RK3288 - Quad-Core Cortex-A17 SoC | Rockchip | BGA-636
부품 번호: RK3288 ✗ 단종| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $14.06 | $14.06 |
| 10 | $13.5 | $135.00 |
| 100 | $12.75 | $1,275.00 |
| 500 | $12 | $6,000.00 |
| 1,000 | $11.25 | $11,250.00 |
RK3288 개요
A quad-core application processor (AP) is a system-on-chip that integrates multiple CPU cores, a graphics processor, memory interfaces, display controllers, and standard peripherals (USB, SDIO, I2C, SPI, UART, Ethernet, HDMI, LVDS, MIPI) on a single die. In a system architecture, the AP sits between power management ICs (PMICs), DRAM (LPDDR2/LPDDR3/DDR3), and the display/camera subsystems. The RK3288 belongs to a broader family of Rockchip ARM APs and is part of the Cortex-A17 generation that targeted Android tablets, set-top boxes, Chromebooks, and digital signage during the mid-2010s.
Key features include quad-core ARM Cortex-A17 up to 1.8 GHz, Mali-T764 GPU with OpenGL ES 3.1 support, hardware-accelerated 4K H.264/H.265 video decode, HDMI 2.0 output up to 4K@60Hz, dual-channel 32-bit LPDDR3/DDR3/LPDDR2 interface, MIPI DSI and LVDS display outputs, USB 2.0, SD/MMC, eMMC 5.0 support, and integrated audio codec with SPDIF/I2S. The chip supports Android 5.x/6.x and Linux kernels, making it a versatile multimedia AP for consumer and embedded OEMs.
The RK3288 uses a 28 nm HKMG CMOS process, which balances performance with reasonable power consumption. Its quad-core Cortex-A17 out-of-order design delivers significantly higher single-threaded performance than the Cortex-A9 predecessor (RK3188) and enables efficient multitasking. The Mali-T764 GPU supports modern graphics APIs, while the 4K hardware codec block offloads video decode from the CPU cores.
Typical applications include Android tablets, Chromebooks, digital signage, smart home control panels, set-top boxes, industrial HMI terminals, and embedded kiosks. Designers choose the RK3288 when they need a mature quad-core Cortex-A17 SoC with strong multimedia capabilities and broad Linux/Android BSP support.
When designing with the RK3288, pay attention to PCB layout for the BGA-636 footprint - it requires microvia / HDI PCB technology for reliable BGA escape routing. Thermal management is critical because the SoC can dissipate 2 to 5 W under full CPU+GPU+4K decode load. Use a multi-layer PCB with a continuous ground plane under the BGA and provide adequate copper thermal relief around the package. Validate the PMIC compatibility (e.g., RK808 or ACT8846 family) and DRAM timing margins before committing to volume production.
This page synthesizes distributor pricing, drop-in same-package Rockchip SoC variants, application pairings, and practical PCB/system design notes not typically consolidated in the manufacturer datasheet.
드롭인 대체품: RK3288 — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
RK3288W
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
RK3288-CG
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
RK3288 최대 정격 & 전기적 특성
| CPU Architecture | Quad-core ARM Cortex-A17 with NEON coprocessor |
| Maximum CPU Frequency | 1.8 GHz |
| GPU | ARM Mali-T764 (OpenGL ES 3.1, OpenCL 1.2) |
| Process Technology | 28 nm HKMG CMOS |
| 패키지 | BGA-636 (636-ball BGA) |
| DRAM Interface | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 |
| Storage Interface | eMMC 5.0, SD/MMC, SPI NOR/NAND |
| Video Decode | H.264 / H.265 4K hardware decode |
| Display Output | HDMI 2.0 up to 4K@60Hz, MIPI-DSI, LVDS, eDP |
| Camera Interface | MIPI CSI-2 (up to 2 cameras) |
| USB | USB 2.0 Host + USB 2.0 OTG |
| Peripherals | I2C, SPI, UART, SDIO, I2S/PCM, SPDIF, Ethernet MAC |
| Operating Systems | Android 5.x/6.x, Linux 3.10/4.4 |
| RoHS 상태 | Compliant |
| Operating Temperature (commercial) | 0 C to +85 C |
RK3288 bga-636 (636-ball bga) 핀 구성 가이드
RK3288(bga-636 (636-ball bga) 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: RK3288.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
RK3288 적합 용도: 6 애플리케이션s: Android Tablets (8"-10"), Chromebook / Netbook Mainboards, Digital Signage and Smart Kiosks, Set-Top Boxes and TV Dongles, Industrial HMI and Control Panels, Smart Home Control Panels and IoT Gateways.
