MPC859PCVR100A - PowerQUICC 32-Bit 100MHz MPU | NXP | 357-PBGA
料号： MPC859PCVR100A ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $88.5 | $885.00 |
| 100 | $79.2 | $7,920.00 |
| 500 | $72.8 | $36,400.00 |
| 1,000 | $67.5 | $67,500.00 |
MPC859PCVR100A 概述
A PowerQUICC microprocessor is a system-on-chip (SoC) communications controller that integrates a PowerPC processor core with specialized peripheral engines (the CPM - Communications Processor Module) designed to offload networking tasks from the main CPU. The MPC8xx series sits in the hierarchy: PowerQUICC -> Power Architecture microprocessor -> embedded MPU -> integrated circuit. These parts historically target Customer Premises Equipment (CPE) and enterprise telecom designs where deterministic communications handling and integrated peripheral support reduce component count.
Key features of the MPC859PCVR100A include a 100 MHz PowerPC core, integrated CPM with support for multiple ATM SAR priority levels, two 10/100 Mbps Ethernet MACs, HDLC/PPP support, and parallel I/O. The 357-PBGA 25x25 mm package provides high-density interconnect for the wide internal bus structures. Compared with the MPC860, the MPC859DSL adds enhanced SAR (ESAR) features such as multiple APC priority levels and port-to-port switching without host intervention.
Typical applications include DSLAM line cards, integrated access devices, multichannel routers, VoIP gateways, and ATM edge concentrators. The part is well suited to designs that previously used the MPC860SAR and need additional SAR functionality without changing the toolchain.
When designing with this device, designers must allocate adequate PCB real estate for the 25x25 mm PBGA and plan thermal dissipation paths. Long-term procurement planning is essential because the MPC859 has been classified by NXP/Freescale as a mature/legacy product line.
This page synthesizes legacy distributor pricing, pin-compatible MPC8xx drop-in alternatives (MPC866PCVR100A, MPC859TCVR100A, MPC859TVR100A), and practical design considerations not found in the original manufacturer datasheet.
直接替换替代料： MPC859PCVR100A ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： MPC859PCVR100A （相同外形与封装尺寸） ——差异在于 Mounting Type, Operating Temperature, Package, Core Architecture.
快速对比工具——选择替代料号进行并排对比：
MPC866PCVR100A
✅ 直接替换📋 参考替代料（不在目录中）
MPC859TCVR100A
✅ 直接替换✓ 有现货
$42.45 / 个
查看数据手册 →MPC859TVR100A
✅ 直接替换✓ 有现货
$21.65 / 个
查看数据手册 →MPC860PCVR100A
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
MPC859PCVR100A 最大额定值与电气特性
| Manufacturer | NXP Semiconductors |
| Series | MPC8xx / PowerQUICC |
| Core Processor | PowerPC MPC8xx |
| Core Architecture | Power Architecture, 32-Bit |
| Number of Cores | 1 |
| Core Clock Speed | 100 MHz |
| 工作温度 | -40C to +100C |
| 封装 | 357-PBGA (25x25 mm) |
| 安装类型 | Surface Mount |
| Terminal Form | BALL |
| Number of Terminals | 357 |
| Package Code | BGA |
| Package Shape | SQUARE |
| Temperature Grade | INDUSTRIAL |
| Voltage - I/O | 3.3 V |
| Communications Features | CPM with ESAR, multiple APC priorities, ATM AAL support |
| Ethernet MACs | 2 (10/100 Mbps) |
MPC859PCVR100A square 引脚配置指南
MPC859PCVR100A（square 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： MPC859PCVR100A.
请参阅 数据手册 以查看完整引脚配置。
典型应用
MPC859PCVR100A 适用于 6 应用s: DSLAM Line Card Controllers, Integrated Access Devices (IAD), Multichannel Routers and Edge Concentrators, VoIP Media Gateways, Industrial Networking Equipment, ATM Edge Concentrator Designs.
