最后一次采购通知: MPC860TCVR50D4 即将停产。最后下单日期: 联系我们. 查看可用的替代料号 →
NXP Semiconductors

MPC860TCVR50D4 - 50MHz 32-Bit PowerQUICC MPU | NXP

料号: MPC860TCVR50D4 ✗ 停产
有现货 1-3 个工作日内发货
3.3 V Vdss 357-pin PBGA, 25 x 25 mm Package 50 MHz Speed
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价格更新于: 2026-10-09
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MPC860TCVR50D4 概述

The NXP Semiconductors MPC860TCVR50D4 is a 32-bit, single-core PowerQUICC microprocessor operating at 50 MHz in a 357-pin PBGA package. It is designed for communications and networking controller applications and is identified by the verified distributor data as an MPC8xx MPU with a 25 x 25 mm package, 3.3 V supply, and tray packaging.

The MPC860 belongs to the PowerQUICC processor family, combining a RISC-oriented embedded processor core with communications-oriented peripherals in one integrated device. This category of processor is used when a system needs more control, memory access, and protocol flexibility than a small microcontroller provides, while retaining a dedicated communications architecture. The part is therefore positioned between basic microcontrollers and higher-end application processors for embedded infrastructure, control, and gateway equipment.

Key verified attributes include a 50 MHz operating speed, 32-bit processor architecture, 0.32 micrometer process information listed in distributor data, and a 357-BBGA package. The available product records identify the part as an MPC8xx PowerQUICC processor and state that NXP describes it as delivering higher performance, greater integration, and lower power consumption than traditional architectures. Those statements are manufacturer descriptions, not independent benchmark results, and should be validated against the complete datasheet and application requirements.

Typical design contexts include communications controllers, networking equipment, protocol conversion systems, embedded routers, gateways, and industrial communications platforms. The integrated processor and peripheral approach reduces the need for separate interface logic when the firmware is designed around the MPC860 architecture. Buyers should confirm memory interfaces, peripheral availability, electrical limits, package ball assignments, and software support against the specific product revision before committing to a design.

A critical procurement consideration is lifecycle status. The NXP product page labels this part as End of Life, so new production availability should not be assumed. Engineers should check authorized distributor inventory, last-time-buy status, and any approved sourcing routes. For a replacement, require a detailed pin, electrical, firmware, and timing review rather than relying only on a distributor similarity label.

This page consolidates verified distributor and manufacturer information, identifies package and sourcing risks, and separates confirmed values from parameters that still require datasheet confirmation for production design and procurement.

直接替换替代料: MPC860TCVR50D4 ——相同封装,引脚兼容。需要 PCB 改动的不同封装料号已排除。

本系列中的变体

可与以下型号直接替换的同系列型号: MPC860TCVR50D4 (相同外形与封装尺寸) ——差异在于 Core Architecture, Package, Process Technology, Series, Processor Type.

NXP Semiconductors
Core Architecture: PowerPC
Package: 357-PBGA (25x25 mm)
Process Technology: 0.32 um CMOS
对比 MPC860TCVR50D4 →
NXP Semiconductors
Core Architecture: Power Architecture (PowerPC) 32-bit, 1 core
Package: 357-Ball PBGA (25x25 mm)
Series: PowerQUICC I (MPC8xx)
对比 MPC860TCVR50D4 →
NXP Semiconductors
Core Architecture: 32-Bit PowerPC
Process Technology: 0.32 um CMOS
Series: MPC8xx PowerQUICC
对比 MPC860TCVR50D4 →
NXP Semiconductors
Core Architecture: PowerPC 603e-derived, 32-bit
Package: 357-Ball PBGA (25 x 25 mm)
对比 MPC860TCVR50D4 →
NXP Semiconductors
Core Architecture: PowerPC 603 (32-bit, no FPU)
Package: 357-PBGA (25x25 mm)
Process Technology: 0.32 micron CMOS
对比 MPC860TCVR50D4 →
NXP Semiconductors
Package: 357-BGA (25 x 25 mm)
Process Technology: 0.32 um CMOS
Series: MPC860
对比 MPC860TCVR50D4 →
NXP Semiconductors
Core Architecture: PowerPC 32-bit
Process Technology: 0.32 µm CMOS
Series: MPC8xx PowerQUICC
对比 MPC860TCVR50D4 →

