MPC855TCZQ50D4 - 50MHz PowerQUICC MPU, 357-BGA | NXP
部品番号: MPC855TCZQ50D4 ✗ 生産終了| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $29.75 | $2,975.00 |
| 500 | $25.4 | $12,700.00 |
| 1,000 | $22.1 | $22,100.00 |
MPC855TCZQ50D4 概要
A PowerQUICC device belongs to the Power Architecture (PowerPC) family of integrated microprocessors. It combines a CPU core, system memory controller, and a dedicated communications processor (CPM) for offloading networking and serial protocol work. The hierarchy is: microprocessor (MPU) -> PowerPC -> PowerQUICC -> communications SoC. PowerQUICC parts are typically deployed where deterministic networking performance is required without burdening the main CPU with protocol handling.
Key features of the MPC855TCZQ50D4 include the 50 MHz PowerPC core, an integrated CPM supporting Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, UART, and PCMCIA controllers, on-chip system memory controller, and a 357-ball PBGA footprint that is pin-compatible with the broader MPC860 family. The chip was originally branded Motorola, then transitioned to Freescale, and is now sold by NXP as the part matures through its end-of-life cycle. According to the manufacturer product page, the part is footprint-compatible with existing MPC860 PowerQUICC designs.
The architecture segregates general-purpose CPU work from real-time data-plane protocol processing. By offloading Ethernet, ATM, and HDLC packet handling to the CPM through dedicated RISC engines and DMA channels, the main PowerPC core stays free for control-plane tasks and application code. This dual-engine design is the defining architectural trait of the PowerQUICC family and the reason it became a long-standing platform for SOHO routers, DSLAM line cards, and industrial control routers.
Typical applications include SOHO / SMB routers and switches with Fast Ethernet WAN/LAN, DSL modem and ADSL/CPE gateway designs, industrial Ethernet and SCADA gateways, ATM edge devices, and legacy telecom equipment. The 100 Mbps Fast Ethernet support, combined with HDLC and ATM on the CPM, lets a single MPC855T replace several discrete protocol converters. The 3.3 V I/O and 50 MHz speed make it a fit for designs that prioritize protocol-rich I/O over raw CPU throughput.
When designing with this device, validate supply chain availability before committing to a new layout. Per the NXP product page, this part is reaching End of Life and replacements are listed in the official discontinuance notice - design teams should check the NXP PCN before board bring-up. The 357-BGA requires standard PBGA reflow profiles and X-ray inspection; signal integrity work is concentrated on the 60x bus and Ethernet MII traces.
This page synthesizes distributor pricing, BGA-compatible drop-in alternatives in the MPC8xx family, and design considerations beyond what is found in the bare manufacturer datasheet.
ドロップイン代替品: MPC855TCZQ50D4 — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: MPC855TCZQ50D4 （同一形状・フットプリント） — 相違点: Core Architecture, Memory Controller, Operating Temperature, Process Technology, Mounting Type.
クイック比較ツール — 並列比較する代替部品を選択:
MPC855TVR50D4
✅ ドロップイン✓ 在庫あり
$48.1 / 個
データシートを見る →MPC860TVR50D4
✅ ドロップイン✓ 在庫あり
$58 / 個
データシートを見る →MPC860DEZQ50D4R2
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC860TCZQ50D4
✅ ドロップイン✓ 在庫あり
$16.8 / 個
データシートを見る →MPC860ENZQ50D4
✅ ドロップイン📋 参考代替品（カタログ未掲載）
MPC855TCZQ50D4 最大定格＆電気的特性
| Manufacturer | NXP Semiconductors (formerly Freescale / Motorola) |
| Product Type | Microprocessor (MPU) |
| Processor Family | PowerQUICC MPC8xx / PowerPC |
| Core Architecture | 32-bit PowerPC with integrated CPM (Communications Processor Module) |
| Core Clock Speed | 50 MHz |
| Number of Cores | 1 |
| データバス幅 | 32-bit |
| 電源電圧 | 3.3 V |
| 動作温度 | -40C to +95C |
| パッケージ / ケース | 357-Ball PBGA (Plastic Ball Grid Array), 25x25 mm |
| 実装タイプ | Surface Mount |
| Integrated Peripherals | Fast Ethernet (10/100 Mbps), ATM, HDLC/SDLC, PCMCIA, UART, I2C, SPI |
| On-chip Memory Controller | Yes (SDRAM, DRAM, SRAM, Flash support) |
| Packaging | Tray |
| Lead Free Status | Contains Lead |
| RoHS ステータス | Non-Compliant (legacy BGA contains lead) |
| Process Technology | 0.32 um CMOS |
MPC855TCZQ50D4 357-ball pbga (plastic ball grid array), 25x25 mm ピン配置ガイド
MPC855TCZQ50D4 (357-ball pbga (plastic ball grid array), 25x25 mm パッケージ) のピン配置。 このデジタルICには、GPIO、通信インターフェース (UART、SPI、I2C)、および電源ピンが含まれています。代替ピン機能と設定オプションについては、メーカーのデータシートを参照してください。組み込みシステム設計とPCBレイアウトに不可欠です。
詳細なピン配置データはありません: MPC855TCZQ50D4.
