RK3288 - Quad-Core Cortex-A17 SoC | Rockchip | BGA-636
料号： RK3288 ✗ 停产| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $14.06 | $14.06 |
| 10 | $13.5 | $135.00 |
| 100 | $12.75 | $1,275.00 |
| 500 | $12 | $6,000.00 |
| 1,000 | $11.25 | $11,250.00 |
RK3288 概述
A quad-core application processor (AP) is a system-on-chip that integrates multiple CPU cores, a graphics processor, memory interfaces, display controllers, and standard peripherals (USB, SDIO, I2C, SPI, UART, Ethernet, HDMI, LVDS, MIPI) on a single die. In a system architecture, the AP sits between power management ICs (PMICs), DRAM (LPDDR2/LPDDR3/DDR3), and the display/camera subsystems. The RK3288 belongs to a broader family of Rockchip ARM APs and is part of the Cortex-A17 generation that targeted Android tablets, set-top boxes, Chromebooks, and digital signage during the mid-2010s.
Key features include quad-core ARM Cortex-A17 up to 1.8 GHz, Mali-T764 GPU with OpenGL ES 3.1 support, hardware-accelerated 4K H.264/H.265 video decode, HDMI 2.0 output up to 4K@60Hz, dual-channel 32-bit LPDDR3/DDR3/LPDDR2 interface, MIPI DSI and LVDS display outputs, USB 2.0, SD/MMC, eMMC 5.0 support, and integrated audio codec with SPDIF/I2S. The chip supports Android 5.x/6.x and Linux kernels, making it a versatile multimedia AP for consumer and embedded OEMs.
The RK3288 uses a 28 nm HKMG CMOS process, which balances performance with reasonable power consumption. Its quad-core Cortex-A17 out-of-order design delivers significantly higher single-threaded performance than the Cortex-A9 predecessor (RK3188) and enables efficient multitasking. The Mali-T764 GPU supports modern graphics APIs, while the 4K hardware codec block offloads video decode from the CPU cores.
Typical applications include Android tablets, Chromebooks, digital signage, smart home control panels, set-top boxes, industrial HMI terminals, and embedded kiosks. Designers choose the RK3288 when they need a mature quad-core Cortex-A17 SoC with strong multimedia capabilities and broad Linux/Android BSP support.
When designing with the RK3288, pay attention to PCB layout for the BGA-636 footprint - it requires microvia / HDI PCB technology for reliable BGA escape routing. Thermal management is critical because the SoC can dissipate 2 to 5 W under full CPU+GPU+4K decode load. Use a multi-layer PCB with a continuous ground plane under the BGA and provide adequate copper thermal relief around the package. Validate the PMIC compatibility (e.g., RK808 or ACT8846 family) and DRAM timing margins before committing to volume production.
This page synthesizes distributor pricing, drop-in same-package Rockchip SoC variants, application pairings, and practical PCB/system design notes not typically consolidated in the manufacturer datasheet.
直接替换替代料： RK3288 ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
快速对比工具——选择替代料号进行并排对比：
RK3288W
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
RK3288-CG
✅ 直接替换 ⚠️ 规格未核验📋 参考替代料（不在目录中）
RK3288 最大额定值与电气特性
| CPU Architecture | Quad-core ARM Cortex-A17 with NEON coprocessor |
| Maximum CPU Frequency | 1.8 GHz |
| GPU | ARM Mali-T764 (OpenGL ES 3.1, OpenCL 1.2) |
| Process Technology | 28 nm HKMG CMOS |
| 封装 | BGA-636 (636-ball BGA) |
| DRAM Interface | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 |
| Storage Interface | eMMC 5.0, SD/MMC, SPI NOR/NAND |
| Video Decode | H.264 / H.265 4K hardware decode |
| Display Output | HDMI 2.0 up to 4K@60Hz, MIPI-DSI, LVDS, eDP |
| Camera Interface | MIPI CSI-2 (up to 2 cameras) |
| USB | USB 2.0 Host + USB 2.0 OTG |
| Peripherals | I2C, SPI, UART, SDIO, I2S/PCM, SPDIF, Ethernet MAC |
| Operating Systems | Android 5.x/6.x, Linux 3.10/4.4 |
| RoHS 状态 | Compliant |
| Operating Temperature (commercial) | 0 C to +85 C |
RK3288 bga-636 (636-ball bga) 引脚配置指南
RK3288（bga-636 (636-ball bga) 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： RK3288.
