MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP
料号： MPC603RVG300LC ✗ 停产MPC603RVG300LC 概述
Background: A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instructions from program memory and coordinating peripherals through on-chip buses. PowerPC is a RISC instruction-set architecture originally developed jointly by Apple, IBM, and Motorola; the MPC603e line implements the low-end 32-bit member of this family with integrated L1 caches, a memory-management unit, and on-chip peripherals tailored for embedded systems such as networking, telecom, industrial control, and aerospace platforms.
Key features include a single 32-bit PowerPC core with integrated 16 KB instruction and 16 KB data L1 caches, a 64-bit external data bus, and integrated floating-point and integer units. The device supports a 300 MHz internal core clock and is fabricated in a 0.29-micron CMOS process. Operating voltage is 2.5V (core) with 3.3V I/O, and the 255-FCCBGA 21x21 mm exposed-pad package is designed for surface-mount assembly on multilayer PCBs.
The architecture integrates a four-stage pipeline with branch prediction, hardware table-walk MMU, and a 32-bit PowerPC instruction set with optional 64-bit extensions. The on-chip PLL generates the internal clock from an external reference, and dedicated JTAG pins support boundary-scan and debug.
Typical applications include embedded networking equipment, industrial control systems, aerospace and defense electronics, telecom base-station controllers, and legacy PowerPC-based single-board computers where long-life-cycle parts and second-source supply are required.
When designing with the MPC603RVG300LC, plan PCB layout for the 255-ball BGA with matched-impedance traces to the SDRAM bus; use the exposed thermal pad for heat-sinking and follow NXP's reference design for power-sequencing the 2.5V core before 3.3V I/O.
This page synthesizes distributor pricing, drop-in PowerPC-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
直接替换替代料： MPC603RVG300LC ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC603RVG300LC （相同外形与封装尺寸） ——差异在于 Lead Free Status, Mounting Type, Process Technology.
MPC603RRX300LC
✅ 直接替换📋 参考替代料（不在目录中）
MPC603RRX266LC
✅ 直接替换联系询价
查看数据手册 →MPC750BPX300LE
✅ 直接替换📋 参考替代料（不在目录中）
MPC745BPX300LE
✅ 直接替换📋 参考替代料（不在目录中）
MPC755BVT300LE
✅ 直接替换联系询价
查看数据手册 →MPC603RVG300LC 最大额定值与电气特性
| Processor Type | MPC603e PowerPC |
| Core Architecture | PowerPC RISC, 32-bit (64-bit data bus) |
| Core Count | 1 |
| Operating Frequency | 300 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage | 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| External Data Bus | 64-bit |
| Process Technology | 0.29 um CMOS |
| 封装 | 255-FCCBGA (21x21 mm) with exposed pad |
| 安装类型 | Surface Mount (BGA) |
| Packaging Media | Tray |
| Lead Free Status | Lead Free |
MPC603RVG300LC 255-fccbga (21x21 mm) with exposed pad 引脚配置指南
MPC603RVG300LC（255-fccbga (21x21 mm) with exposed pad 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC603RVG300LC.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC603RVG300LC 适用于 6 应用s: Embedded Networking Routers, Industrial Process Control, Aerospace and Defense Embedded Systems, Telecom Base-Station Controllers, Single-Board Computers (SBC), Legacy Printer and Imaging Controllers.
Embedded Networking Routers
The MPC603RVG300LC's 300 MHz PowerPC 603e core with 64-bit external data bus delivers deterministic forwarding performance in legacy router and switch designs. Its 16 KB instruction / 16 KB data L1 caches reduce memory-latency jitter for packet-header parsing, while the 255-FCCBGA package fits standard multilayer router motherboards. The 2.5V core / 3.3V I/O supply scheme aligns with conventional networking ASIC rails.
推荐
Industrial Process Control
The 603e's deterministic 4-stage pipeline and integrated MMU support hard real-time control loops in PLCs, motor controllers, and SCADA nodes. Operating from industrial 24V backplanes stepped down to 2.5V/3.3V, the MPC603RVG300LC's exposed-pad FCCBGA package simplifies thermal management in sealed enclosures. Long-term supply through NXP/Rochester supports 10-20 year industrial lifecycles.
推荐
Aerospace and Defense Embedded Systems
Aerospace platforms such as flight-control computers, mission processors, and avionics data concentrators have long relied on PowerPC 603e for its deterministic interrupt latency and radiation-tolerant options from NXP. The MPC603RVG300LC's 255-FCCBGA package is drop-in replaceable with the higher-speed variants and the broader MPC750/MPC745 family, simplifying upgrade paths while preserving flight-qualified firmware binaries.