DSLAM Line Card Controllers
The MPC859PCVR100A integrates the PowerPC core with a Communications Processor Module (CPM) supporting ATM SAR, HDLC, and Ethernet, allowing DSLAM line cards to process high-volume ATM AAL traffic without burdening the host CPU. Its 100 MHz clock and 32-bit data path provide the throughput needed for multiple DSL port aggregation. Verified Web Data confirms ESAR features such as multiple APC priority levels and port-to-port switching without host intervention. The 357-PBGA 25x25 mm footprint is shared across the MPC8xx family, simplifying multi-port card layouts. Designed for industrial -40C to +100C environments typical of central-office line shelves. Board design must allocate adequate trace routing for the dense BGA ball escape and consider 1.8V/3.3V split-rail power sequencing for hot-swap safety. For legacy DSLAM refresh projects, the MPC866PCVR100A can serve as a pin-compatible drop-in.
推荐
Integrated Access Devices (IAD)
IAD designs that combine voice, DSL, and Ethernet services benefit from the MPC859PCVR100A's combined ATM and Ethernet MAC support within a single chip. The dual 10/100 Mbps Ethernet MACs handle LAN-side switching while the integrated SAR processes ATM uplink traffic. Verified Web Data confirms the part's 100 MHz PowerPC core with 32-bit architecture and industrial -40C to +100C temperature grade suits CPE deployments. The 357-PBGA package enables compact IAD board layouts while supporting the wide parallel bus interfaces required by bridging/routing tasks. Thermal management relies on the PBGA's exposed die being bonded to sufficient PCB copper to keep junction temperature in spec under sustained ATM traffic. Designers should verify against NXP's reference manuals for the precise CPM interrupt multiplexing used in typical IAD reference designs.
推荐
Multichannel Routers and Edge Concentrators
Edge routers aggregating multiple WAN channels can offload HDLC, PPP, and ATM framing to the MPC859PCVR100A's integrated CPM, freeing the host PowerPC core for routing table management. With 100 MHz core clock and 32-bit datapath verified by DigiKey listings, the device handles multiple T1/E1 channels plus Ethernet uplink. Verified Web Data confirms 357-PBGA 25x25 mm packaging for high-density edge-router board designs. The ESAR features enable per-channel QoS prioritization critical for SLA-bound enterprise edge links. For routers emphasizing HDLC/PPP over ATM, the MPC866PCVR100A may be preferred as a pin-compatible drop-in. Compared with the older MPC860 family, the MPC859 adds enhanced SAR that simplifies channelized traffic shaping without software intervention.
推荐
VoIP Media Gateways
VoIP gateway designs use the MPC859PCVR100A's CPM to terminate TDM/HDLC T1/E1 links while the host PowerPC runs VoIP stack (SIP/H.248) and DSP control. The dual Ethernet MACs provide both LAN-side control and WAN-side packet transport. Verified Web Data confirms industrial temperature range (-40C to +100C) suitable for carrier-grade gateway environments. The 357-PBGA 25x25 mm package provides ample I/O for TDM highway interfaces and PCM/TDM bus connections. Designers should plan boot ROM and SDRAM topology carefully, using the MPC8xx UPM (User-Programmable Machine) to interface glueless to commodity SDRAM. The MPC866PCVR100A is a drop-in option when HDLC emphasis outweighs ATM emphasis.
推荐
Industrial Networking Equipment
Industrial routers, switches, and protocol converters benefit from the MPC859PCVR100A's -40C to +100C temperature range and long-life industrial focus, as confirmed by Verified Web Data (DIGCHIP). The MPC8xx platform's deterministic interrupt response and CPM offload make it well suited to factory automation networks that mix EtherNet/IP, Modbus TCP, and serial protocols. The 357-PBGA 25x25 mm footprint supports dense backplane-style board layouts typical of industrial rack-mounted networking gear. Power sequencing must follow NXP's split-rail 1.8V/3.3V recommendation for proper PowerPC core bring-up. For sites with severe thermal environments, consider extending PBGA PCB copper area for thermal dissipation.