请参阅 数据手册 以查看完整引脚配置。
典型应用
RK3288 适用于 6 应用s: Android Tablets (8"-10"), Chromebook / Netbook Mainboards, Digital Signage and Smart Kiosks, Set-Top Boxes and TV Dongles, Industrial HMI and Control Panels, Smart Home Control Panels and IoT Gateways.
Android Tablets (8"-10")
The RK3288 quad-core Cortex-A17 at 1.8 GHz combined with the Mali-T764 GPU makes it well suited to mid-range Android tablets in the 8- to 10-inch class. Engineers can drive WXGA or FHD IPS panels via the integrated MIPI-DSI and HDMI 2.0 outputs, with the 4K hardware decoder enabling smooth 1080p and 4K streaming. The dual-channel 32-bit LPDDR3 interface (up to 4 GB) delivers enough bandwidth to keep the GPU and 4K video pipeline fed. Versus a Cortex-A9 predecessor like RK3188, the Cortex-A17 out-of-order cores deliver roughly 60 % higher single-threaded performance, which directly improves UI responsiveness in Android 5/6.
推荐
Chromebook / Netbook Mainboards
Chrome OS and Chromium-based netbooks historically adopted the RK3288 because it integrates a quad-core ARM Cortex-A17 cluster, HDMI 2.0, USB 2.0, SD card, and an LVDS display interface in a single BGA-636 SoC. Pairing the RK3288 with an LPDDR3 DRAM and eMMC 5.0 module yields a compact x86-class netbook motherboard with ARM power efficiency. The 28 nm HKMG process keeps typical power around 2-4 W under browsing load, which translates to 8-10 hour battery life in a 30 Wh chassis. The processor boots Android/Chrome OS images directly from eMMC with no external bootloader required.
推荐
Digital Signage and Smart Kiosks
Digital signage players and interactive kiosk designs use the RK3288 to drive HDMI 2.0 panels at 4K@60 Hz while running Android-based signage software. The SoC's hardware 4K H.264/H.265 decoder offloads video playback from the CPU, leaving more headroom for UI overlays, sensor integration, and remote-management agents. LVDS and MIPI-DSI outputs let integrators reuse the same RK3288 board for both standalone kiosks (HDMI monitor) and integrated LCD kiosks (LVDS panel). Industrial temperature screening is advised since signage deployments often run in semi-outdoor enclosures; the commercial-grade temperature spec (0-85 C) covers most indoor environments.
推荐
Set-Top Boxes and TV Dongles
Set-top boxes and HDMI streaming dongles depend on the RK3288's 4K hardware video codec, HDMI 2.0 transmitter, and Android/Linux app ecosystem. The SoC can decode 4K H.265 streams while simultaneously running the UI, streaming apps, and DRM/widevine security stack. Its low BOM - single SoC plus DRAM, eMMC, Wi-Fi module, and HDMI connector - keeps the dongle bill of materials competitive. Engineers benefit from existing Android TV reference designs and Rockchip BSP support for popular streaming frameworks.
推荐
Industrial HMI and Control Panels
Industrial human-machine interface (HMI) panels pair the RK3288 with an LVDS or MIPI-DSI display to deliver responsive multitouch control surfaces for factory automation and building management. The Cortex-A17 cores and NEON SIMD accelerate typical HMI workloads (graphical animations, MQTT/Modbus-TCP polling, data logging) without breaking a sweat, while the dual-display capability (HDMI + LVDS) lets engineers mirror the screen on an external monitor for diagnostic use. The BGA-636 package and 28 nm SoC allow fanless operation when paired with a modest heatsink and a continuous ground pour. The design should leverage the Linux BSP and long-term kernel support that Rockchip provides for industrial customers.
推荐
Smart Home Control Panels and IoT Gateways
The RK3288 suits smart home panels and IoT gateways that combine a touchscreen UI, voice control, Zigbee/Z-Wave/BLE radio, and Wi-Fi connectivity. The quad-core SoC runs Android or Linux with a graphics-rich control app while offloading sensor aggregation and protocol translation to a companion radio module. HDMI output enables a big-screen display mode (turning the panel into a family-room dashboard), while USB 2.0 and SD card interfaces support peripherals like cameras and BLE dongles. The integrated audio codec and I2S/SPDIF interfaces simplify direct connection to panel-mounted speakers and microphones.
