualified per automotive product line. Halogen-free status not stated in verified data - marked unknown.