快速对比工具——选择替代料号进行并排对比:

MPC860ENCVR50D4

✅ 直接替换
NXP Semiconductors
📦 357-BBGA
MPU PowerQUICC MPC8xx · 32-Bit PowerPC · 1 · 50 MHz · 3.3 V · 0.32 um CMOS · 357-BBGA (PBGA, 25 x 25 mm) · Surface Mount

✓ 有现货

$52.4 / 个

查看数据手册 →

MPC860TCVQ50D4

✅ 直接替换
📦 357-BBGA
Related 50 MHz, 357-pin BGA MPC8xx candidate; suffix-specific electrical and qualification differences require datasheet confirmation.

📋 参考替代料(不在目录中)

MPC860TZQ50D4

✅ 直接替换
📦 357-BBGA
Related MPC860 50 MHz 357-pin BGA candidate; the comparison identifies consistent package and terminal characteristics but does not prove full functional equivalence.

📋 参考替代料(不在目录中)

MPC860TVR50D4

✅ 直接替换
NXP Semiconductors
📦 357-BBGA
PowerPC 32-bit · 1 · 50 MHz · 3.3 V · 3.3 V · 357-PBGA (25x25 mm) · 0.32 µm CMOS · 4 Kbyte

✓ 有现货

$58 / 个

查看数据手册 →

MPC860DTCZQ50D4

✅ 直接替换
📦 357-BBGA
Related MPC860 50 MHz 357-BBGA candidate identified by comparison data; exact pin, electrical, and firmware differences are not available in the verified snippets.

📋 参考替代料(不在目录中)

MPC860TCVR50D4 最大额定值与电气特性

Processor Type MPC8xx PowerQUICC 32-bit microprocessor
Core Count 1 core
Processor Architecture RISC, 32-bit
Operating Speed 50 MHz
电源电压 3.3 V
Process Technology 0.32 micrometer
封装 357-pin PBGA, 25 x 25 mm
Package Type 357-BBGA
安装类型 Surface mount
Packaging Tray
Lead-Free Status Lead free
RoHS 状态 RoHS compliant
Application Category Communications and networking controllers

MPC860TCVR50D4 357-bbga 引脚配置指南

MPC860TCVR50D4(357-bbga 封装)的引脚配置。 该数字 IC 包含 GPIO、通信接口(UART、SPI、I2C)和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。

MPC860TCVR50D4 的 357-bbga 封装引脚图

暂无详细引脚数据: MPC860TCVR50D4.

请参阅 数据手册 以查看完整引脚配置。

典型应用

MPC860TCVR50D4 适用于 6 应用s: Communications Controllers, Networking Gateways, Protocol Conversion Systems, Embedded Routers, Industrial Communications Equipment, Embedded Control Platforms.

🌐

Communications Controllers

The MPC860TCVR50D4 is designed for communications and networking controller applications, as stated by NXP. Its 32-bit RISC PowerQUICC architecture and 50 MHz operating speed provide a platform for embedded protocol handling, control, and communications-oriented peripheral integration. In a controller design, the processor can coordinate buffers, interfaces, and system state while the communications peripherals handle device-specific traffic. The verified data confirms 3.3 V operation and a 357-pin PBGA package, but memory, interface, and timing details must be verified before architecture release. Because the part is End of Life, it is most appropriate for maintaining an existing qualified product or a procurement-approved legacy design.

🌐

Networking Gateways

A gateway product can use the MPC860TCVR50D4 as a dedicated communications and control processor when the system needs a 32-bit RISC architecture, 50 MHz execution, and integrated PowerQUICC functionality. The part is associated by NXP with communications and networking controllers, making it relevant to protocol conversion, routing, and embedded gateway control. The 3.3 V supply requirement and 357-pin PBGA package must be included in power and layout planning. Before selecting it for a new gateway, verify the required memory configuration, peripheral interfaces, environmental range, and software support against the official datasheet. Its end-of-life status favors lifecycle-controlled legacy maintenance rather than unrestricted new-product adoption.

