MPC603RVG300LC vs MPC603RRX266LC 对比
详细并排对比 MPC603RVG300LC 出自 NXP Semiconductors 和 MPC603RRX266LC 出自 NXP Semiconductors。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
NXP Semiconductors
MPC603RRX266LC - PowerPC 603e 266MHz MPU, 255-FCCBGA | NXP
MPC603RRX266LC Obsolete规格对比
| 参数 | MPC603RVG300LC | MPC603RRX266LC |
|---|---|---|
| 品牌 | NXP Semiconductors | NXP Semiconductors |
| 分类 | Microcontrollers | Microcontrollers |
| 生命周期状态 | 不推荐新设计 | Obsolete |
| Processor Type | MPC603e PowerPC | — |
| Core Architecture | PowerPC RISC, 32-bit (64-bit data bus) | — |
| Core Count | 1 | — |
| Operating Frequency | 300 MHz | — |
| Core Voltage | 2.5 V | 2.5 V |
| I/O Voltage | 3.3 V | 3.3 V |
| L1 Instruction Cache | 16 KB | — |
| L1 Data Cache | 16 KB | — |
| External Data Bus | 64-bit | — |
| Process Technology | 0.29 um CMOS | 0.29 micron CMOS |
| 封装 | 255-FCCBGA (21x21 mm) with exposed pad | — |
| 安装类型 | Surface Mount (BGA) | Surface Mount |
| Packaging Media | Tray | — |
| Lead Free Status | Lead Free | Contains Lead |
| 工作温度范围 | [DATA_NEEDED: operating temperature range] | — |
| Core Processor | — | PowerPC 603e |
| Number of Cores | — | 1 |
| 数据总线宽度 | — | 32-bit |
| Address Bus Width | — | 32-bit |
| 最大时钟频率 | — | 266 MHz |
| 封装 / 外壳 | — | 255-BCBGA, FCCBGA (21x21 mm) |
| Packaging | — | Tray |
| RoHS 状态 | — | Non-Compliant |
| 工作温度 | — | Industrial grade |
| Series | — | MPC6xx |