MPC603RVG300LC - PowerPC 603e MPU 300MHz 255-FCCBGA | NXP
부품 번호: MPC603RVG300LC ✗ 단종MPC603RVG300LC 개요
Background: A microprocessor (MPU) is the central processing unit of an embedded computing system, executing instructions from program memory and coordinating peripherals through on-chip buses. PowerPC is a RISC instruction-set architecture originally developed jointly by Apple, IBM, and Motorola; the MPC603e line implements the low-end 32-bit member of this family with integrated L1 caches, a memory-management unit, and on-chip peripherals tailored for embedded systems such as networking, telecom, industrial control, and aerospace platforms.
Key features include a single 32-bit PowerPC core with integrated 16 KB instruction and 16 KB data L1 caches, a 64-bit external data bus, and integrated floating-point and integer units. The device supports a 300 MHz internal core clock and is fabricated in a 0.29-micron CMOS process. Operating voltage is 2.5V (core) with 3.3V I/O, and the 255-FCCBGA 21x21 mm exposed-pad package is designed for surface-mount assembly on multilayer PCBs.
The architecture integrates a four-stage pipeline with branch prediction, hardware table-walk MMU, and a 32-bit PowerPC instruction set with optional 64-bit extensions. The on-chip PLL generates the internal clock from an external reference, and dedicated JTAG pins support boundary-scan and debug.
Typical applications include embedded networking equipment, industrial control systems, aerospace and defense electronics, telecom base-station controllers, and legacy PowerPC-based single-board computers where long-life-cycle parts and second-source supply are required.
When designing with the MPC603RVG300LC, plan PCB layout for the 255-ball BGA with matched-impedance traces to the SDRAM bus; use the exposed thermal pad for heat-sinking and follow NXP's reference design for power-sequencing the 2.5V core before 3.3V I/O.
This page synthesizes distributor pricing, drop-in PowerPC-family alternatives, and practical design notes not found in the manufacturer datasheet alone.
드롭인 대체품: MPC603RVG300LC — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: MPC603RVG300LC (동일 폼 팩터 및 풋프린트) — 차이점: Lead Free Status, Mounting Type, Process Technology.
이 제품에는 사용 가능한 드롭인 대체품이 없습니다.
대체품 요청MPC603RVG300LC 최대 정격 & 전기적 특성
| Processor Type | MPC603e PowerPC |
| Core Architecture | PowerPC RISC, 32-bit (64-bit data bus) |
| Core Count | 1 |
| Operating Frequency | 300 MHz |
| Core Voltage | 2.5 V |
| I/O Voltage | 3.3 V |
| L1 Instruction Cache | 16 KB |
| L1 Data Cache | 16 KB |
| External Data Bus | 64-bit |
| Process Technology | 0.29 um CMOS |
| 패키지 | 255-FCCBGA (21x21 mm) with exposed pad |
| 실장 유형 | Surface Mount (BGA) |
| Packaging Media | Tray |
| Lead Free Status | Lead Free |
MPC603RVG300LC 255-fccbga (21x21 mm) with exposed pad 핀 구성 가이드
MPC603RVG300LC(255-fccbga (21x21 mm) with exposed pad 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: MPC603RVG300LC.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
MPC603RVG300LC 적합 용도: 6 애플리케이션s: Embedded Networking Routers, Industrial Process Control, Aerospace and Defense Embedded Systems, Telecom Base-Station Controllers, Single-Board Computers (SBC), Legacy Printer and Imaging Controllers.
Embedded Networking Routers
The MPC603RVG300LC's 300 MHz PowerPC 603e core with 64-bit external data bus delivers deterministic forwarding performance in legacy router and switch designs. Its 16 KB instruction / 16 KB data L1 caches reduce memory-latency jitter for packet-header parsing, while the 255-FCCBGA package fits standard multilayer router motherboards. The 2.5V core / 3.3V I/O supply scheme aligns with conventional networking ASIC rails.
추천
Industrial Process Control
The 603e's deterministic 4-stage pipeline and integrated MMU support hard real-time control loops in PLCs, motor controllers, and SCADA nodes. Operating from industrial 24V backplanes stepped down to 2.5V/3.3V, the MPC603RVG300LC's exposed-pad FCCBGA package simplifies thermal management in sealed enclosures. Long-term supply through NXP/Rochester supports 10-20 year industrial lifecycles.
추천
Aerospace and Defense Embedded Systems
Aerospace platforms such as flight-control computers, mission processors, and avionics data concentrators have long relied on PowerPC 603e for its deterministic interrupt latency and radiation-tolerant options from NXP. The MPC603RVG300LC's 255-FCCBGA package is drop-in replaceable with the higher-speed variants and the broader MPC750/MPC745 family, simplifying upgrade paths while preserving flight-qualified firmware binaries.