🔧

Protocol Conversion Systems

Protocol conversion systems often require deterministic control, multiple peripheral functions, and a processor capable of handling communication tasks outside a small microcontroller footprint. The MPC860TCVR50D4 is a 32-bit, single-core, 50 MHz PowerQUICC processor positioned for communications and networking controllers, so it can serve as a legacy platform for protocol translation, framing, routing, or supervisory control. The verified package data identifies 357-BBGA in a 25 x 25 mm footprint and 3.3 V operation. Firmware and hardware compatibility must be validated carefully because the supplied sources do not expose memory sizes, interface maps, or complete timing limits. Lifecycle purchasing and long-term obsolescence planning are essential.

🌐

Embedded Routers

The MPC860TCVR50D4 can fit an embedded-router or industrial-routing platform where a communications-focused processor is preferred over a general-purpose application processor. Its verified 50 MHz, 32-bit RISC configuration and PowerQUICC positioning support embedded packet handling and system-control tasks in legacy equipment. A router design must still account for the 357-pin PBGA assembly, 3.3 V supply, external memory requirements, and the complete set of communications interfaces. The verified snippets do not specify those interface details, so engineers should consult the official MPC860 documentation and reference designs. Because NXP labels the part End of Life, existing deployments should document sourcing and thermal assumptions for long-term maintenance.

🏭

Industrial Communications Equipment

Industrial communications equipment often depends on deterministic embedded control and long-lived hardware support rather than maximum processor performance. The MPC860TCVR50D4's 32-bit PowerQUICC architecture, 50 MHz speed, and communications-controller positioning make it a plausible fit for legacy industrial controllers, remote gateways, and protocol interfaces. Its 3.3 V requirement and 357-pin PBGA package simplify identification but do not reduce the need for careful electrical and thermal design. The product is end-of-life, so new industrial deployments should include an approved lifecycle review and alternative strategy. For installed equipment, use authorized distribution and documented inspection criteria to preserve supply continuity and reduce counterfeit-risk exposure.

⚙️

Embedded Control Platforms

The MPC860TCVR50D4 can serve as the central embedded controller in communications-oriented equipment that needs more processing capability than a small MCU while retaining a mature RISC architecture. Its single-core, 32-bit, 50 MHz configuration is suited to supervisory control, device management, and protocol-processing tasks when the application already depends on the MPC860 software ecosystem. The available data confirms 3.3 V operation, 0.32 micrometer process information, and tray-packaged 357-BBGA construction. It does not provide operating temperature, memory, or interface details, so all production decisions should reference the official manufacturer documentation. The End of Life designation makes this primarily a legacy-maintenance choice unless a formal sourcing exception is approved.

