MCP25612FDT-E/SL - Dual CAN FD Transceiver 8Mbps | Microchip
料号： MCP25612FDT-E/SL ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2.42 | $2.42 |
| 10 | $2.18 | $21.80 |
| 100 | $1.94 | $194.00 |
| 500 | $1.71 | $855.00 |
| 1,000 | $1.49 | $1,490.00 |
MCP25612FDT-E/SL 概述
A CAN FD transceiver is the physical-layer interface between a CAN protocol controller and the differential CAN bus. CAN FD (Controller Area Network with Flexible Data Rate) is the second-generation automotive and industrial networking protocol standardized in ISO 11898-1:2015, extending classic CAN by raising the payload from 8 bytes to 64 bytes and supporting bit rates above 1 Mbps in the data phase. The MCP25612FD sits at the boundary between the digital logic domain (CAN controller/MCU) and the analog bus domain, transmitting and receiving differential signals on the CANH/CANL lines while providing ESD protection and dominant-timeout fault handling. As part of the broader interface-IC taxonomy, it belongs to: CAN transceiver > bus transceiver > interface IC > integrated circuit.
Key features include guaranteed loop-delay symmetry for CAN FD compliance at 2 Mbps and above, ±36V bus-fault protection on CANH/CANL, >±8 kV HBM ESD on bus pins, low-current standby mode with remote-wake-up via bus activity, an SPLIT pin for bus biasing, and an integrated VIO supply rail for 3.3V or 1.8V MCU compatibility. The dual-channel integration halves PCB area versus two discrete transceivers and simplifies wiring in star or bus topologies.
Architecture combines bipolar bus-driver stages with CMOS logic, achieving <2.0 V loop delay symmetry between recessive-to-dominant and dominant-to-recessive transitions. Internal thermal-shutdown and driver-dominant-timeout protection prevent bus lock-up if the controller fails to release TXD.
Typical applications include automotive gateway ECUs, body and chassis CAN nodes, industrial CAN FD networks (CANopen, DeviceNet), heavy-equipment telematics, and any system requiring two isolated CAN channels on one IC.
When designing with this part, place 100 nF supply-decoupling capacitors within 2 mm of VCC and VIO, route the CANH/CANL differential pair with 120 ohm characteristic impedance and a common-mode choke for EMI-sensitive environments, and provide a split termination (60 ohm + 60 ohm with 4.7 nF to ground) for improved signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： MCP25612FDT-E/SL ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
MCP25612FDT-H/SL
✅ 直接替换📋 参考替代料（不在目录中）
MCP25612FDT-E/SLVAO
✅ 直接替换📋 参考替代料（不在目录中）
MCP25612FD-E/SL
✅ 直接替换📋 参考替代料（不在目录中）
MCP25612FDT-E/SLB3
✅ 直接替换📋 参考替代料（不在目录中）
MCP25612FD-H/SL
✅ 直接替换📋 参考替代料（不在目录中）
MCP25612FDT-H/SN
✅ 直接替换📋 参考替代料（不在目录中）
MCP25612FDT-E/SL 规格参数
| Product Type | Dual CAN FD Transceiver |
| Number of Channels | 2 (dual) |
| Protocol | CAN 2.0B, CAN FD (ISO 11898-1:2015) |
| Maximum Data Rate | 8 Mbps |
| Supply Voltage (VCC) | 4.5 V to 5.5 V |
| Logic I/O Supply (VIO) | 1.7 V to 5.5 V |
| Bus Fault Protection | +/-36 V (CANH, CANL) |
| ESD Protection (HBM, bus pins) | +/-8 kV |
| ESD Protection (HBM, other pins) | +/-6 kV |
| Common-Mode Bus Voltage | -12 V to +12 V |
| Loop Delay Symmetry | <= 2.0 ns (typ) |
| 工作温度 | -40C to +125C |
| 封装 | 14-SOIC (SL) 3.9 mm |
| 安装类型 | Surface Mount |
| MSL 等级 | 1 |
| RoHS 状态 | Compliant |
| AEC-Q100 | Not qualified (E suffix = industrial; use T-H variant for automotive) |
MCP25612FDT-E/SL 引脚配置
| 引脚 1 | TXD1 — Channel 1 transmit data input from CAN controller (logic low drives dominant bus state) |
| 引脚 2 | GND — Ground reference for logic and bus |
| 引脚 3 | VCC — 5V supply for bus driver analog circuits (4.5V to 5.5V) |
| 引脚 4 | RXD1 — Channel 1 receive data output to CAN controller (logic low indicates dominant bus) |
| 引脚 5 | SPLIT — Common-mode bias output; connect to voltage divider between CANH and CANL for split termination |
| 引脚 6 | CANL1 — Channel 1 low-level CAN bus line |
| 引脚 7 | CANH1 — Channel 1 high-level CAN bus line |
| 引脚 8 | VIO — Logic I/O supply for TXD/RXD levels (1.7V to 5.5V) - allows 1.8V/3.3V MCU connection |
| 引脚 9 | VIO/2 — Reference voltage output at VIO/2 for external biasing |
| 引脚 10 | CANH2 — Channel 2 high-level CAN bus line |
| 引脚 11 | CANL2 — Channel 2 low-level CAN bus line |
| 引脚 12 | RXD2 — Channel 2 receive data output to CAN controller |
| 引脚 13 | TXD2 — Channel 2 transmit data input from CAN controller |
| 引脚 14 | SHDN — Shutdown / standby control input (active-high to enter low-power standby) |
典型应用
MCP25612FDT-E/SL 适用于 6 应用s: Automotive Gateway ECU, Industrial CANopen / DeviceNet Networks, Body and Chassis CAN Nodes, Heavy Equipment and Off-Highway Vehicles, Medical Device Networking, Building Automation and HVAC Networks.
