MCIMX6D5EZK08AD - i.MX6Dual 800MHz ARM Cortex-A9 MPU | NXP
料号： MCIMX6D5EZK08AD ⚠ 最后一次采购MCIMX6D5EZK08AD 概述
An applications processor (AP) is a high-integration system-on-chip that combines one or more CPU cores, graphics, memory controllers, display/touch interfaces and I/O into a single IC for embedded multimedia products. In the broader taxonomy, the i.MX6D sits within microprocessors / MPUs, then ARM Cortex-A class processors, then multimedia APs; it is the typical application processor used between an OS kernel (Linux, Android, Windows Embedded) and peripherals such as LCD panels, camera sensors, audio codecs, and Ethernet PHYs. Compared with a microcontroller (MCU), an MPU like the MCIMX6D5EZK08AD runs at GHz-class clocks with an MMU, enabling full OS support and complex user interfaces.
Key features include the dual-core ARM Cortex-A9 core complex with NEON SIMD and VFPv3, hardware-accelerated multi-format video engine (VPU), 2D/3D graphics GPU (GC880 + GC320), dual-display support up to two independent LVDS or HDMI outputs, integrated SATA-II, PCIe 2.0, multiple USB 2.0 ports (one with HSIC), and a rich mix of audio, MIPI-CSI camera and MIPI-DSI display interfaces. The 569-ball MAPBGA POP variant allows a companion memory package (typically DDR3 / LPDDR2) to be stacked directly on top, simplifying PCB layout and reducing board area.
Typical applications include automotive infotainment head units, industrial HMI / factory-control panels, smart-home gateways, point-of-sale terminals, and medical patient-monitoring displays. The wide operating-temperature range, hardware video codec and dual-display capability are the main reasons the i.MX6D is selected for these designs rather than a smaller MCU.
When designing with the MCIMX6D5EZK08AD, follow the NXP Hardware Development Guide for the i.MX6 family: respect the strict DDR3/LPDDR2 routing topology (matched lengths, controlled impedance), provide a clean multi-rail power tree, and use only NXP-qualified POP memory stacks to keep signal-integrity within datasheet margins. The part is RoHS compliant and shipped in trays; long-term availability must be confirmed with NXP because the i.MX 6Dual line is on the manufacturer's product-change / discontinuance track.
This page synthesizes distributor pricing from Mouser, DigiKey and Octopart, drop-in / package-compatible alternatives from NXP's i.MX6 family, and practical board-design notes not found in the standalone datasheet PDF.
直接替换替代料： MCIMX6D5EZK08AD ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
MCIMX6D5EZK08AE
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D6AVT10AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D7CVT08AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6D5EZK10AD
✅ 直接替换📋 参考替代料（不在目录中）
MCIMX6DP4AVT8AA
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX6D5EYM10AD
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MCIMX6D5EZK08AD 最大额定值与电气特性
| Part Number | MCIMX6D5EZK08AD |
| Series | i.MX 6 |
| Core Architecture | ARM Cortex-A9 |
| Number of Cores | 2 (Dual) |
| 数据总线宽度 | 32-bit |
| Maximum CPU Clock | 800 MHz |
| 工作温度 | -40C to +85C |
| 封装 / 外壳 | 569-MAPBGA (12x12 mm) |
| Package Type | MAPBGA with POP memory interface |
| 安装类型 | Surface Mount |
| 存储器类型 | L1 (per core) + unified L2 cache |
| Peripherals | SATA-II, PCIe 2.0, USB 2.0, HSIC, MIPI-CSI, MIPI-DSI, HDMI, LVDS, Ethernet MAC, I2C, SPI, UART, I2S |
| Graphics | 2D (GC320) + 3D (GC880) GPU + VPU hardware codec |
| Display Support | Dual-display, up to 1080p |
| Compliance / RoHS | RoHS compliant |
| Lead-Free | Yes |
MCIMX6D5EZK08AD mapbga with pop memory interface 引脚配置指南
MCIMX6D5EZK08AD（mapbga with pop memory interface 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MCIMX6D5EZK08AD.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MCIMX6D5EZK08AD 适用于 6 应用s: Automotive Infotainment Head Unit, Industrial HMI / Factory Control Panel, Smart-Home / IoT Gateway, Point-of-Sale (POS) Terminal, Medical Patient-Monitor Display, Multimedia / Digital Signage Player.
Automotive Infotainment Head Unit
The MCIMX6D5EZK08AD suits automotive infotainment head units because its dual ARM Cortex-A9 cores at 800 MHz deliver enough compute for Linux/QNX infotainment stacks, while the integrated GC880 3D GPU drives 3D-style HVAC and gauge-cluster graphics. The hardware VPU decodes H.264 1080p streams for rear-seat-entertainment playback without loading the CPU, and dual-display support drives both the central stack and the passenger-side display simultaneously. Per the NXP i.MX6 hardware guide, the integrated HDMI / LVDS / MIPI-DSI controllers connect directly to automotive-grade TFT panels without external bridges.
推荐
Industrial HMI / Factory Control Panel
The MCIMX6D5EZK08AD is a strong match for industrial HMI panels thanks to its -40C to +85C industrial operating range, dual-core CPU for parallel polling of fieldbus protocols, and integrated touch / display controllers that connect directly to industrial TFTs. The dual-core Cortex-A9 comfortably runs a real-time Linux stack while the Vivante GPU renders SCADA visualizations, trending charts and animated machinery diagrams at 60 fps. The PCIe 2.0 and SATA-II interfaces support industrial SSDs and gigabit-Ethernet PHYs such as the i.MX6 reference design's AR8031, allowing predictive-maintenance telemetry over standard factory networks.