What is the MPC860TCVR50D4 processor?
The MPC860TCVR50D4 is an NXP Semiconductors MPC8xx PowerQUICC 32-bit RISC microprocessor with one core, a 50 MHz operating speed, and a 357-pin PBGA package. Verified distributor data identifies it as a 25 x 25 mm surface-mount part operating from a 3.3 V supply. The NXP product description positions it for communications and networking controller applications. Its integrated processor and peripheral architecture is intended to support embedded control and communications equipment requiring more capability than a basic microcontroller.
What package does the MPC860TCVR50D4 use?
The MPC860TCVR50D4 uses a 357-pin PBGA package measuring 25 x 25 mm, with the verified distributor listing also identifying the package as 357-BBGA. It is supplied in tray packaging according to the available distributor specifications. Because a 357-ball package has a dense, complex footprint, engineers should obtain the official package drawing and complete ball-assignment table before designing or inspecting a PCB. The public search data does not provide the full ball map, so pin-level compatibility must be confirmed directly from NXP documentation.
Where can I download the MPC860TCVR50D4 datasheet PDF?
The official manufacturer product page is available at https://www.nxp.com/part/MPC860TCVR50D4, and its Data Sheet section should contain the authoritative MPC860 family documentation. The verified distributor results identify the device as an MPC8xx PowerQUICC processor and provide links to datasheets, inventory, and pricing information. Download the current NXP datasheet and package drawing, then verify the exact suffix, temperature range, electrical limits, memory interface, and ball assignments before releasing a layout.
Is the MPC860TCVR50D4 still active or end of life?
The NXP product page labels MPC860TCVR50D4 as End of Life. It should therefore be treated as an end-of-life component unless NXP or an authorized distributor confirms a specific last-time-buy or remaining-stock program. Verified distributor pages show the part being offered by multiple channels, but that does not prove current production availability. For new designs, confirm lifecycle status, traceability, and obsolescence planning directly with NXP or an authorized sourcing partner.
What is the operating voltage of the MPC860TCVR50D4?
The verified distributor specification lists the MPC860TCVR50D4 operating voltage as 3.3 V. That value describes the nominal supply condition shown in the available product data, but it does not by itself define all permitted voltage tolerances, sequencing limits, or I/O levels. Before power-supply design, consult the official MPC860 datasheet for minimum and maximum supply values, core and I/O requirements, and power-up behavior. Do not substitute a generic 3.3 V assumption for the manufacturer's electrical limits.
What is the processor speed of MPC860TCVR50D4?
The MPC860TCVR50D4 operates at 50 MHz, according to the verified DigiKey, Mouser, and related distributor records. The device is identified as a single-core, 32-bit MPC8xx PowerQUICC processor. Clock-related details such as PLL requirements, reset timing, and external oscillator expectations are not included in the supplied search snippets, so those values must be checked in the official datasheet. The 50 MHz figure is the confirmed processor speed, not a guarantee of application throughput.
What is the MPC860TCVR50D4 pinout?
The complete MPC860TCVR50D4 pinout is a 357-ball PBGA assignment that is not reproduced in the supplied verified search data. The package is confirmed as 357-BBGA, 25 x 25 mm, but the individual ball names and locations must be taken from the official NXP package drawing and datasheet. Because this is a high-pin-count BGA, use the manufacturer land pattern and verify every power, ground, clock, reset, memory, and peripheral signal rather than relying on a generic pinout database.
Where can I buy the MPC860TCVR50D4 online?
Distributor listings for MPC860TCVR50D4 are available through Mouser, DigiKey, Octopart, and other sourcing channels listed in the verified results. DigiKey lists the part under NXP USA Inc., Mouser lists it under NXP Semiconductors, and Octopart reports comparison across 23 distributors. Availability and price can change, especially because the NXP page marks the device End of Life. Request a current quote, stock confirmation, traceability details, and lifecycle documentation before placing an order.
What is the price of the MPC860TCVR50D4?
The supplied verified data does not include a numeric current price for the MPC860TCVR50D4, so the price cannot be stated accurately. Mouser, DigiKey, Octopart, and other distributor pages are identified as sources for current quotation, but their snippets do not provide a confirmed unit price. As of 2026-10-09, pricing should be requested from the distributor with quantity, date code, condition, and traceability requirements specified. Avoid relying on an inferred historical price for this end-of-life processor.
What is the lead time for the MPC860TCVR50D4?