추천
Telecom Base-Station Controllers
Legacy 3G/4G base-station baseband controllers use the MPC603RVG300LC for its DSP-friendly integer performance and predictable interrupt response. The 64-bit external data bus interfaces efficiently to SDRAM and DSP ASICs, while the 300 MHz clock rate provides adequate headroom for MAC-layer scheduling. The BGA package supports dense PCB layouts typical of compact radio units.
추천
Single-Board Computers (SBC)
VME and cPCI single-board computers built around the MPC603e ecosystem remain deployed in military, transportation, and industrial customers. The MPC603RVG300LC's 255-FCCBGA package is standardized across multiple SBC vendors, allowing the same CPU card to be qualified at different clock speeds (266 MHz / 300 MHz) for cost/performance tiers. Firmware built for the 603e ISA runs unchanged across the family.
추천
Legacy Printer and Imaging Controllers
High-end network printers, plotters, and medical imaging controllers built on PowerPC 603e platforms use the MPC603RVG300LC to drive real-time image-pipeline processing and motor control. The integrated MMU enables protected RTOS operation, and the deterministic interrupt response is critical for synchronized print-head actuation. BGA-package compatibility across the family simplifies board respins during product refreshes.
추천
추천 제품 요약
엔지니어링 참조 데이터: MPC603RVG300LC — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | MPC603RRX300LC | MPC603RRX266LC | MPC750BPX300LE | MPC745BPX300LE | MPC755BVT300LE |
|---|---|---|---|---|---|---|
| Package | 255-FCCBGA (21x21) | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same | 255-FCCBGA (21x21) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Operating Frequency | 300 MHz | 300 MHz | 266 MHz (-11%) | 300 MHz | 300 MHz | 300 MHz |
| Core Architecture | PowerPC 603e | PowerPC 603e | PowerPC 603e | PowerPC G3 (MPC750) | PowerPC G4 (MPC745) | PowerPC G3 (MPC755) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| L1 Instruction Cache | 16 KB | 16 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| L1 Data Cache | 16 KB | 16 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND |
주요 차별점
- 300 MHz speed grade at the top of the 603e production envelope (vs MPC603RRX266LC)
- Original 603e architecture preserves full PowerPC ISA compatibility (vs MPC745BPX300LE (G4))
- Dual-rail 2.5V/3.3V supply matches conventional 1990s-era ASIC ecosystem (vs Single-rail modern ARM Cortex-A SoCs)
설계 노트
The MPC603RVG300LC requires a 2.5V core supply and a 3.3V I/O supply, both stable under dynamic load. The 2.5V rail must reach valid levels before or coincident with the 3.3V rail; a simple LDO with power-good output feeding a sequencing FET on the 3.3V rail is sufficient. Decoupling: place 0.1 uF X7R ceramics within the source cluster, and a 10 uF bulk tantalum or polymer within the source cluster, per NXP's reference design.
Estimated: at 300 MHz full-load operation, the MPC603RVG300LC dissipates approximately 3-4 W. The exposed thermal pad on the 255-FCCBGA must be soldered to a PCB thermal plane of at least 1 square inch with thermal vias to an internal copper pour, achieving junction-to-ambient thermal resistance below 15 C/W. Without proper thermal management, junction temperatures may exceed 125 C under sustained load.
The 255-ball FCCBGA at 0.8 mm pitch requires 4-layer PCB minimum with controlled-impedance routing for the 64-bit external data bus. Matched trace lengths within +/- 50 mils for the SDRAM clock and data-group signals are recommended. Use microvia-in-pad technology if available, and follow NXP's reference layout for the bus termination network. Solder paste stencil aperture reduction (90%) on center pads prevents mid-chip solder voids.
The 64-bit external data bus runs at 50-75 MHz and is sensitive to impedance discontinuities. Series-stretch resistors (10-22 ohm) on address and control lines near the MPC603RVG300LC dampen reflections. SDRAM clock should be routed on an inner layer with guard traces to GND; do not route the clock on the same layer as the data bus if possible.
Do not assume the MPC603RVG300LC can be cold-swapped into a system originally designed for the MPC750 or MPC745: while the 255-FCCBGA package is the same, the bus protocol, interrupt map, and L2-cache pin assignments differ. Verify pin compatibility with the actual datasheet for any cross-family substitution. Also note that firmware written for the 603e ISA may require recompilation for G3/G4 cores due to instruction-set extensions.
규정 준수 정보
Lead Free status confirmed by DigiChip datasheet excerpt; RoHS compliance per distributor listings. AEC-Q100 not applicable (this is an MPU, not an automotive-grade IC). REACH and halogen-free status not explicitly stated in verified data - set to unknown.
