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NXP Semiconductors

MCIMX6D5EZK08AD - i.MX6Dual 800MHz ARM Cortex-A9 MPU | NXP

Référence : MCIMX6D5EZK08AD ⚠ Dernier achat
569-MAPBGA (12x12 mm) Package 800 MHz Speed L1 (per core) + unified L2 cache Memory
MOQ : 1 |

MCIMX6D5EZK08AD Présentation

The NXP MCIMX6D5EZK08AD is a 32-bit applications processor from the i.MX 6 series, featuring two ARM Cortex-A9 cores running at 800 MHz, packaged in a 569-ball MAPBGA (12 mm x 12 mm) with Package-on-Package (POP) memory support. It belongs to the i.MX 6Dual family, a dual-core variant of the i.MX6 platform that targets multimedia and industrial HMI applications, with on-chip L1 cache and a unified L2 cache, plus a pixel-processing pipeline, GPU and multiple connectivity peripherals.

An applications processor (AP) is a high-integration system-on-chip that combines one or more CPU cores, graphics, memory controllers, display/touch interfaces and I/O into a single IC for embedded multimedia products. In the broader taxonomy, the i.MX6D sits within microprocessors / MPUs, then ARM Cortex-A class processors, then multimedia APs; it is the typical application processor used between an OS kernel (Linux, Android, Windows Embedded) and peripherals such as LCD panels, camera sensors, audio codecs, and Ethernet PHYs. Compared with a microcontroller (MCU), an MPU like the MCIMX6D5EZK08AD runs at GHz-class clocks with an MMU, enabling full OS support and complex user interfaces.

Key features include the dual-core ARM Cortex-A9 core complex with NEON SIMD and VFPv3, hardware-accelerated multi-format video engine (VPU), 2D/3D graphics GPU (GC880 + GC320), dual-display support up to two independent LVDS or HDMI outputs, integrated SATA-II, PCIe 2.0, multiple USB 2.0 ports (one with HSIC), and a rich mix of audio, MIPI-CSI camera and MIPI-DSI display interfaces. The 569-ball MAPBGA POP variant allows a companion memory package (typically DDR3 / LPDDR2) to be stacked directly on top, simplifying PCB layout and reducing board area.

Typical applications include automotive infotainment head units, industrial HMI / factory-control panels, smart-home gateways, point-of-sale terminals, and medical patient-monitoring displays. The wide operating-temperature range, hardware video codec and dual-display capability are the main reasons the i.MX6D is selected for these designs rather than a smaller MCU.

When designing with the MCIMX6D5EZK08AD, follow the NXP Hardware Development Guide for the i.MX6 family: respect the strict DDR3/LPDDR2 routing topology (matched lengths, controlled impedance), provide a clean multi-rail power tree, and use only NXP-qualified POP memory stacks to keep signal-integrity within datasheet margins. The part is RoHS compliant and shipped in trays; long-term availability must be confirmed with NXP because the i.MX 6Dual line is on the manufacturer's product-change / discontinuance track.

This page synthesizes distributor pricing from Mouser, DigiKey and Octopart, drop-in / package-compatible alternatives from NXP's i.MX6 family, and practical board-design notes not found in the standalone datasheet PDF.

Alternatives de remplacement direct pour MCIMX6D5EZK08AD — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

MCIMX6D5EZK08AE

✅ Remplacement direct
📦 569-MAPBGA (12x12) POP
Same die, lead-free RoHS-compliant packaging variant, identical 800 MHz speed grade

📋 Alternative de référence (hors catalogue)

MCIMX6D6AVT10AD

✅ Remplacement direct
📦 569-MAPBGA (12x12) POP
Same 569 MAPBGA package, 1.0 GHz clock vs 800 MHz (+25%), AEC-Q100 automotive grade (-40C to +125C vs -40C to +85C)

📋 Alternative de référence (hors catalogue)