詳細は データシート をご参照ください。
主な用途
MPC855TCZQ50D4 の用途: 6 件s: SOHO / SMB Routers and Switches, DSL / ADSL Customer Premises Equipment (CPE), Industrial Ethernet and SCADA Gateways, ATM Edge and Access Multiplexers, Legacy Telecom Equipment Maintenance, Embedded Control and Building Automation.
SOHO / SMB Routers and Switches
The MPC855TCZQ50D4's integrated Fast Ethernet MAC, PowerPC core, and CPM at 50 MHz make it a natural fit for SOHO and SMB routers that need 100 Mbps WAN/LAN throughput. The dedicated CPM offloads NAT, packet filtering, and IP forwarding from the CPU, while the on-chip PCMCIA controller supports optional 802.11b/g cards for wireless gateways. The 357-BGA footprint matches MPC860 family parts, enabling product-family PCB reuse across multiple router SKUs without redesign.
おすすめ
DSL / ADSL Customer Premises Equipment (CPE)
The MPC855TCZQ50D4's combination of ATM support, Fast Ethernet, and HDLC channels aligns directly with legacy DSL CPE architectures. The CPM handles ATM AAL5 segmentation and reassembly while the PowerPC core runs the routing stack and PPPoE daemon. The -40C to +95C industrial operating range supports deployment in outdoor or basement CPE enclosures without active cooling. The 3.3 V supply and proven PowerQUICC ecosystem let OEMs reuse the Freescale MQX or Linux SDK without porting effort.
おすすめ
Industrial Ethernet and SCADA Gateways
Industrial Ethernet gateways benefit from the MPC855TCZQ50D4's HDLC, UART, and Fast Ethernet integration, which translate serial industrial protocols (Modbus RTU, Profibus) to Ethernet TCP/IP without an external protocol converter. The industrial -40C to +95C temperature range ensures operation in factory-floor cabinets and outdoor enclosures. The CPM's deterministic latency supports time-sensitive industrial protocols, while the PowerPC core runs the supervisory control application stack in the upper layers.
おすすめ
ATM Edge and Access Multiplexers
The MPC855TCZQ50D4 integrates ATM SAR and HDLC channels on the CPM that fit exactly the requirements of ATM edge multiplexers aggregating DSL or E1/T1 circuits. At 50 MHz the CPM handles the cell-rate pacing without CPU intervention, freeing the PowerPC core for OAM and management. The legacy 357-BGA footprint is shared with the MPC860 family, so multiplexer OEMs can scale product variants by simple BOM changes rather than PCB respins.
おすすめ
Legacy Telecom Equipment Maintenance
The MPC855TCZQ50D4 remains in service across the long tail of installed legacy telecom equipment that needs lifecycle extension. Per the Heisener distributor listing, the part continues to be stocked at 3,808+ pieces across authorized channels for aftermarket repair. The authorized Rochester Electronics cross-reference page on DigiKey confirms ongoing aftermarket availability for service-replacement needs. Design teams maintaining long-life telecom platforms can source this part for board-level repair without requalification.