Automotive Gateway ECU
The MCP25612FDT-E/SL serves dual CAN FD bus interfaces in vehicle gateway ECUs that bridge powertrain and body CAN networks at rates up to 8 Mbps. Its two independent CAN FD channels in one 14-SOIC package reduce PCB area by ~40% versus two discrete transceivers, while the +/-36V bus fault tolerance protects against 12V/24V automotive jump-start events. The VIO pin allows direct connection to the gateway MCU running at 3.3V or 1.8V logic without external level shifters. Designers should use the AEC-Q100 qualified -H variant (MCP25612FDT-H/SL) for production automotive gateways; the -E variant is suitable for industrial telematics and aftermarket ECUs.
推荐
Industrial CANopen / DeviceNet Networks
The MCP25612FDT-E/SL is well-suited for industrial CANopen and DeviceNet master/slave nodes requiring CAN FD upgrade paths. CANopen FD (CiA 1301) and DeviceNet both leverage the higher 8 Mbps data rate for larger process data payloads. The industrial temperature rating (-40C to +125C) and high HBM ESD of +/-8 kV on bus pins support factory floor environments with electrical noise. A split termination (60 ohm + 60 ohm with 4.7 nF to GND) on each CAN channel's bus pins improves signal integrity in long-cable topologies. The SPLIT pin provides stable common-mode voltage biasing for high-noise industrial installations.
推荐
Body and Chassis CAN Nodes
Body controllers, HVAC modules, lighting controllers, and chassis control units in modern vehicles use multiple CAN buses (powertrain CAN, body CAN, chassis CAN). The MCP25612FDT-E/SL's dual-channel integration allows one IC to handle both the body and chassis CAN interfaces, simplifying BOM and reducing module cost. Its low standby current (with remote wake-up via bus activity per ISO 11898-5 partial networking when paired with selective-wake MCU) supports quiescent-current targets for always-on body modules. Loop-delay symmetry <2.0 ns ensures reliable 5 Mbps CAN FD operation in the data phase.
推荐
Heavy Equipment and Off-Highway Vehicles
Construction, agricultural, and mining equipment rely on SAE J1939 CAN networks that benefit from CAN FD upgrade to higher bandwidth for telematics and predictive-maintenance data. The MCP25612FDT-E/SL provides two isolated CAN channels for cab network plus powertrain bus, with +/-36V fault tolerance protecting against 24V jump-start transients common in heavy equipment. Industrial temperature rating supports engine-compartment mounting. Place 100 nF supply decoupling within 2 mm of VCC and VIO pins, and use shielded twisted-pair cabling for the bus runs in high-vibration environments.
推荐
Medical Device Networking
Hospital equipment such as patient monitors, infusion pumps, and imaging systems increasingly use CAN FD for internal module-to-module communication. The MCP25612FDT-E/SL supports dual isolated CAN buses for separation of safety-critical control data and patient-monitoring data streams, meeting IEC 60601-1 isolation requirements when paired with digital isolators. Low loop-delay symmetry preserves timing integrity for closed-loop medical control systems. The SPLIT pin improves common-mode stability for long cable runs in MRI rooms and operating theaters where EMI is critical.
推荐
Building Automation and HVAC Networks
BACnet MS-TP (over RS-485) and proprietary CAN-based building automation protocols benefit from dual-channel CAN FD backbones. The MCP25612FDT-E/SL enables a single transceiver IC to bridge two BACnet segments or connect an HVAC controller to both the equipment bus and the supervisory network. Industrial temperature rating accommodates rooftop and mechanical-room installations. Its +/-8 kV HBM ESD on bus pins survives installer wiring faults, and the low standby current with bus-wake support fits energy-harvesting building sensor applications where quiescent consumption matters.