推荐
Telecom Base-Station Controllers
Legacy 3G/4G base-station baseband controllers use the MPC603RVG300LC for its DSP-friendly integer performance and predictable interrupt response. The 64-bit external data bus interfaces efficiently to SDRAM and DSP ASICs, while the 300 MHz clock rate provides adequate headroom for MAC-layer scheduling. The BGA package supports dense PCB layouts typical of compact radio units.
推荐
Single-Board Computers (SBC)
VME and cPCI single-board computers built around the MPC603e ecosystem remain deployed in military, transportation, and industrial customers. The MPC603RVG300LC's 255-FCCBGA package is standardized across multiple SBC vendors, allowing the same CPU card to be qualified at different clock speeds (266 MHz / 300 MHz) for cost/performance tiers. Firmware built for the 603e ISA runs unchanged across the family.
推荐
Legacy Printer and Imaging Controllers
High-end network printers, plotters, and medical imaging controllers built on PowerPC 603e platforms use the MPC603RVG300LC to drive real-time image-pipeline processing and motor control. The integrated MMU enables protected RTOS operation, and the deterministic interrupt response is critical for synchronized print-head actuation. BGA-package compatibility across the family simplifies board respins during product refreshes.
推荐
推荐产品汇总
工程参考数据： MPC603RVG300LC ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC603RRX300LC | MPC603RRX266LC | MPC750BPX300LE | MPC745BPX300LE | MPC755BVT300LE |
|---|---|---|---|---|---|---|
| Package | 255-FCCBGA (21x21) | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Operating Frequency | 300 MHz | 300 MHz | 266 MHz (-11%) | 300 MHz | 300 MHz | 300 MHz |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC G3 (MPC750) | PowerPC G4 (MPC745) | PowerPC G3 (MPC755) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| L1 Instruction Cache | 16 KB | 16 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| L1 Data Cache | 16 KB | 16 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
关键差异点
- 300 MHz speed grade at the top of the 603e production envelope （对比 MPC603RRX266LC)
- Original 603e architecture preserves full PowerPC ISA compatibility （对比 MPC745BPX300LE (G4))
- Dual-rail 2.5V/3.3V supply matches conventional 1990s-era ASIC ecosystem （对比 Single-rail modern ARM Cortex-A SoCs)
设计说明
The MPC603RVG300LC requires a 2.5V core supply and a 3.3V I/O supply, both stable under dynamic load. The 2.5V rail must reach valid levels before or coincident with the 3.3V rail; a simple LDO with power-good output feeding a sequencing FET on the 3.3V rail is sufficient. Decoupling: place 0.1 uF X7R ceramics within the source cluster, and a 10 uF bulk tantalum or polymer within the source cluster, per NXP's reference design.
Estimated: at 300 MHz full-load operation, the MPC603RVG300LC dissipates approximately 3-4 W. The exposed thermal pad on the 255-FCCBGA must be soldered to a PCB thermal plane of at least 1 square inch with thermal vias to an internal copper pour, achieving junction-to-ambient thermal resistance below 15 C/W. Without proper thermal management, junction temperatures may exceed 125 C under sustained load.
The 255-ball FCCBGA at 0.8 mm pitch requires 4-layer PCB minimum with controlled-impedance routing for the 64-bit external data bus. Matched trace lengths within +/- 50 mils for the SDRAM clock and data-group signals are recommended. Use microvia-in-pad technology if available, and follow NXP's reference layout for the bus termination network. Solder paste stencil aperture reduction (90%) on center pads prevents mid-chip solder voids.
The 64-bit external data bus runs at 50-75 MHz and is sensitive to impedance discontinuities. Series-stretch resistors (10-22 ohm) on address and control lines near the MPC603RVG300LC dampen reflections. SDRAM clock should be routed on an inner layer with guard traces to GND; do not route the clock on the same layer as the data bus if possible.
Do not assume the MPC603RVG300LC can be cold-swapped into a system originally designed for the MPC750 or MPC745: while the 255-FCCBGA package is the same, the bus protocol, interrupt map, and L2-cache pin assignments differ. Verify pin compatibility with the actual datasheet for any cross-family substitution. Also note that firmware written for the 603e ISA may require recompilation for G3/G4 cores due to instruction-set extensions.
合规信息
Lead Free status confirmed by DigiChip datasheet excerpt; RoHS compliance per distributor listings. AEC-Q100 not applicable (this is an MPU, not an automotive-grade IC). REACH and halogen-free status not explicitly stated in verified data - set to unknown.
