PEF24628EV1.2-G - Quad-Channel EFM SHDSL SoC | Infineon
料号： PEF24628EV1.2-G ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $38.5 | $38.50 |
| 10 | $34.2 | $342.00 |
| 100 | $28.9 | $2,890.00 |
| 500 | $24.5 | $12,250.00 |
| 1,000 | $21.8 | $21,800.00 |
PEF24628EV1.2-G 概述
A System-on-Chip (SoC) in the telecom interface category is a highly integrated device that combines a CPU subsystem, multiple dedicated protocol engines, and a flexible host interface on a single silicon die. The PEF24628 belongs to the SHDSL/EFM transceiver SoC family, which sits hierarchically under: telecom interface IC -> wired broadband transceiver -> xDSL transceiver -> SHDSL front-end SoC. The device historically originated from the Lantiq product line, which Infineon acquired and now sells as part of its wireline communications portfolio.
Key features include four independent SHDSL channels, support for EFM bonding (G.998.1), on-chip HDLC controllers, parallel and serial host interfaces, low-jitter PLL clock synthesis, and integrated line driver interface logic. The HDLC engine, parallel/serial host ports, and flexible interrupt structure minimize the burden on the external host CPU in a DSLAM line card or CPE modem design.
The architecture is built on a mature 0.13 um CMOS process with mixed-signal analog front-end circuitry for the SHDSL line interface. The part includes dedicated per-channel DSP engines for SHDSL symbol processing, echo cancellation, and trellis coding. Internal SRAM buffers per channel help absorb latency variation on the host bus, and the SerDes block supports multi-channel aggregation to a framer/backhaul device.
Typical applications include SHDSL.bis line cards in DSLAMs, multi-pair bonded EFM Ethernet modems, four-wire industrial DSL links, and legacy E1/T1 extension infrastructure over copper. The quad-channel density makes it a strong fit for small-form-factor CPE MDU/MTU aggregation where four bonded pairs are needed.
Design consideration: pay close attention to the PG-LBGA-324-2 PCB land pattern, controlled-impedance differential routing for the SHDSL line pairs, and proper thermal management - the device dissipates significant power when all four channels are active. Reference Infineon design notes for the recommended magnetics, line protection, and host-IF timing budget.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
直接替换替代料： PEF24628EV1.2-G ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
PEF24624EV1.2-G
✅ 直接替换📋 参考替代料（不在目录中）
PEF24628EV1.2
✅ 直接替换📋 参考替代料（不在目录中）
PEF24628EV1.2-G 规格参数
| Product Type | Telecom SoC / SHDSL Transceiver |
| 功能 | Quad-Channel EFM SHDSL Transceiver |
| Number of Channels | 4 independent SHDSL channels |
| DSL Standard | G.991.2 (SHDSL.bis), G.998.1 (EFM bonding) |
| Host Interface | HDLC, Parallel, Serial |
| Number of Circuits | 1 |
| Supply Voltage - Core | 1.5 V |
| Supply Voltage - I/O | 3.3 V |
| 封装 | PG-LBGA-324-2 |
| Package Pin Count | 324 |
| 安装类型 | Surface Mount (BGA) |
| 工作温度 | -40C to +85C (industrial) |
| RoHS 状态 | Compliant |
| Lead-Free | Yes |
| Line Interface | Differential 2-wire SHDSL line pairs (x4) |
| HDLC Controllers | On-chip, per channel |
| Manufacturer | Infineon Technologies (formerly Lantiq) |
PEF24628EV1.2-G 324 引脚配置指南
PEF24628EV1.2-G（324 封装）的引脚配置。 引脚编号、功能和连接图在制造商数据手册中定义。请参阅该手册以了解确切的封装尺寸和焊接指南。
暂无详细引脚数据： PEF24628EV1.2-G.
请参阅 数据手册 以查看完整引脚配置。
典型应用
PEF24628EV1.2-G 适用于 6 应用s: DSLAM SHDSL Line Card, Bonded EFM Ethernet Modem (CPE), Industrial Multi-Pair DSL Link, Legacy E1/T1 Extension over Copper, MDU/MTU Broadband Aggregation, Wireless Backhaul over Copper (Small Cell).
DSLAM SHDSL Line Card
The PEF24628EV1.2-G is a natural fit for central-office DSLAM line cards that terminate SHDSL.bis subscribers at multi-megabit symmetric rates. With four independent SHDSL channels per chip plus on-chip HDLC controllers and a flexible parallel/serial host bus, the part cuts BOM cost per port in half compared to single-channel transceivers. Designers can aggregate 8-16 ports per line card by stacking 2-4 PEF24628 devices, sharing the backplane host bus and reference clock. The 1.5 V core / 3.3 V I/O supplies integrate cleanly with standard DSLAM ASIC or network processor silicon, and the -40C to +85C operating range supports thermally constrained CO cabinet deployments.
推荐
Bonded EFM Ethernet Modem (CPE)
For customer-premises bonded EFM Ethernet modems that aggregate 2-4 SHDSL pairs into a single high-speed Ethernet link, the PEF24628EV1.2-G provides all four channels plus G.998.1 bonding glue in one IC. The on-chip HDLC and SerDes blocks offload framing and aggregation from the CPE host CPU, allowing a low-cost MIPS or ARM processor to handle L2/L3 forwarding. The 324-pin BGA keeps the CPE PCB under 50x50 mm even with magnetics and line protection, and the industrial temperature range supports outdoor or MDU/MTU enclosure deployment.
