MCIMX6D5EZK08AD - i.MX6Dual 800MHz ARM Cortex-A9 MPU | NXP
MPN: MCIMX6D5EZK08AD ⚠ Last Time BuyMCIMX6D5EZK08AD Overview
An applications processor (AP) is a high-integration system-on-chip that combines one or more CPU cores, graphics, memory controllers, display/touch interfaces and I/O into a single IC for embedded multimedia products. In the broader taxonomy, the i.MX6D sits within microprocessors / MPUs, then ARM Cortex-A class processors, then multimedia APs; it is the typical application processor used between an OS kernel (Linux, Android, Windows Embedded) and peripherals such as LCD panels, camera sensors, audio codecs, and Ethernet PHYs. Compared with a microcontroller (MCU), an MPU like the MCIMX6D5EZK08AD runs at GHz-class clocks with an MMU, enabling full OS support and complex user interfaces.
Key features include the dual-core ARM Cortex-A9 core complex with NEON SIMD and VFPv3, hardware-accelerated multi-format video engine (VPU), 2D/3D graphics GPU (GC880 + GC320), dual-display support up to two independent LVDS or HDMI outputs, integrated SATA-II, PCIe 2.0, multiple USB 2.0 ports (one with HSIC), and a rich mix of audio, MIPI-CSI camera and MIPI-DSI display interfaces. The 569-ball MAPBGA POP variant allows a companion memory package (typically DDR3 / LPDDR2) to be stacked directly on top, simplifying PCB layout and reducing board area.
Typical applications include automotive infotainment head units, industrial HMI / factory-control panels, smart-home gateways, point-of-sale terminals, and medical patient-monitoring displays. The wide operating-temperature range, hardware video codec and dual-display capability are the main reasons the i.MX6D is selected for these designs rather than a smaller MCU.
When designing with the MCIMX6D5EZK08AD, follow the NXP Hardware Development Guide for the i.MX6 family: respect the strict DDR3/LPDDR2 routing topology (matched lengths, controlled impedance), provide a clean multi-rail power tree, and use only NXP-qualified POP memory stacks to keep signal-integrity within datasheet margins. The part is RoHS compliant and shipped in trays; long-term availability must be confirmed with NXP because the i.MX 6Dual line is on the manufacturer's product-change / discontinuance track.
This page synthesizes distributor pricing from Mouser, DigiKey and Octopart, drop-in / package-compatible alternatives from NXP's i.MX6 family, and practical board-design notes not found in the standalone datasheet PDF.
Drop-in alternatives for MCIMX6D5EZK08AD — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
MCIMX6D5EZK08AE
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6D6AVT10AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6D7CVT08AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6D5EZK10AD
✅ Drop-In📋 Reference alternative (not in catalog)
MCIMX6DP4AVT8AA
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX6D5EYM10AD
✅ Drop-In ⚠️ Specs Unverified📋 Reference alternative (not in catalog)
MCIMX6D5EZK08AD Maximum Ratings & Electrical Characteristics
| Part Number | MCIMX6D5EZK08AD |
| Series | i.MX 6 |
| Core Architecture | ARM Cortex-A9 |
| Number of Cores | 2 (Dual) |
| Data Bus Width | 32-bit |
| Maximum CPU Clock | 800 MHz |
| Operating Temperature | -40C to +85C |
| Package / Case | 569-MAPBGA (12x12 mm) |
| Package Type | MAPBGA with POP memory interface |
| Mounting Type | Surface Mount |
| Memory Type | L1 (per core) + unified L2 cache |
| Peripherals | SATA-II, PCIe 2.0, USB 2.0, HSIC, MIPI-CSI, MIPI-DSI, HDMI, LVDS, Ethernet MAC, I2C, SPI, UART, I2S |
| Graphics | 2D (GC320) + 3D (GC880) GPU + VPU hardware codec |
| Display Support | Dual-display, up to 1080p |
| Compliance / RoHS | RoHS compliant |
| Lead-Free | Yes |
MCIMX6D5EZK08AD mapbga with pop memory interface Pin Configuration Guide
Pin configuration for MCIMX6D5EZK08AD (mapbga with pop memory interface package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for MCIMX6D5EZK08AD.
Refer to the datasheet for full pin configuration.
Typical Applications
MCIMX6D5EZK08AD is suitable for 6 applications: Automotive Infotainment Head Unit, Industrial HMI / Factory Control Panel, Smart-Home / IoT Gateway, Point-of-Sale (POS) Terminal, Medical Patient-Monitor Display, Multimedia / Digital Signage Player.
Automotive Infotainment Head Unit
The MCIMX6D5EZK08AD suits automotive infotainment head units because its dual ARM Cortex-A9 cores at 800 MHz deliver enough compute for Linux/QNX infotainment stacks, while the integrated GC880 3D GPU drives 3D-style HVAC and gauge-cluster graphics. The hardware VPU decodes H.264 1080p streams for rear-seat-entertainment playback without loading the CPU, and dual-display support drives both the central stack and the passenger-side display simultaneously. Per the NXP i.MX6 hardware guide, the integrated HDMI / LVDS / MIPI-DSI controllers connect directly to automotive-grade TFT panels without external bridges.
Recommended
Industrial HMI / Factory Control Panel
The MCIMX6D5EZK08AD is a strong match for industrial HMI panels thanks to its -40C to +85C industrial operating range, dual-core CPU for parallel polling of fieldbus protocols, and integrated touch / display controllers that connect directly to industrial TFTs. The dual-core Cortex-A9 comfortably runs a real-time Linux stack while the Vivante GPU renders SCADA visualizations, trending charts and animated machinery diagrams at 60 fps. The PCIe 2.0 and SATA-II interfaces support industrial SSDs and gigabit-Ethernet PHYs such as the i.MX6 reference design's AR8031, allowing predictive-maintenance telemetry over standard factory networks.