推荐
ATM Edge Concentrator Designs
ATM edge concentrators aggregate DS1/E1 ATM tributaries into higher-speed uplinks, leveraging the MPC859PCVR100A's ESAR (enhanced SAR) features including multiple APC priority levels and port-to-port switching without host intervention. Verified Web Data confirms the 100 MHz 32-bit performance necessary for cell-by-cell traffic shaping. The 357-PBGA package reduces board area versus legacy QFP packages, allowing higher port density per line card. Compared with the MPC860SAR, this part offers true port-to-port switching, eliminating host-CPU round trips for ATM bearer routing. Long-term availability planning is critical because the NRND classification by NXP encourages design teams to qualify the MPC866PCVR100A as a drop-in backup.
推荐
推荐产品汇总
工程参考数据： MPC859PCVR100A ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | MPC866PCVR100A | MPC859TCVR100A | MPC859TVR100A | MPC860PCVR100A |
|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 357-PBGA (25x25 mm) | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same | 357-PBGA (25x25 mm) - same |
| Core Architecture | 32-Bit PowerPC | 32-Bit PowerPC | 32-Bit PowerPC | 32-Bit PowerPC | 32-Bit PowerPC |
| Core Clock Speed | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Number of Cores | 1 | 1 | 1 | 1 | 1 |
| Communications Features | CPM with ESAR, multiple APC priorities, ATM AAL, port-to-port switching | Fast Ethernet and HDLC focused CPM | T-LAN focused CPM | T-LAN routing CPM | MPC860SAR baseline (no ESAR) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND |
关键差异点
- Enhanced SAR (ESAR) enabled versus MPC860SAR baseline （对比 MPC860PCVR100A)
- Tighter ATM feature integration than the HDLC-emphasized MPC866 （对比 MPC866PCVR100A)
- Wide industrial temperature grade range （对比 MPC859PZP100A)
设计说明
The 357-PBGA 25x25 mm package has limited on-package heat dissipation. Estimated at 100 MHz PowerPC core clock with mixed SAR/Ethernet CPM activity, junction temperature under industrial -40C to +100C spec requires careful PCB thermal design. Estimated: with a typical core power dissipation in the 1.5W to 2.5W range, use a minimum 4-layer PCB with continuous ground plane directly under the PBGA die and 6mm x 6mm thermal via array (0.3mm drill, 0.5mm pitch) tied to inner copper planes. For sealed enclosures, verify junction temp against the 100C upper limit using OEM worst-case power numbers rather than typical.
PBGA 357-ball routing requires 1.0 mm pitch fanout with microvia (laser-drilled) technology on the inner layers. Estimated: a minimum 4-layer stackup is needed: signal top, ground, power, signal bottom. Reference the NXP MPC8xx hardware specifications document for exact keep-out zones for the JTAG, BDM, and reset pins. Trace length matching matters less than impedance control here because bus speeds are modest compared with modern ASICs.
The MPC8xx family uses a split-rail design: 1.8V for the PowerPC core and 3.3V for I/O. Power sequencing requires the I/O rail to come up before the core rail, or simultaneous tracking with a delta of no more than 0.5V. Failure to sequence properly can result in I/O latch-up during hot-plug. Add 100nF decoupling at every power ball cluster, plus bulk 10uF tantalum or ceramic caps at the voltage regulator output. Monitor NXP's MPC8xx errata for any module-specific power pin changes.
Do not assume MPC859PCVR100A can be swapped 1:1 with MPC866PCVR100A in software-managed SAR routing without code rework - their CPM register maps differ even when pin-compatible. Verified Web Data via Utmel comparison notes the MPC859DSL's enhanced SAR (ESAR) features (multiple APC priorities, port-to-port switching) require updated CPM firmware to leverage. Also, when migrating to MPC859PZP100A as an alternative package, confirm the ZP-package thermal envelope matches the original PBGA layout before dropping into existing thermal qualification.
合规信息
Compliance data was not present in the Verified Web Data; recommend checking with Rochester Electronics (as the long-term stocking distributor) or NXP for confirmed RoHS/REACH status as of 2026-10-17. This is an industrial-grade microprocessor; AEC-Q100 automotive qualification is not applicable.
