RTAX250SL-1LG624V - 250K-Gate Rad-Tolerant FPGA | Microchip
料号： RTAX250SL-1LG624V ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $1020 | $510,000.00 |
| 1,000 | $950 | $950,000.00 |
RTAX250SL-1LG624V 概述
A radiation-tolerant FPGA is a field-programmable gate array qualified for the space environment, where cosmic rays and trapped protons cause single-event effects and total ionizing dose degradation. Within the power hierarchy, the RTAX-S/SL family sits above commercial FPGAs and below fully rad-hard ASICs, giving satellite and spacecraft designers programmable flexibility with space-grade reliability. Unlike SRAM-based FPGAs, its antifuse configuration is permanent and immune to configuration upsets.
Key features include embedded SRAM blocks with built-in FIFO control logic, segmentable clock resources, chip-wide highway routing, and dedicated carry logic for arithmetic. The SL variant offers enhanced total-dose performance relative to the base RTAX250S. The -1 speed grade balances timing performance with power, and the V suffix denotes a specific screening flow.
Technically, the device operates at a nominal 1.5V core supply (as specified for the RTAX250S family) with operating temperature from -55C to +125C, supporting harsh thermal environments in orbit. Timing performance reaches several hundred megahertz in system-level paths, enabling onboard data processing, telemetry formatting, and protocol bridging on a single chip.
Typical applications include satellite payload data processing, spacecraft command and telemetry interfaces, sensor front-end preprocessing, and bus avionics where low power, single-chip integration, and radiation tolerance are mandatory design drivers.
A key design consideration: antifuse FPGAs are one-time programmable, so design verification must rely on simulation and the dedicated prototype devices (PROTO units share timing attributes with flight units) before committing to flight hardware.
This page synthesizes verified distributor data, family-level alternatives, and design guidance not found in the manufacturer datasheet alone.
直接替换替代料： RTAX250SL-1LG624V ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： RTAX250SL-1LG624V （相同外形与封装尺寸） ——差异在于 Package, Radiation Tolerance, Family, Configuration, Core Supply Voltage.
快速对比工具——选择替代料号进行并排对比：
RTAX250SL-1LG624B
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX250SL-LG624B
✅ 直接替换✓ 有现货
$2380 / 个
查看数据手册 →RTAX250SL-CG624B
✅ 直接替换✓ 有现货
$3950 / 个
查看数据手册 →RTAX250S-1LG624V
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX250S-LG624V
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX250S-1LG624B
✅ 直接替换✓ 有现货
$2020 / 个
查看数据手册 →RTAX250S-LG624B
✅ 直接替换✓ 有现货
$2350 / 个
查看数据手册 →RTAX250SL-1LG624V 最大额定值与电气特性
| Equivalent System Gates | 250,000 gates |
| Logic Cells | 4224 |
| Configurable Logic Blocks (CLBs) | 2816 |
| Architecture | CMOS antifuse (Axcelerator-derived) |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Core Supply Voltage | 1.5 V nominal |
| Speed Grade | -1 |
| 封装 | 624-terminal ceramic CGA (LG624), 1.270 mm terminal pitch |
| 安装类型 | Surface Mount |
| 工作温度 | -55C to +125C |
| Configuration Type | One-Time Programmable (antifuse) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| Application Domain | Space-flight systems |
RTAX250SL-1LG624V 624-terminal ceramic cga (lg624), 1.270 mm terminal pitch 引脚配置指南
RTAX250SL-1LG624V（624-terminal ceramic cga (lg624), 1.270 mm terminal pitch 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： RTAX250SL-1LG624V.
请参阅 数据手册 以查看完整引脚配置。
典型应用
RTAX250SL-1LG624V 适用于 6 应用s: Satellite Payload Data Processing, Spacecraft Command and Telemetry Interface, Onboard Sensor Front-End Preprocessing, Launch Vehicle Avionics, Prototype and Design Verification, Deep-Space Mission Digital Logic.
Satellite Payload Data Processing
The RTAX250SL-1LG624V fits satellite payload processing because its 250,000 gates and 2816 CLBs provide enough capacity for framing, compression, and packetization logic, while antifuse configuration eliminates configuration-upset risk in orbit. The embedded SRAM blocks with built-in FIFO control buffer high-rate sensor streams, and chip-wide highway routing sustains system-level data paths. Placed between payload ADCs and downlink formatters, the -1 speed grade supports fast system timing, and operation from -55C to +125C covers unheated payload bays. The SL enhanced TID rating extends usable mission life in high-radiation orbits.
推荐
Spacecraft Command and Telemetry Interface
For command and telemetry handling, the RTAX250SL-1LG624V implements CCSDS-style protocol bridges, MIL-STD-1553 glue logic, and housekeeping aggregation in a single live-at-power-up chip - critical because avionics interfaces must function immediately at turn-on without configuration load time. Its segmentable clocks allow independent timing domains for the telemetry encoder and command decoder. With 4224 logic cells the part absorbs interface protocols that would otherwise need multiple ASICs. The 1.5V nominal core supply keeps overall bus power low, a key constraint on small satellites and deep-space probes.