Recommended
Smart-Home / IoT Gateway
For smart-home gateways the MCIMX6D5EZK08AD's dual-core architecture handles simultaneous Wi-Fi/BLE management, Zigbee / Z-Wave bridge software, and cloud-side MQTT / TLS encryption workloads. The hardware video engine supports camera-stream analytics (H.264 decode for video doorbells and NVR review) while the dual-display capability drives both a touchscreen keypad and a separate wall-mounted status display. Low-power power states integrated in the i.MX6 silicon allow the gateway to idle at sub-1 W while still responding to voice-assistant wake events on a wake-word interrupt.
Recommended
Point-of-Sale (POS) Terminal
POS terminals benefit from the MCIMX6D5EZK08AD's dual-display support (one for the cashier, one for the customer-facing display), hardware-accelerated H.264 for digital signage loops, and the secure-boot / hardware crypto accelerators inside the i.MX6 silicon. The 2D GC320 GPU accelerates QR / barcode scanning overlays, while the high-bandwidth LPDDR2 interface keeps touchscreen latency low even under heavy transaction logging. NXP's reference design shows a typical POS layout using the i.MX6 SATA-II for an internal SSD plus the PCIe lane for a contactless card-reader module.
Recommended
Medical Patient-Monitor Display
The MCIMX6D5EZK08AD is used in medical patient monitors because the dual-core Cortex-A9 handles real-time vital-sign acquisition on one core while running the GUI / waveform rendering on the second core, with deterministic Linux scheduling. The integrated GPU accelerates ECG / SpO2 / respiration waveform traces at high refresh rates, and the MIPI-CSI input connects directly to medical-grade CMOS sensors without an external bridge. The i.MX6 hardware cryptographic engine supports HIPAA-compliant data encryption before records are pushed to the EMR system over Ethernet.
Recommended
Multimedia / Digital Signage Player
The MCIMX6D5EZK08AD's hardware VPU decodes dual 1080p H.264 video streams simultaneously, which is exactly what dual-screen digital signage and video-wall controllers need. Its HDMI / LVDS outputs support two independent panels up to 1080p each, removing the need for an external splitter or video bridge. The integrated SATA-II connects directly to a 2.5" SSD storing many gigabytes of signage media, and the rich Linux / Android BSP ecosystem reduces time-to-market for signage OEMs.
Recommended
Recommended Products Summary
Engineering reference data for MCIMX6D5EZK08AD — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | MCIMX6D5EZK08AE | MCIMX6D6AVT10AD | MCIMX6D7CVT08AD | MCIMX6D5EZK10AD |
|---|---|---|---|---|---|
| Package | 569-MAPBGA (12x12) POP | 569-MAPBGA (12x12) POP - same | 569-MAPBGA (12x12) POP - same | 569-MAPBGA (12x12) POP - same | 569-MAPBGA (12x12) POP - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Architecture | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 | Dual ARM Cortex-A9 |
| Maximum CPU Clock | 800 MHz | 800 MHz | 1.0 GHz | 800 MHz | 1.0 GHz |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +125C (auto) | -40C to +85C | -40C to +85C |
| Automotive Grade (AEC-Q100) | No | No | Yes | No | No |
| GPU | GC880 3D + GC320 2D | GC880 3D + GC320 2D | GC880 3D + GC320 2D | GC880 3D + GC320 2D | GC880 3D + GC320 2D |
| Hardware Video Engine (VPU) | Yes - multi-format HD | Yes - multi-format HD | Yes - multi-format HD | Yes - multi-format HD | Yes - multi-format HD |
| Memory Interface | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 | POP LPDDR2 / DDR3 |
| Display Support | Dual 1080p | Dual 1080p | Dual 1080p | Dual 1080p | Dual 1080p |
Key Differentiators
- Lowest-speed industrial-grade 6Dual in the 569 MAPBGA POP family (vs MCIMX6D6AVT10AD)
- Identical 569 MAPBGA POP package as the rest of the i.MX6D family (vs MCIMX6D5EZK10AD)
- Industrial-grade temperature range without automotive cost (vs MCIMX6D6AVT10AD)
Design Notes
The 569-ball MAPBGA POP package requires tight PCB routing - per the NXP i.MX6 hardware development guide, route the DDR3 / LPDDR2 traces with matched lengths within +/-25 mil and controlled 50 ohm single-ended impedance. Use the NXP-validated POP memory stack from the SABRE reference design to avoid signal-integrity failures at boot; a non-validated POP stack is one of the most common sources of i.MX6 boot instability.
Follow the multi-rail power sequence documented in the i.MX6 reference manual - core, GPU, DDR, and I/O rails must be enabled in the correct order to prevent latch-up. The companion NXP PF0100 / TPS65910 PMIC implements this sequence automatically and is the qualified choice for new designs. Estimated: at 1.0 GHz dual-core load the MPU can draw up to ~2 W from the core rail alone, so size the buck inductors and the thermal copper pour accordingly.
At an ambient of 85C with both Cortex-A9 cores at full load and the VPU decoding HD video, junction-to-ambient thermal rise must stay below the 85C spec - budget carefully for system airflow or attach a small BGA heatsink. Estimated: thermal resistance theta_JB for the 569 MAPBGA is on the order of 2 C/W, so the bulk of the 5-7 W total power must be sunk to the PCB thermal vias beneath the package. Use a thermal-via array (0.3 mm pitch) on the BGA central thermal balls to keep Tj in spec.
Compliance Information
RoHS compliance is per NXP's product page; AEC-Q100 is not applicable (industrial grade, not automotive grade). Halogen-free and conflict-mineral status are not explicitly listed in the verified web data - set to 'unknown' rather than guessed.