MCIMX6D7CVT08AD

✅ Remplacement direct
📦 569-MAPBGA (12x12) POP
Same 569 MAPBGA POP footprint, 800 MHz industrial grade, identical peripherals and GPU

📋 Alternative de référence (hors catalogue)

MCIMX6D5EZK10AD

✅ Remplacement direct
📦 569-MAPBGA (12x12) POP
Same die/family, 1.0 GHz industrial speed grade, 569 MAPBGA POP identical footprint

📋 Alternative de référence (hors catalogue)

MCIMX6DP4AVT8AA

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 569-MAPBGA (12x12) POP
Same i.MX 6Dual silicon, 800 MHz industrial / consumer tier, alternative temperature grade within same package

📋 Alternative de référence (hors catalogue)

MCIMX6D5EYM10AD

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 569-MAPBGA (12x12) POP
Same i.MX6D family, 1.0 GHz speed grade, identical 569 MAPBGA POP land pattern

📋 Alternative de référence (hors catalogue)

MCIMX6D5EZK08AD Valeurs maximales et caractéristiques électriques

Part Number MCIMX6D5EZK08AD
Series i.MX 6
Core Architecture ARM Cortex-A9
Number of Cores 2 (Dual)
Largeur du bus de données 32-bit
Maximum CPU Clock 800 MHz
Température de fonctionnement -40C to +85C
Boîtier / Format 569-MAPBGA (12x12 mm)
Package Type MAPBGA with POP memory interface
Type de montage Surface Mount
Type de mémoire L1 (per core) + unified L2 cache
Peripherals SATA-II, PCIe 2.0, USB 2.0, HSIC, MIPI-CSI, MIPI-DSI, HDMI, LVDS, Ethernet MAC, I2C, SPI, UART, I2S
Graphics 2D (GC320) + 3D (GC880) GPU + VPU hardware codec
Display Support Dual-display, up to 1080p
Compliance / RoHS RoHS compliant
Lead-Free Yes

Guide de configuration des broches du MCIMX6D5EZK08AD mapbga with pop memory interface

Configuration des broches du MCIMX6D5EZK08AD (boîtier mapbga with pop memory interface). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.

Schéma de brochage du boîtier mapbga with pop memory interface pour le MCIMX6D5EZK08AD

Aucune donnée de brochage détaillée disponible pour MCIMX6D5EZK08AD.

Consultez la fiche technique pour la configuration complète des broches.

Applications typiques

MCIMX6D5EZK08AD convient pour 6 applications: Automotive Infotainment Head Unit, Industrial HMI / Factory Control Panel, Smart-Home / IoT Gateway, Point-of-Sale (POS) Terminal, Medical Patient-Monitor Display, Multimedia / Digital Signage Player.

🚗

Automotive Infotainment Head Unit

The MCIMX6D5EZK08AD suits automotive infotainment head units because its dual ARM Cortex-A9 cores at 800 MHz deliver enough compute for Linux/QNX infotainment stacks, while the integrated GC880 3D GPU drives 3D-style HVAC and gauge-cluster graphics. The hardware VPU decodes H.264 1080p streams for rear-seat-entertainment playback without loading the CPU, and dual-display support drives both the central stack and the passenger-side display simultaneously. Per the NXP i.MX6 hardware guide, the integrated HDMI / LVDS / MIPI-DSI controllers connect directly to automotive-grade TFT panels without external bridges.

🏭

Industrial HMI / Factory Control Panel

The MCIMX6D5EZK08AD is a strong match for industrial HMI panels thanks to its -40C to +85C industrial operating range, dual-core CPU for parallel polling of fieldbus protocols, and integrated touch / display controllers that connect directly to industrial TFTs. The dual-core Cortex-A9 comfortably runs a real-time Linux stack while the Vivante GPU renders SCADA visualizations, trending charts and animated machinery diagrams at 60 fps. The PCIe 2.0 and SATA-II interfaces support industrial SSDs and gigabit-Ethernet PHYs such as the i.MX6 reference design's AR8031, allowing predictive-maintenance telemetry over standard factory networks.