推荐
Industrial Multi-Pair DSL Link
Industrial sites with existing 2-wire copper infrastructure (rail, utility substations, factory floors) can use the PEF24628EV1.2-G to deliver symmetric Ethernet over 2-4 bonded pairs at distances up to several kilometers. The SHDSL.bis coding provides strong immunity to impulse noise, while the on-chip DSP per channel handles adaptive equalization without external host intervention. The device's -40C to +85C operating range and lead-free PG-LBGA package suit harsh-environment industrial gateways and SCADA concentrators where commercial-grade parts would fail.
推荐
Legacy E1/T1 Extension over Copper
Carriers extending E1/T1 circuits to sites without fiber can backhaul multiple E1/T1 streams over a single bonded SHDSL link using the PEF24628EV1.2-G. Each of the four SHDSL channels can carry a fractional E1 payload, and the on-chip HDLC controllers handle the per-channel framing without external mapper devices. This dramatically reduces the recurring leased-line cost compared to multiple discrete E1 modems, while keeping the central-office aggregation in a single dense line-card slot.
推荐
MDU/MTU Broadband Aggregation
Multi-Dwelling and Multi-Tenant Units (MDU/MTU) often need to backhaul broadband from many apartments over existing in-building copper. The PEF24628EV1.2-G supports 4-pair bonded EFM from a single CPE per dwelling, aggregating upstream to a basement DSLAM. Its 1.5 V core / 3.3 V I/O dual supply matches the power tree of typical MDU aggregator designs, and the small BGA footprint enables a wall-mount CPE enclosure that fits in standard telecom back-boxes.
推荐
Wireless Backhaul over Copper (Small Cell)
Small-cell backhaul over existing copper is a common deployment, and the PEF24628EV1.2-G can deliver 4-pair bonded symmetric bandwidth of 10+ Mbps suitable for 4G small-cell backhaul where fiber is unavailable. The chip's industrial temperature grade and high MTBF (no moving parts, mature 0.13 um CMOS) suit tower-top or street-furniture cabinets. The 324-pin BGA allows the radio, modem, and PoE circuitry to share a single compact mainboard.
推荐
推荐产品汇总
工程参考数据： PEF24628EV1.2-G ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | PEF24624EV1.2-G | PEF24628EV1.2 |
|---|---|---|---|
| Package | PG-LBGA-324-2 | PG-LBGA-256 (different) | PG-LBGA-324-2 (same) |
| Brand | Infineon | Infineon | Infineon |
| SHDSL Channels | 4 | 2 | 4 |
| Core Supply | 1.5 V | 1.5 V | 1.5 V |
| I/O Supply | 3.3 V | 3.3 V | 3.3 V |
| Lead-Free / RoHS | Yes (-G suffix) | Yes (-G suffix) | No (SnPb finish) |
| On-Chip HDLC | Yes (per channel) | Yes (per channel) | Yes (per channel) |
| Operating Temperature | -40C to +85C | -40C to +85C | -40C to +85C |
关键差异点
- Quad-channel SHDSL density in a single chip （对比 PEF24624EV1.2-G)
- On-chip HDLC controllers per channel （对比 Discrete SHDSL PHY + external HDLC chip)
- Lead-free RoHS-compliant green compound （对比 PEF24628EV1.2 (non-G, SnPb finish))
设计说明
The PEF24628EV1.2-G requires two well-decoupled supplies: 1.5 V for the digital core and 3.3 V for the I/O and analog front-end. Use a low-noise LDO (e.g., TPS7A4701-class) for the 1.5 V rail because SHDSL symbol-rate jitter is sensitive to core supply noise. Decouple each supply with a 10 uF bulk + 0.1 uF + 1 nF high-frequency cap placed within 3 mm of each BGA power pin cluster. The two rails should power up within 10 ms of each other to avoid CMOS latch-up; check the manufacturer datasheet for the exact sequencing diagram.
The PG-LBGA-324-2 package requires a 4-6 layer PCB with microvia-in-pad or via-on-pad technology to break out the 0.8 mm pitch BGA. Use a 1 oz copper outer layer with 0.5 oz inner layers and a continuous ground plane on layer 2 directly beneath the device for thermal spreading and controlled impedance for the SHDSL differential pairs. Route the SHDSL line pairs as 100 ohm differential with 5 mil trace/space and length-match within 5 mil across each pair. The thermal pad/die-attach balls require a thermal via array of 0.3 mm drilled vias on a 0.8 mm pitch to the inner ground plane.
Do not skip the external line-protection circuitry (TVS diodes, PTC fuses, gas discharge tubes) on the SHDSL line pairs - the PEF24628EV1.2-G's analog front end is not designed to survive a direct lightning surge or cross-cabinet short. Reference the Infineon design guide for the recommended Bourns or Littelfuse protection part numbers. Additionally, ensure the 25 MHz (or per datasheet) reference clock source has < 50 ppm accuracy and < 1 ps RMS jitter; SHDSL symbol locking is highly sensitive to clock phase noise and will fail to train otherwise.
合规信息
-G suffix confirms lead-free RoHS compliance per Infineon product page. Not AEC-Q100 qualified - this is a telecom infrastructure part, not automotive. Halogen-free status not explicitly stated in distributor listings; check with Infineon for the latest material declaration.