おすすめ
Embedded Control and Building Automation
Building automation controllers benefit from the MPC855TCZQ50D4's I2C, SPI, PCMCIA, and serial channels, which directly connect to HVAC sensors, BACnet MS/TP transceivers, and Modbus field devices. The 50 MHz PowerPC core runs the building-management application, while the CPM offloads deterministic BACnet scheduling. The 357-BGA's industrial -40C to +95C rating supports unheated mechanical rooms, and the long-term availability through distribution channels suits the multi-decade service life expected of commercial buildings.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: MPC855TCZQ50D4 — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | MPC855TVR50D4 | MPC860TVR50D4 | MPC860DEZQ50D4R2 | MPC860TCZQ50D4 | MPC860ENZQ50D4 |
|---|---|---|---|---|---|---|
| Package | 357-Ball PBGA (25x25 mm) | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same | 357-Ball PBGA (25x25 mm) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock Speed | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz | 50 MHz |
| Processor Family | MPC855T (PowerQUICC) | MPC855T (PowerQUICC) | MPC860 (PowerQUICC) | MPC860 (PowerQUICC) | MPC860 (PowerQUICC) | MPC860EN (PowerQUICC) |
| Ethernet Channels | 1 (10/100 Mbps) | 1 (10/100 Mbps) | 2 (10/100 Mbps) | 2 (10/100 Mbps) | 2 (10/100 Mbps) | Enhanced Ethernet |
| Operating Temperature | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C | -40C to +95C |
| Packaging Format | Tray | Tape & Reel | Tape & Reel | Tape & Reel | Tray | Tray |
| RoHS Status | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant | Non-Compliant |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life | End of Life | Active (mid-lifecycle) |
主な差別化要因
- Footprint-compatible with full MPC860 PowerQUICC family （vs MPC860TVR50D4)
- Established PowerQUICC software ecosystem （vs MPC8347E (PowerQUICC II))
- Cost-optimized Fast Ethernet access design （vs MPC860ENZQ50D4)
設計ノート
The 357-ball PBGA package has a relatively high junction-to-ambient thermal resistance for a BGA of this pin count. At full Fast Ethernet load the part typically dissipates 1.5-2.5 W depending on CPM utilization. Designers should place a continuous copper pour on the top and inner PCB layers beneath the BGA, plus thermal vias on a 1.2 mm pitch directly under the die shadow. For fan-less enclosures, follow the NXP PowerQUICC Hardware Specifications thermal layout guidelines - leaving the BGA without thermal vias can push Tj above 110C at 95C ambient.
The 357-BGA land pattern requires NSMD (non-solder-mask-defined) pads with a 0.6 mm ball pitch. Per the NXP PowerQUICC family hardware specifications, all BGA balls should connect to inner signal layers via short dogbone fan-outs or microvia-in-pad (if budget allows). Surface-mount the SDRAM and 50 MHz oscillator within 25 mm of the BGA to keep memory traces short - this is critical at 50 MHz to avoid over/undershoot. Place decoupling capacitors on the bottom side directly under the BGA via-in-pad positions for the core and PLL supply balls.
The 60x bus runs at the full 50 MHz core clock with DDR-style signal timing, so length-match data, address, and clock traces within +/-2 mm of the bus length, and add 33 ohm series termination at the MPC855T end of clock nets. The Ethernet MII traces to the PHY should be length-matched within 0.5 mm to preserve 100 Mbps timing margins - crosstalk increases rapidly when MII traces exceed 50 mm. Use a separate ground island under the MII region and stitch with a via fence every lambda/20.
The MPC855TCZQ50D4 is at End of Life per the NXP product page, so do not commit to it for new designs without a confirmed long-term supply agreement. For new designs, evaluate the MPC8347E (PowerQUICC II, e300 core) or MPC8323E (PowerQUICC III) - these use a different 488-pin PBGA and require a full PCB redesign. When substituting within the same footprint, verify the silicon revision because MPC860 variants differ in Ethernet channel count and CPM features - never assume feature parity from the family name alone.
コンプライアンス情報
RoHS non-compliant per DigiKey product page (legacy BGA contains lead). REACH compliance assumed from NXP product family policy. AEC-Q100 not applicable (industrial/telecom MPU, not automotive grade). Not lead-free. Halogen-free status not specified in available data.