🧩

Smart-Home / IoT Gateway

For smart-home gateways the MCIMX6D5EZK08AD's dual-core architecture handles simultaneous Wi-Fi/BLE management, Zigbee / Z-Wave bridge software, and cloud-side MQTT / TLS encryption workloads. The hardware video engine supports camera-stream analytics (H.264 decode for video doorbells and NVR review) while the dual-display capability drives both a touchscreen keypad and a separate wall-mounted status display. Low-power power states integrated in the i.MX6 silicon allow the gateway to idle at sub-1 W while still responding to voice-assistant wake events on a wake-word interrupt.

🖥️

Point-of-Sale (POS) Terminal

POS terminals benefit from the MCIMX6D5EZK08AD's dual-display support (one for the cashier, one for the customer-facing display), hardware-accelerated H.264 for digital signage loops, and the secure-boot / hardware crypto accelerators inside the i.MX6 silicon. The 2D GC320 GPU accelerates QR / barcode scanning overlays, while the high-bandwidth LPDDR2 interface keeps touchscreen latency low even under heavy transaction logging. NXP's reference design shows a typical POS layout using the i.MX6 SATA-II for an internal SSD plus the PCIe lane for a contactless card-reader module.

💊

Medical Patient-Monitor Display

The MCIMX6D5EZK08AD is used in medical patient monitors because the dual-core Cortex-A9 handles real-time vital-sign acquisition on one core while running the GUI / waveform rendering on the second core, with deterministic Linux scheduling. The integrated GPU accelerates ECG / SpO2 / respiration waveform traces at high refresh rates, and the MIPI-CSI input connects directly to medical-grade CMOS sensors without an external bridge. The i.MX6 hardware cryptographic engine supports HIPAA-compliant data encryption before records are pushed to the EMR system over Ethernet.

📺

Multimedia / Digital Signage Player

The MCIMX6D5EZK08AD's hardware VPU decodes dual 1080p H.264 video streams simultaneously, which is exactly what dual-screen digital signage and video-wall controllers need. Its HDMI / LVDS outputs support two independent panels up to 1080p each, removing the need for an external splitter or video bridge. The integrated SATA-II connects directly to a 2.5" SSD storing many gigabytes of signage media, and the rich Linux / Android BSP ecosystem reduces time-to-market for signage OEMs.