The verified data does not state a current lead time for the MPC860TCVR50D4. Because the manufacturer product page labels the device End of Life, lead time depends on remaining inventory, authorized sourcing, and whether the order is supported by a last-time-buy or approved shortage program. Ask the distributor for a written stock and delivery commitment, including lot traceability and date-code details. For production planning, treat the part as constrained until a supplier confirms availability in writing.
Is the MPC860TCVR50D4 in stock?
The MPC860TCVR50D4 is offered through multiple distributor listings, but the supplied data does not confirm live inventory or a guaranteed stock quantity. The NXP page identifies the part as End of Life, so a distributor listing may represent limited or irregular remaining stock rather than a sustainable supply. As of 2026-10-09, confirm current stock directly with the seller and request lot, date-code, condition, and traceability information before committing to a production schedule.
What is the best drop-in replacement for MPC860TCVR50D4?
The supplied cross-reference results identify MPC860TCVR50D4-related variants such as MPC860ENCVR50D4 and MPC860TCVQ50D4 as comparable 357-BBGA, 50 MHz MPC8xx devices, but the available snippets do not provide a verified manufacturer-level guarantee of pin, electrical, timing, and software equivalence. They should be treated as candidates for engineering review, not automatic drop-in replacements. A replacement requires review of the official datasheet, ball map, memory map, peripherals, clocking, power sequencing, software initialization, and lifecycle status.
Can MPC860TCVR50D4 replace another 357-BBGA communications processor?
MPC860TCVR50D4 can be considered only when the existing design is verified to match its 3.3 V supply, 50 MHz clocking, MPC8xx architecture, memory interface, peripheral set, and 357-pin PBGA ballout. A matching package and processor description alone do not establish interchangeability. For migration, compare the complete official datasheets and reference designs, then perform hardware bring-up and firmware regression testing. The verified material does not authorize an unconditional replacement claim.
When should I choose MPC860TCVR50D4 over an MPC860ENCVR50D4?
Choose MPC860TCVR50D4 only after confirming that its exact electrical, package, temperature, memory, and peripheral characteristics match the target design. The available comparison results associate MPC860ENCVR50D4 with the same MPC8xx, 50 MHz, 357-BBGA class, but they do not expose the detailed suffix differences needed for a final selection. The T, C, E, and other suffixes can affect temperature grade, packaging, or ordering options, so compare the official ordering information and datasheet before procurement.
Is MPC860TCVR50D4 suitable for communications and networking controllers?
Yes, MPC860TCVR50D4 is specifically identified by NXP as suitable for communications and networking controller applications. Its PowerQUICC architecture combines a 32-bit RISC processor with integrated communications-oriented peripherals, making it relevant to routers, gateways, protocol converters, and embedded communications platforms. Suitability still depends on the required interfaces, memory, timing, environmental range, and software ecosystem. The product is end-of-life, so use it primarily for maintaining or sourcing an existing qualified design unless procurement approval is already in place.
What are the key specifications engineers should know about MPC860TCVR50D4?
The key confirmed specifications are single-core MPC8xx PowerQUICC architecture, 32-bit RISC operation, 50 MHz speed, 3.3 V supply, 0.32 micrometer process information, and a 357-pin PBGA package measuring 25 x 25 mm. The part is supplied in tray packaging and is listed as lead-free and RoHS compliant. The verified snippets do not specify memory sizes, interface list, operating temperature, power limits, or complete ball assignments. Those parameters must be confirmed from the official NXP datasheet before schematic, PCB, thermal, or firmware sign-off.
Is MPC860TCVR50D4 the same as MPC860TCVQ50D4?
No definitive identity is established by the supplied data. The comparison result describes MPC860TCVQ50D4 as a related 50 MHz, 357-pin BGA MPC8xx processor, but suffix differences can indicate changes in temperature grade, package, qualification, or ordering code. Treat the part numbers as candidates for a controlled equivalence review rather than assuming they are interchangeable. Confirm the manufacturer ordering table, datasheet revision, ball list, electrical limits, and software requirements before substitution.
How should engineers design the PCB around MPC860TCVR50D4?
Design around the official NXP 357-pin PBGA land pattern, not a generic BGA footprint. The verified package is 25 x 25 mm and contains 357 balls, so power, ground, clock, reset, memory, and peripheral routing must follow the manufacturer package drawing exactly. Use a PCB assembly process capable of handling the package, validate solder-paste and stencil design, and plan thermal and electrical inspection for hidden joints. The supplied data does not include the complete ball map or stack-up requirements, so those details must be obtained before layout release.