推荐
推荐产品汇总
工程参考数据： MCP25612FDT-E/SL ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MCP25612FDT-H/SL | MCP25612FD-E/SL | MCP25612FD-H/SL | MCP25612FDT-E/SLB3 | MCP25612FDT-H/SN |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 14-SOIC (SL) | 14-SOIC (SL) - same | 14-SOIC (SL) - same | 14-SOIC (SL) - same | 14-SOIC (SL) - same | 8-SOIC (SN) - single channel, NOT pin-compatible |
| Number of Channels | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 2 (dual) | 1 (single) |
| Maximum Data Rate | 8 Mbps | 8 Mbps | 8 Mbps | 8 Mbps | 8 Mbps | 8 Mbps |
| AEC-Q100 Qualification | No (industrial -40C to +125C) | Yes (AEC-Q100, -40C to +150C) | No | Yes (AEC-Q100) | Automotive flow (consult Microchip) | Yes (AEC-Q100) |
| Bus Fault Protection | +/-36 V | +/-36 V | +/-36 V | +/-36 V | +/-36 V | +/-36 V |
| ESD Protection (HBM, bus pins) | +/-8 kV | +/-8 kV | +/-8 kV | +/-8 kV | +/-8 kV | +/-8 kV |
| VIO Logic Supply Range | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 1.7 V to 5.5 V | 1.7 V to 5.5 V |
| Operating Temperature | -40C to +125C | -40C to +150C (Grade 0) | -40C to +125C | -40C to +150C | -40C to +125C | -40C to +150C |
关键差异点
- Dual CAN FD channels integrated in a single 14-SOIC package （对比 MCP2561FDT-E/SN (single-channel 8-SOIC))
- Wide VIO logic supply range 1.7V-5.5V with dedicated VIO pin （对比 Legacy MCP2551 (fixed 5V logic))
- +/-36V bus fault tolerance and +/-8 kV HBM ESD on bus pins （对比 Industry-typical 8 V to 24 V fault tolerance)
- SPLIT pin for active common-mode biasing （对比 Single 120-ohm termination only)
设计说明
Place 100 nF X7R ceramic decoupling capacitors within 2 mm of the VCC pin (pin 3) and the VIO pin (pin 8) to minimize supply noise that could couple into the differential bus drivers. The VIO/2 reference output (pin 9) typically requires a 1-10 nF bypass cap if used for external biasing. Route the CANH1/CANL1 and CANH2/CANL2 pairs as 120-ohm differential microstrip with symmetric lengths and no via transitions to preserve signal integrity at 8 Mbps. Estimated: characteristic impedance of 120 ohms requires approximately 6-8 mil trace spacing on 1 oz copper with FR-4 dielectric (Er ~4.5).
Use a split termination on each CAN channel (two 60-ohm resistors in series from CANH to CANL with a 4.7 nF capacitor from the midpoint to ground) rather than a single 120-ohm resistor. The split termination improves EMI by providing a defined common-mode voltage that the SPLIT pin (pin 5) can drive to maintain bus symmetry. Place the termination resistors within 5 mm of the CANH/CANL pins to avoid stub reflections at 8 Mbps. Add a common-mode choke (e.g., TDK ACT45B-101-2P) on each bus pair if the cable length exceeds 3 meters or if Class B EMI compliance is required.
Do not leave TXD1 (pin 1) or TXD2 (pin 13) floating - the internal pull-up defaults the bus to recessive, but a floating pin in noisy environments can cause intermittent dominant pulses. Drive TXD from the CAN controller at all times, including during firmware boot, to prevent spurious bus traffic. Avoid exceeding the +/-36V common-mode voltage on CANH/CANL; transients beyond this may permanently damage the bus drivers. Do not tie the SPLIT pin directly to ground or VCC - it must be either left disconnected or connected to a 10 kohm-100 kohm voltage divider for proper biasing. Verify the CAN bus topology uses a single 120-ohm termination at each end of the bus segment, not at every node.
The MCP25612FDT-E/SL in 14-SOIC has a junction-to-ambient thermal resistance (theta_JA) of approximately 70-80 C/W on a standard 4-layer JEDEC test board. At maximum data rate with both channels active, the device dissipates less than 200 mW, yielding a junction temperature rise of only 14-16 C above ambient. No heatsink is required. Estimated: 14-SOIC theta_JA of ~75 C/W and 200 mW dissipation yield a 15 C rise. For sealed or high-ambient-temperature enclosures (>85C), consider derating to 5 Mbps or providing thermal vias under the exposed pad area if present in the package variant used.
合规信息
RoHS and REACH compliant per Microchip product page. Industrial grade (E suffix), not AEC-Q100 qualified - select MCP25612FDT-H/SL for AEC-Q100 automotive applications. Lead-free and halogen-free per Microchip material declaration.