Android Tablets (8"-10")
The RK3288 quad-core Cortex-A17 at 1.8 GHz combined with the Mali-T764 GPU makes it well suited to mid-range Android tablets in the 8- to 10-inch class. Engineers can drive WXGA or FHD IPS panels via the integrated MIPI-DSI and HDMI 2.0 outputs, with the 4K hardware decoder enabling smooth 1080p and 4K streaming. The dual-channel 32-bit LPDDR3 interface (up to 4 GB) delivers enough bandwidth to keep the GPU and 4K video pipeline fed. Versus a Cortex-A9 predecessor like RK3188, the Cortex-A17 out-of-order cores deliver roughly 60 % higher single-threaded performance, which directly improves UI responsiveness in Android 5/6.
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Chromebook / Netbook Mainboards
Chrome OS and Chromium-based netbooks historically adopted the RK3288 because it integrates a quad-core ARM Cortex-A17 cluster, HDMI 2.0, USB 2.0, SD card, and an LVDS display interface in a single BGA-636 SoC. Pairing the RK3288 with an LPDDR3 DRAM and eMMC 5.0 module yields a compact x86-class netbook motherboard with ARM power efficiency. The 28 nm HKMG process keeps typical power around 2-4 W under browsing load, which translates to 8-10 hour battery life in a 30 Wh chassis. The processor boots Android/Chrome OS images directly from eMMC with no external bootloader required.
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Digital Signage and Smart Kiosks
Digital signage players and interactive kiosk designs use the RK3288 to drive HDMI 2.0 panels at 4K@60 Hz while running Android-based signage software. The SoC's hardware 4K H.264/H.265 decoder offloads video playback from the CPU, leaving more headroom for UI overlays, sensor integration, and remote-management agents. LVDS and MIPI-DSI outputs let integrators reuse the same RK3288 board for both standalone kiosks (HDMI monitor) and integrated LCD kiosks (LVDS panel). Industrial temperature screening is advised since signage deployments often run in semi-outdoor enclosures; the commercial-grade temperature spec (0-85 C) covers most indoor environments.
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Set-Top Boxes and TV Dongles
Set-top boxes and HDMI streaming dongles depend on the RK3288's 4K hardware video codec, HDMI 2.0 transmitter, and Android/Linux app ecosystem. The SoC can decode 4K H.265 streams while simultaneously running the UI, streaming apps, and DRM/widevine security stack. Its low BOM - single SoC plus DRAM, eMMC, Wi-Fi module, and HDMI connector - keeps the dongle bill of materials competitive. Engineers benefit from existing Android TV reference designs and Rockchip BSP support for popular streaming frameworks.
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Industrial HMI and Control Panels
Industrial human-machine interface (HMI) panels pair the RK3288 with an LVDS or MIPI-DSI display to deliver responsive multitouch control surfaces for factory automation and building management. The Cortex-A17 cores and NEON SIMD accelerate typical HMI workloads (graphical animations, MQTT/Modbus-TCP polling, data logging) without breaking a sweat, while the dual-display capability (HDMI + LVDS) lets engineers mirror the screen on an external monitor for diagnostic use. The BGA-636 package and 28 nm SoC allow fanless operation when paired with a modest heatsink and a continuous ground pour. The design should leverage the Linux BSP and long-term kernel support that Rockchip provides for industrial customers.
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Smart Home Control Panels and IoT Gateways
The RK3288 suits smart home panels and IoT gateways that combine a touchscreen UI, voice control, Zigbee/Z-Wave/BLE radio, and Wi-Fi connectivity. The quad-core SoC runs Android or Linux with a graphics-rich control app while offloading sensor aggregation and protocol translation to a companion radio module. HDMI output enables a big-screen display mode (turning the panel into a family-room dashboard), while USB 2.0 and SD card interfaces support peripherals like cameras and BLE dongles. The integrated audio codec and I2S/SPDIF interfaces simplify direct connection to panel-mounted speakers and microphones.