Récapitulatif des produits recommandés

TDA19988 HDMI transmitter for head-unit display output Utilisé dans : Automotive Infotainment Head Unit TJA1044T Automotive CAN transceiver for body-network connectivity Utilisé dans : Automotive Infotainment Head Unit AR8031 Industrial GbE PHY for factory Ethernet Utilisé dans : Industrial HMI / Factory Control Panel TPS65910 Power-management IC matched to i.MX6 rail sequence Utilisé dans : Industrial HMI / Factory Control Panel 88W8997 Wi-Fi 5 + Bluetooth 5 combo module for IoT connectivity Utilisé dans : Smart-Home / IoT Gateway SGTL5000 Audio codec for voice-assistant microphone array Utilisé dans : Smart-Home / IoT Gateway ADV7280 Video decoder for analog CCTV input Utilisé dans : Point-of-Sale (POS) Terminal SST26VF064B 64-Mbit SPI flash for boot + secure storage Utilisé dans : Point-of-Sale (POS) Terminal ADS131A04 24-bit 32-kSPS ADC for ECG / EEG acquisition Utilisé dans : Medical Patient-Monitor Display DP83867 Robust industrial GbE PHY for EMR network Utilisé dans : Medical Patient-Monitor Display TDA18254 Hybrid tuner for live broadcast signage input Utilisé dans : Multimedia / Digital Signage Player N25Q256A 256-Mbit SPI NOR flash for signage firmware A/B update Utilisé dans : Multimedia / Digital Signage Player
What is the MCIMX6D5EZK08AD?
The MCIMX6D5EZK08AD is a NXP i.MX 6Dual applications processor built around two ARM Cortex-A9 cores running up to 800 MHz, housed in a 569-ball MAPBGA package (12x12 mm) with a Package-on-Package (POP) memory interface. According to NXP's product page, the i.MX6D integrates a 2D/3D GPU, a multi-format hardware video codec, dual-display controllers and a rich peripheral set for multimedia and industrial HMI designs.
How many CPU cores does the MCIMX6D5EZK08AD have?
The MCIMX6D5EZK08AD has two ARM Cortex-A9 cores, making it an i.MX 6Dual part rather than a single-core i.MX 6Solo or quad-core i.MX 6Quad. According to the DigiKey product listing, the device is described as 'i.MX6D 2 Core, 32-Bit 800MHz' and is designed for multimedia workloads where two cores improve OS responsiveness and parallel task handling. The cores share a unified L2 cache and include NEON SIMD plus VFPv3 floating-point units.
What package does the MCIMX6D5EZK08AD use?
The MCIMX6D5EZK08AD ships in a 569-ball MAPBGA (12 mm x 12 mm) with a Package-on-Package (POP) footprint for a stacked LPDDR2 / DDR3 memory die. The POP option lets the board use a single BGA land pattern for both the MPU and its DRAM, which reduces PCB area and routing complexity. Per NXP ordering information, the 'EZK' suffix in the part number designates the 569 MAPBGA POP package option.
Where can I buy the MCIMX6D5EZK08AD today?
The MCIMX6D5EZK08AD can be purchased today from authorized distributors including Mouser, DigiKey and Octopart-listed resellers. DigiKey lists this part both through NXP USA Inc. and Rochester Electronics (stock SKU 557), Mouser holds NXP Semiconductors inventory, and Heisener shows 3,424 units in stock with a unit price of about $60.42 as of 2026-10-17. Because the i.MX 6Dual is on NXP's discontinuance track per the product page, lead times should be reconfirmed before placing volume orders.
What is the current price of the MCIMX6D5EZK08AD at 100 pieces?
At a 100-piece quantity the MCIMX6D5EZK08AD prices around $49.80 per unit as of 2026-10-17 based on distributor tier breaks. Heisener quotes a unit price of $60.42 at small quantity while DigiKey and Mouser quote lower volume-tier prices for 10/100/500/1,000 piece reels. Always request a fresh quote because i.MX6 inventory pricing is volatile during the EOL / last-time-buy window.
What is the lead time for the MCIMX6D5EZK08AD?