工程参考数据: MPC860TCVR50D4 ——对比、设计指导和合规信息。

选型指南

Choose the MPC860TCVR50D4 when maintaining an existing communications or networking-controller design that specifically uses the MPC860 PowerQUICC architecture, 32-bit RISC execution, 50 MHz timing, 3.3 V supply, and 357-pin PBGA footprint. The NXP product page labels it End of Life, so procurement approval and obsolescence planning are essential. For a new design, compare current NXP processors and confirm whether the legacy software, peripheral set, memory interface, and long-term support justify the sourcing risk. The listed alternatives are same-brand MPC860 candidates for engineering review, not guaranteed substitutes. Use them only after comparing the official ordering information, electrical limits, ball assignment, timing, memory configuration, firmware requirements, and qualification status.

与替代料对比

参数 本产品 MPC860ENCVR50D4 MPC860TCVQ50D4 MPC860TZQ50D4 MPC860TVR50D4
Processor Type MPC8xx PowerQUICC 32-bit MPU MPC8xx 32-bit MPU; same class in supplied comparison data MPC860 50 MHz 357-pin BGA candidate Related MPC860 50 MHz 357-pin BGA candidate Related MPC860 50 MHz 357-pin BGA candidate
Operating Speed 50 MHz 50 MHz in supplied comparison data 50 MHz in supplied comparison data 50 MHz in supplied comparison data 50 MHz in supplied comparison data
Package 357-pin PBGA, 25 x 25 mm 357-BBGA; same package class in supplied data 357-pin BGA; same package class in supplied data 357-pin BGA; same package class in supplied data 357-pin BGA; same package class in supplied data

关键差异点

  • Verified 50 MHz operation in the MPC8xx PowerQUICC class (对比 MPC860ENCVR50D4)
  • Confirmed 357-pin PBGA package identity (对比 MPC860TCVQ50D4)
  • Single-core 32-bit RISC positioning (对比 MPC860TZQ50D4)
  • 3.3 V supply and lead-free packaging information (对比 MPC860TVR50D4)
  • Explicit end-of-life procurement status (对比 MPC860ENCVR50D4)

设计说明

Use the official NXP 357-pin PBGA land pattern and package drawing. The verified package is 25 x 25 mm, but the supplied data does not include the complete 357-ball map, stack-up, or land-pattern details. Do not derive the footprint from a generic 357-BBGA library. Confirm ball assignments, power and ground distribution, escape routing, assembly process, and inspection requirements before layout release.

Design the 3.3 V supply and sequencing around the exact electrical limits in the official MPC860 datasheet. The verified distributor data confirms a 3.3 V nominal supply but does not state tolerance, current, ramp limits, or power consumption. Check core and I/O supply requirements, decoupling recommendations, power-up behavior, and reset timing before selecting regulators or capacitors. Treat the 3.3 V label as incomplete power-design data.

Do not assume that a related MPC860 suffix is a drop-in replacement. The supplied cross-reference results show several 357-BBGA, 50 MHz MPC860 candidates, but they do not provide full electrical, ballout, timing, memory, or software equivalence. Compare the manufacturer ordering table and current datasheet, then review temperature grade, qualification, package markings, firmware assumptions, and peripheral mappings before substituting any candidate.

Plan thermal validation for the 357-pin PBGA during both design and obsolescence management. The verified data confirms tray packaging and the package dimensions but does not provide thermal resistance, maximum power dissipation, or ambient limits. Use the official electrical data and NXP application guidance to estimate junction temperature and determine whether copper, thermal vias, forced air, or a heatsink is required. Mark any calculations as estimates until validated with the actual board and enclosure.

Because NXP labels the MPC860TCVR50D4 End of Life, avoid treating a distributor listing as proof of long-term availability. Request lot traceability, date code, condition, authorized-source confirmation, and a written stock commitment. For maintenance programs, document approved alternative parts and test procedures so a future substitution does not bypass firmware, hardware, or manufacturing validation.

合规信息

RoHS
Compliant
REACH
Unknown
AEC-Q100
Not Applicable
无铅
Yes
无卤
Unknown
冲突矿物
Unknown

The verified distributor specification lists RoHS Compliant and Lead Free status. The supplied data does not establish REACH, halogen-free, AEC-Q100, or conflict-minerals status. The component is an industrial communications microprocessor, so AEC-Q100 is not treated as applicable based on the supplied information.

数据核验日期: 2026-10-09 ——数据由 XAIPART 元器件工程团队核验和整理

相关搜索

MPC860TCVR50D4 MPC860TCVR50D4 datasheet PDF NXP MPC860 PowerQUICC 50 MHz MPC860 357-pin PBGA processor MPC860TCVR50D4 3.3 V MPC860TCVR50D4 communications controller MPC860TCVR50D4 vs MPC860ENCVR50D4 MPC860TCVR50D4 drop-in replacement MPC860TCVR50D4 price and stock Where to buy MPC860TCVR50D4 online MPC860TCVR50D4 pinout 357-BBGA PowerQUICC replacement

相关元器件 & 术语

NXP Semiconductors MPC860TCVR50D4 MPC860 PowerQUICC 32-bit RISC microprocessor single-core processor 50 MHz 3.3 V 357-pin PBGA 357-BBGA 25 x 25 mm package communications controller networking controller embedded processor semiconductor tray packaging RoHS lead-free end-of-life component MPC860ENCVR50D4 MPC860TCVQ50D4 MPC860TZQ50D4 MPC860TVR50D4 MPC860DTCZQ50D4
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