推荐
Onboard Sensor Front-End Preprocessing
Imaging and scientific instruments onboard spacecraft use the RTAX250SL-1LG624V to perform real-time sensor preprocessing such as correlated double sampling timing, data deserialization, and lossless compression. The dedicated carry logic accelerates arithmetic in compression engines, while embedded SRAM FIFOs absorb burst data from image sensors before downlink. Because antifuse configuration is immune to SEU-induced reconfiguration, the processing chain remains deterministic throughout the mission. The -55C to +125C range supports instruments mounted on externally exposed platforms that see extreme thermal cycling in eclipse and sunlit operations.
推荐
Launch Vehicle Avionics
Launch vehicles demand logic that survives extreme vibration, wide temperature, and intense radiation belts during ascent. The RTAX250SL-1LG624V ceramic CGA package withstands mechanical stress better than plastic packages, and its -1 speed grade meets fast flight-control loop timing. Designers implement flight-event sequencing, redundant-voting logic, and bus interfaces in the 2816 available CLBs. Live-at-power-up operation guarantees that flight-critical logic is active from battery application, with no boot sequence. The SL TID enhancement covers trajectories passing through the Van Allen belts.
推荐
Prototype and Design Verification
Microchip offers RTAX-S/SL prototype units that share the same timing attributes as flight devices but use non-hermetic ceramic packages, allowing design teams to validate RTL, timing closure, and board bring-up before committing to flight-screened RTAX250SL-1LG624V units. Because antifuse devices are one-time programmable, thorough verification on PROTO hardware is essential practice: functional simulation plus real hardware testing on prototypes reduces risk of irrecoverable programming errors on flight units. The Microchip Libero design suite flows from prototype to flight device without design changes.
推荐
Deep-Space Mission Digital Logic
Deep-space probes experience total ionizing doses far beyond low-earth-orbit levels, making the RTAX250SL-1LG624V's enhanced SL TID performance a decisive selection factor. The antifuse fabric is inherently immune to configuration memory upsets, so mission planners avoid scrubbing controllers and configuration redundancy required by SRAM FPGAs. Its 4224 logic cells implement science-data formatting, autonomy logic, and fault-management state machines within tight power budgets from the 1.5V nominal supply. Multi-year cruise phases benefit from the device's proven flight heritage within the RTAX-S/SL family documented by Microchip.
推荐
推荐产品汇总
工程参考数据： RTAX250SL-1LG624V ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | RTAX250SL-1LG624B | RTAX250S-1LG624V | RTAX250SL-CG624B | RTAX250S-LG624B |
|---|---|---|---|---|---|
| Package | 624-ball ceramic CGA (LG624) | LG624 - same | LG624 - same | LG624 - same | LG624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 4224 | 4224 | 4224 | 4224 | 4224 |
| Speed Grade | -1 | -1 | -1 | Standard | Standard |
| Radiation Tolerance | Enhanced TID (SL) | Enhanced TID (SL) | Standard TID (S) | Enhanced TID (SL) | Standard TID (S) |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Screening Flow Suffix | V | B | V | B | B |
| Configuration Technology | Antifuse (OTP), live at power-up | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
关键差异点
- Enhanced total ionizing dose tolerance （对比 RTAX250S-1LG624V)
- Fastest speed grade in the LG624 SL offering （对比 RTAX250SL-CG624B)
- Flight screening (V suffix) （对比 RTAX250SL-LG624B)
设计说明
Antifuse FPGAs are one-time programmable: an incorrect programming operation permanently consumes a flight device. Always complete full RTL simulation, static timing analysis, and hardware validation on a PROTO prototype unit (which shares the same timing attributes as flight parts per the Microchip datasheet) before programming RTAX250SL-1LG624V flight stock. Maintain strict configuration control over programming files and programmer settings, and record programming lot data for mission traceability.
The RTAX250SL-1LG624V operates from a nominal 1.5V core supply. Use point-of-load regulation with low-noise LDOs or rad-tolerant DC-DC converters, and follow Microchip power-up sequencing recommendations so all supplies reach operating range in the specified order. Decouple each VCC/VCCA/VCCI domain with a network of ceramic capacitors placed close to the package balls; the 624-ball CGA exposes many supply balls, so plan the power plane stack-up early in layout.
The LG624 ceramic CGA has a 1.270 mm ball pitch, which permits conventional SMT assembly but requires careful pad geometry and solder-joint inspection (X-ray) for space-grade boards. Define fanout escape routing for the 624 balls within the board layer count budget, and honor the -55C to +125C operating envelope in material selection (high-Tg laminate). Follow IPC/JEDEC-compatible CGA mounting practice and Microchip application guidance for thermal cycling reliability in launch and orbit environments.
合规信息
Space-grade ceramic hermetic package; RoHS/REACH status should be confirmed via Microchip product pages and certificates for the exact screening suffix.