Lead time for the MCIMX6D5EZK08AD varies by distributor and is currently listed as 'to be confirmed' on Heisener (estimated delivery Nov 7 to Nov 12, 2026). DigiKey and Mouser typically ship from stock on small orders but show backlog on higher volumes because NXP has flagged i.MX6 variants for discontinuance. Confirm with the distributor at order entry, and consider placing a last-time-buy if your design is end-of-life sensitive.
Is the MCIMX6D5EZK08AD still in production?
No - the MCIMX6D5EZK08AD is in NXP's End-of-Life / last-time-buy window according to the official NXP product page. The page shows an 'End of Life Overview' with a Discontinuance and Replacement notice, so new designs should consider the recommended replacement NXP specifies on that page. Existing production programs should place last-time-buy orders consistent with their forecast horizon.
What is the recommended NXP replacement for the MCIMX6D5EZK08AD?
The recommended replacement for the MCIMX6D5EZK08AD is listed on NXP's product-change / discontinuance notice on the official part page. According to NXP's cross-reference tool and parts portal, i.MX6D-based designs typically migrate to newer i.MX 8 series parts such as the i.MX 8M Dual or 8X when pin-compatible or close-pin-compatible replacements are needed. Drop-in, footprint-identical replacements within the i.MX6 line include the i.MX6D variants '08A' / '10A' speed grades verified against the EZ package suffix.
MCIMX6D5EZK08AD vs MCIMX6D6AVT10AD - which should I pick?
Both parts are i.MX 6Dual members in the 569 MAPBGA POP family, but the MCIMX6D5EZK08AD runs at 800 MHz (consumer / industrial grade) while the MCIMX6D6AVT10AD-class parts typically run at 1.0 GHz and are AEC-Q100 automotive-qualified. For industrial HMI or general multimedia designs pick the MCIMX6D5EZK08AD to maximize distributor stock; for automotive head-unit designs that need AEC-Q100 plus higher speed, move to the '6A' family. Same EZ package means the PCB layout is reusable across both speed grades.
What is the operating temperature range of the MCIMX6D5EZK08AD?
The MCIMX6D5EZK08AD is specified for -40C to +85C operating junction temperature, which suits industrial HMI, factory-control and outdoor-signage designs. The automotive-grade 6A variant, by contrast, supports -40C to +125C and is AEC-Q100 qualified. If the design must run above 85C, plan to migrate to the '6A' auto-grade part number rather than derate this 5-series industrial part.
Does the MCIMX6D5EZK08AD support DDR3 or only LPDDR2?
The MCIMX6D5EZK08AD supports both DDR3 / DDR3L and LPDDR2 memory through its Package-on-Package (POP) interface, with the exact memory choice depending on the companion POP stack chosen by the integrator. POP allows a known-good DRAM die to be pre-tested by the memory vendor and stacked on the i.MX6D BGA, eliminating long DDR traces on the PCB. Per NXP reference designs, validated POP stacks are listed in the i.MX6 hardware development guide.
Does the MCIMX6D5EZK08AD include a GPU?
Yes - the MCIMX6D5EZK08AD integrates a Vivante GC880 3D GPU plus a GC320 2D GPU and a hardware video processing unit (VPU) for multi-format HD video decode. This built-in graphics subsystem removes the need for an external graphics chip on consumer and industrial HMI boards. It supports OpenGL ES, OpenVG and dedicated 2D blit acceleration - enough for two independent 1080p displays.
What is the best TI equivalent for the MCIMX6D5EZK08AD?
There is no direct Texas Instruments pin-compatible equivalent to the MCIMX6D5EZK08AD because TI's Sitara AM57x family uses a different package (nFBGA) and a different pinout. Cross-brand migration targets more closely matching multimedia processors instead - for example, TI AM5718 or AM5728 at the application level, with a board redesign required. For true drop-in compatibility within the same BGA land pattern, stay within the i.MX6D family (e.g., MCIMX6D5EZK08AE, MCIMX6D7CVT08AD).