推荐
Smart-Home / IoT Gateway
For smart-home gateways the MCIMX6D5EZK08AD's dual-core architecture handles simultaneous Wi-Fi/BLE management, Zigbee / Z-Wave bridge software, and cloud-side MQTT / TLS encryption workloads. The hardware video engine supports camera-stream analytics (H.264 decode for video doorbells and NVR review) while the dual-display capability drives both a touchscreen keypad and a separate wall-mounted status display. Low-power power states integrated in the i.MX6 silicon allow the gateway to idle at sub-1 W while still responding to voice-assistant wake events on a wake-word interrupt.
推荐
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX6D5EZK08AD's dual-display support (one for the cashier, one for the customer-facing display), hardware-accelerated H.264 for digital signage loops, and the secure-boot / hardware crypto accelerators inside the i.MX6 silicon. The 2D GC320 GPU accelerates QR / barcode scanning overlays, while the high-bandwidth LPDDR2 interface keeps touchscreen latency low even under heavy transaction logging. NXP's reference design shows a typical POS layout using the i.MX6 SATA-II for an internal SSD plus the PCIe lane for a contactless card-reader module.
推荐
Medical Patient-Monitor Display
The MCIMX6D5EZK08AD is used in medical patient monitors because the dual-core Cortex-A9 handles real-time vital-sign acquisition on one core while running the GUI / waveform rendering on the second core, with deterministic Linux scheduling. The integrated GPU accelerates ECG / SpO2 / respiration waveform traces at high refresh rates, and the MIPI-CSI input connects directly to medical-grade CMOS sensors without an external bridge. The i.MX6 hardware cryptographic engine supports HIPAA-compliant data encryption before records are pushed to the EMR system over Ethernet.
推荐
Multimedia / Digital Signage Player
The MCIMX6D5EZK08AD's hardware VPU decodes dual 1080p H.264 video streams simultaneously, which is exactly what dual-screen digital signage and video-wall controllers need. Its HDMI / LVDS outputs support two independent panels up to 1080p each, removing the need for an external splitter or video bridge. The integrated SATA-II connects directly to a 2.5" SSD storing many gigabytes of signage media, and the rich Linux / Android BSP ecosystem reduces time-to-market for signage OEMs.
推荐
推荐产品汇总
工程参考数据： MCIMX6D5EZK08AD ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCIMX6D5EZK08AE | MCIMX6D6AVT10AD | MCIMX6D7CVT08AD | MCIMX6D5EZK10AD |
|---|---|---|---|---|---|
| Package | 569-MAPBGA (12x12) POP | 569-MAPBGA (12x12) POP - same | 569-MAPBGA (12x12) POP - same | 569-MAPBGA (12x12) POP - same | 569-MAPBGA (12x12) POP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Maximum CPU Clock | 800 MHz | 800 MHz | 1.0 GHz | 800 MHz | 1.0 GHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C (auto) | -40C to +85C | -40C to +85C |
| Automotive Grade (AEC-Q100) | No | No | Yes | No | No |
| GPU | GC880 3D + GC320 2D | GC880 3D + GC320 2D | GC880 3D + GC320 2D | GC880 3D + GC320 2D | GC880 3D + GC320 2D |
| Hardware Video Engine (VPU) | Yes - multi-format HD | Yes - multi-format HD | Yes - multi-format HD | Yes - multi-format HD | Yes - multi-format HD |
| Memory Interface | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 |
| Display Support | Dual 1080p | Dual 1080p | Dual 1080p | Dual 1080p | Dual 1080p |
关键差异点
- Lowest-speed industrial-grade 6Dual in the 569 MAPBGA POP family （对比 MCIMX6D6AVT10AD)
- Identical 569 MAPBGA POP package as the rest of the i.MX6D family （对比 MCIMX6D5EZK10AD)
- Industrial-grade temperature range without automotive cost （对比 MCIMX6D6AVT10AD)
设计说明
The 569-ball MAPBGA POP package requires tight PCB routing - per the NXP i.MX6 hardware development guide, route the DDR3 / LPDDR2 traces with matched lengths within +/-25 mil and controlled 50 ohm single-ended impedance. Use the NXP-validated POP memory stack from the SABRE reference design to avoid signal-integrity failures at boot; a non-validated POP stack is one of the most common sources of i.MX6 boot instability.
Follow the multi-rail power sequence documented in the i.MX6 reference manual - core, GPU, DDR, and I/O rails must be enabled in the correct order to prevent latch-up. The companion NXP PF0100 / TPS65910 PMIC implements this sequence automatically and is the qualified choice for new designs. Estimated: at 1.0 GHz dual-core load the MPU can draw up to ~2 W from the core rail alone, so size the buck inductors and the thermal copper pour accordingly.
At an ambient of 85C with both Cortex-A9 cores at full load and the VPU decoding HD video, junction-to-ambient thermal rise must stay below the 85C spec - budget carefully for system airflow or attach a small BGA heatsink. Estimated: thermal resistance theta_JB for the 569 MAPBGA is on the order of 2 C/W, so the bulk of the 5-7 W total power must be sunk to the PCB thermal vias beneath the package. Use a thermal-via array (0.3 mm pitch) on the BGA central thermal balls to keep Tj in spec.
合规信息
RoHS compliance is per NXP's product page; AEC-Q100 is not applicable (industrial grade, not automotive grade). Halogen-free and conflict-mineral status are not explicitly listed in the verified web data - set to 'unknown' rather than guessed.