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추천 제품 요약
엔지니어링 참조 데이터: RK3288 — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | RK3288W | RK3288-CG | Tegra 3 T30 |
|---|---|---|---|---|
| Package | BGA-636 (636-ball BGA, 17x17 mm, 0.5 mm pitch) | BGA-636 - same | BGA-636 - same | BGA - different footprint |
| Brand | Rockchip | Rockchip - same | Rockchip - same | NVIDIA |
| CPU Architecture | Quad-core ARM Cortex-A17 up to 1.8 GHz | Quad-core Cortex-A17 up to 1.8 GHz | Quad-core Cortex-A17 up to 1.8 GHz | Quad-core Cortex-A9 up to 1.4 GHz |
| GPU | Mali-T764 (4-core) | Mali-T764 (4-core) | Mali-T764 (4-core) | GeForce ULP (12-core) |
| Process Technology | 28 nm HKMG | 28 nm HKMG | 28 nm HKMG | 40 nm |
| DRAM Interface | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 | 32-bit dual-channel LPDDR2/LPDDR3/DDR3 | 32-bit single-channel LPDDR2/DDR3 |
| Max HDMI Output | HDMI 2.0 (4K@60 Hz) | HDMI 2.0 (4K@60 Hz) | HDMI 2.0 (4K@60 Hz) | HDMI 1.4 (1080p) |
주요 차별점
- Quad-core Cortex-A17 delivers ~60 % higher single-threaded IPC than the prior Cortex-A9 RK3188 (vs RK3188 (predecessor))
- HDMI 2.0 with 4K@60 Hz output and 4K H.264/H.265 hardware decode (vs Tegra 3 T30)
- BGA-636 in same family as RK3288W/RK3288-CG, enabling board reuse and stepping migration (vs RK3568 (different package))
- Dual-channel 32-bit LPDDR3 / DDR3 interface for up to 4 GB DRAM (vs Tegra 3 T30 single-channel)
설계 노트
The RK3288 ships in a 636-ball BGA with a 0.5 mm ball pitch, which forces HDI PCB stack-up with laser-drilled microvias for inner-row escape. Use at least a 6-layer board (signal / ground / power / power / ground / signal) and maintain a continuous ground plane directly under the BGA to provide a low-impedance return path for high-speed DRAM and HDMI signals. Vias-in-pad are not recommended for cost reasons; use dog-bone fan-out instead. The exposed die-attach paddle under the BGA should be soldered to a large central thermal pad on the top layer to spread heat.
Estimated: with a continuous 50 mm x 50 mm copper pour on the top layer and a 4-layer 1 oz PCB, theta_JA is approximately 15-20 C/W. Under a full CPU + GPU + 4K decode workload, the SoC may dissipate 4-5 W, which keeps junction temperature rise under 100 C above ambient. Designers targeting enclosed kiosks should add a small top-side heatsink (10 mm x 10 mm x 5 mm) or an internal fan to extend MTBF. Validate thermal performance in a real chassis before locking the BOM.
Pair the RK3288 with the Rockchip RK808 (or ACT8846 family) PMIC. The PMIC must generate the 0.9 V / 1.0 V / 1.2 V CPU/GPU core rails, the 1.5 V LPDDR3 rail, and the 1.8 V / 3.3 V I/O rails with the correct sequencing and rise times. Add bulk 22 uF ceramic + 100 nF decoupling on every active rail, plus 10 uF bulk on the SoC's core supply pins. Hot-plugging USB or HDMI while the PMIC is mid-startup can cause latch-up; make sure the PMIC is fully stable before exposing external ports.
DRAM training is sensitive to PCB trace impedance - target 40 ohms +/-10 % for the 32-bit DDR3/LPDDR3 interface and keep all byte lanes length-matched within 25 mil. HDMI 2.0 TMDS pairs must be routed with 50 ohms +/-10 % differential and length-matched to within 50 mil on the intra-pair; failing this leads to intermittent pixel dropouts at 4K@60 Hz. Mistaking the RK3288-CG stepping for the RK3288-W stepping can leave Wi-Fi/BT companion pins floating - verify the stepping in the boot ROM version before locking the schematic.
규정 준수 정보
RoHS compliance confirmed via JLCPCB/LCSC distributor listings per verified web data. Halogen-free status not stated in retrieved product data. AEC-Q100 not applicable because this is a consumer multimedia AP, not an automotive part.