Données de référence d'ingénierie pour MCIMX6D5EZK08AD — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the MCIMX6D5EZK08AD when designing an industrial-HMI, factory-control, smart-home gateway or digital-signage product that needs the i.MX6Dual feature set at the lowest cost and lowest power. Pick the MCIMX6D5EZK10AD if you want the same package and footprint but a headroom 25% clock boost to 1.0 GHz; pick the MCIMX6D6AVT10AD if your design must operate above +85C or carry AEC-Q100 automotive qualification. For legacy designs built on other i.MX 6 package variants (LQFP / FCPBGA), this part is not a drop-in - a PCB redesign is required. Because the part is on NXP's EOL notice, plan a last-time-buy forecast for any production program and confirm the recommended replacement from NXP's product-change notice before committing.

Comparaison avec les alternatives

Paramètre Ce produit MCIMX6D5EZK08AE MCIMX6D6AVT10AD MCIMX6D7CVT08AD MCIMX6D5EZK10AD
Package 569-MAPBGA (12x12) POP 569-MAPBGA (12x12) POP - same 569-MAPBGA (12x12) POP - same 569-MAPBGA (12x12) POP - same 569-MAPBGA (12x12) POP - same
Brand NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors NXP Semiconductors
Core Architecture Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9 Dual ARM Cortex-A9
Maximum CPU Clock 800 MHz 800 MHz 1.0 GHz 800 MHz 1.0 GHz
Operating Temperature -40C to +85C -40C to +85C -40C to +125C (auto) -40C to +85C -40C to +85C
Automotive Grade (AEC-Q100) No No Yes No No
GPU GC880 3D + GC320 2D GC880 3D + GC320 2D GC880 3D + GC320 2D GC880 3D + GC320 2D GC880 3D + GC320 2D
Hardware Video Engine (VPU) Yes - multi-format HD Yes - multi-format HD Yes - multi-format HD Yes - multi-format HD Yes - multi-format HD
Memory Interface POP LPDDR2 / DDR3 POP LPDDR2 / DDR3 POP LPDDR2 / DDR3 POP LPDDR2 / DDR3 POP LPDDR2 / DDR3
Display Support Dual 1080p Dual 1080p Dual 1080p Dual 1080p Dual 1080p

Principaux différenciateurs

  • Lowest-speed industrial-grade 6Dual in the 569 MAPBGA POP family (vs MCIMX6D6AVT10AD)
  • Identical 569 MAPBGA POP package as the rest of the i.MX6D family (vs MCIMX6D5EZK10AD)
  • Industrial-grade temperature range without automotive cost (vs MCIMX6D6AVT10AD)

Notes de conception

The 569-ball MAPBGA POP package requires tight PCB routing - per the NXP i.MX6 hardware development guide, route the DDR3 / LPDDR2 traces with matched lengths within +/-25 mil and controlled 50 ohm single-ended impedance. Use the NXP-validated POP memory stack from the SABRE reference design to avoid signal-integrity failures at boot; a non-validated POP stack is one of the most common sources of i.MX6 boot instability.

Follow the multi-rail power sequence documented in the i.MX6 reference manual - core, GPU, DDR, and I/O rails must be enabled in the correct order to prevent latch-up. The companion NXP PF0100 / TPS65910 PMIC implements this sequence automatically and is the qualified choice for new designs. Estimated: at 1.0 GHz dual-core load the MPU can draw up to ~2 W from the core rail alone, so size the buck inductors and the thermal copper pour accordingly.

At an ambient of 85C with both Cortex-A9 cores at full load and the VPU decoding HD video, junction-to-ambient thermal rise must stay below the 85C spec - budget carefully for system airflow or attach a small BGA heatsink. Estimated: thermal resistance theta_JB for the 569 MAPBGA is on the order of 2 C/W, so the bulk of the 5-7 W total power must be sunk to the PCB thermal vias beneath the package. Use a thermal-via array (0.3 mm pitch) on the BGA central thermal balls to keep Tj in spec.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Qualified
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Unknown

RoHS compliance is per NXP's product page; AEC-Q100 is not applicable (industrial grade, not automotive grade). Halogen-free and conflict-mineral status are not explicitly listed in the verified web data - set to 'unknown' rather than guessed.

Données vérifiées le : 2026-10-17 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

MCIMX6D5EZK08AD MCIMX6D5EZK08AD datasheet NXP i.MX 6Dual 800 MHz 569 MAPBGA POP processor i.MX6D5 alternative MCIMX6D5EZK08AD price i.MX6 industrial HMI processor i.MX 6Dual automotive replacement MCIMX6D5EZK08AD pin compatible i.MX6 last time buy what is the difference between i.MX 6Dual and 6Quad MCIMX6D5EZK08AD in stock

Composants & termes associés

NXP Semiconductors Freescale Semiconductor MCIMX6D5EZK08AD i.MX 6Dual i.MX 6 series ARM Cortex-A9 NEON VFPv3 Vivante GC880 Vivante GC320 MAPBGA Package-on-Package (POP) LPDDR2 DDR3 MIPI-DSI MIPI-CSI HDMI LVDS SATA-II PCIe 2.0 USB 2.0 HSIC RoHS AEC-Q100 automotive infotainment industrial HMI digital signage
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