推荐
推荐产品汇总
工程参考数据： RK3288 ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | RK3288W | RK3288-CG | Tegra 3 T30 |
|---|---|---|---|---|
| Package | BGA-636 (636-ball BGA, 17x17 mm, 0.5 mm pitch) | BGA-636 - same | BGA-636 - same | BGA - different footprint |
| Brand | Rockchip | Rockchip - same | Rockchip - same | NVIDIA |
| CPU Architecture | Quad-core ARM Cortex-A17 up to 1.8 GHz | Quad-core Cortex-A17 up to 1.8 GHz | Quad-core Cortex-A17 up to 1.8 GHz | Quad-core Cortex-A9 up to 1.4 GHz |
| GPU | Mali-T764 (4-core) | Mali-T764 (4-core) | Mali-T764 (4-core) | GeForce ULP (12-core) |
| Process Technology | 28 nm HKMG | 28 nm HKMG | 28 nm HKMG | 40 nm |
| DRAM Interface | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 | 32-bit single-channel LPDDR2/DDR3 |
| Max HDMI Output | HDMI 2.0 (4K@60 Hz) | HDMI 2.0 (4K@60 Hz) | HDMI 2.0 (4K@60 Hz) | HDMI 1.4 (1080p) |
关键差异点
- Quad-core Cortex-A17 delivers ~60 % higher single-threaded IPC than the prior Cortex-A9 RK3188 （对比 RK3188 (predecessor))
- HDMI 2.0 with 4K@60 Hz output and 4K H.264/H.265 hardware decode （对比 Tegra 3 T30)
- BGA-636 in same family as RK3288W/RK3288-CG, enabling board reuse and stepping migration （对比 RK3568 (different package))
- Dual-channel 32-bit LPDDR3 / DDR3 interface for up to 4 GB DRAM （对比 Tegra 3 T30 single-channel)
设计说明
The RK3288 ships in a 636-ball BGA with a 0.5 mm ball pitch, which forces HDI PCB stack-up with laser-drilled microvias for inner-row escape. Use at least a 6-layer board (signal / ground / power / power / ground / signal) and maintain a continuous ground plane directly under the BGA to provide a low-impedance return path for high-speed DRAM and HDMI signals. Vias-in-pad are not recommended for cost reasons; use dog-bone fan-out instead. The exposed die-attach paddle under the BGA should be soldered to a large central thermal pad on the top layer to spread heat.
Estimated: with a continuous 50 mm x 50 mm copper pour on the top layer and a 4-layer 1 oz PCB, theta_JA is approximately 15-20 C/W. Under a full CPU + GPU + 4K decode workload, the SoC may dissipate 4-5 W, which keeps junction temperature rise under 100 C above ambient. Designers targeting enclosed kiosks should add a small top-side heatsink (10 mm x 10 mm x 5 mm) or an internal fan to extend MTBF. Validate thermal performance in a real chassis before locking the BOM.
Pair the RK3288 with the Rockchip RK808 (or ACT8846 family) PMIC. The PMIC must generate the 0.9 V / 1.0 V / 1.2 V CPU/GPU core rails, the 1.5 V LPDDR3 rail, and the 1.8 V / 3.3 V I/O rails with the correct sequencing and rise times. Add bulk 22 uF ceramic + 100 nF decoupling on every active rail, plus 10 uF bulk on the SoC's core supply pins. Hot-plugging USB or HDMI while the PMIC is mid-startup can cause latch-up; make sure the PMIC is fully stable before exposing external ports.
DRAM training is sensitive to PCB trace impedance - target 40 ohms +/-10 % for the 32-bit DDR3/LPDDR3 interface and keep all byte lanes length-matched within 25 mil. HDMI 2.0 TMDS pairs must be routed with 50 ohms +/-10 % differential and length-matched to within 50 mil on the intra-pair; failing this leads to intermittent pixel dropouts at 4K@60 Hz. Mistaking the RK3288-CG stepping for the RK3288-W stepping can leave Wi-Fi/BT companion pins floating - verify the stepping in the boot ROM version before locking the schematic.
合规信息
RoHS compliance confirmed via JLCPCB/LCSC distributor listings per verified web data. Halogen-free status not stated in retrieved product data. AEC-Q100 not applicable because this is a consumer multimedia AP, not an automotive part.
