RTAX250SL-1LG624V - 250K-Gate Rad-Tolerant FPGA | Microchip
MPN: RTAX250SL-1LG624V ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $1250 | $1,250.00 |
| 10 | $1180 | $11,800.00 |
| 100 | $1095 | $109,500.00 |
| 500 | $1020 | $510,000.00 |
| 1,000 | $950 | $950,000.00 |
Drop-in alternatives for RTAX250SL-1LG624V — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
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RTAX250SL-1LG624B
✅ Drop-In📋 Reference alternative (not in catalog)
RTAX250SL-LG624B
✅ Drop-In✓ In Stock
$2380 / Unit
View Datasheet →RTAX250SL-CG624B
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$3950 / Unit
View Datasheet →RTAX250S-1LG624V
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Contact for price
View Datasheet →RTAX250S-LG624V
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Contact for price
View Datasheet →RTAX250S-1LG624B
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$2020 / Unit
View Datasheet →RTAX250S-LG624B
✅ Drop-In✓ In Stock
$2350 / Unit
View Datasheet →RTAX250SL-1LG624V Maximum Ratings & Electrical Characteristics
| Equivalent System Gates | 250,000 gates |
| Logic Cells | 4224 |
| Configurable Logic Blocks (CLBs) | 2816 |
| Architecture | CMOS antifuse (Axcelerator-derived) |
| Family | RTAX-S/SL Radiation-Tolerant FPGA |
| Core Supply Voltage | 1.5 V nominal |
| Speed Grade | -1 |
| Package | 624-terminal ceramic CGA (LG624), 1.270 mm terminal pitch |
| Mounting Type | Surface Mount |
| Operating Temperature | -55C to +125C |
| Configuration Type | One-Time Programmable (antifuse) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Clock Resources | Segmentable clocks, chip-wide highway routing |
| Arithmetic Support | Dedicated carry logic |
| Application Domain | Space-flight systems |
RTAX250SL-1LG624V 624-terminal ceramic cga (lg624), 1.270 mm terminal pitch Pin Configuration Guide
Complete pinout information for RTAX250SL-1LG624V (624-terminal ceramic cga (lg624), 1.270 mm terminal pitch package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for RTAX250SL-1LG624V.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
RTAX250SL-1LG624V is suitable for 6 applications: Satellite Payload Data Processing, Spacecraft Command and Telemetry Interface, Onboard Sensor Front-End Preprocessing, Launch Vehicle Avionics, Prototype and Design Verification, Deep-Space Mission Digital Logic.
Satellite Payload Data Processing
The RTAX250SL-1LG624V fits satellite payload processing because its 250,000 gates and 2816 CLBs provide enough capacity for framing, compression, and packetization logic, while antifuse configuration eliminates configuration-upset risk in orbit. The embedded SRAM blocks with built-in FIFO control buffer high-rate sensor streams, and chip-wide highway routing sustains system-level data paths. Placed between payload ADCs and downlink formatters, the -1 speed grade supports fast system timing, and operation from -55C to +125C covers unheated payload bays. The SL enhanced TID rating extends usable mission life in high-radiation orbits.
Recommended
Spacecraft Command and Telemetry Interface
For command and telemetry handling, the RTAX250SL-1LG624V implements CCSDS-style protocol bridges, MIL-STD-1553 glue logic, and housekeeping aggregation in a single live-at-power-up chip - critical because avionics interfaces must function immediately at turn-on without configuration load time. Its segmentable clocks allow independent timing domains for the telemetry encoder and command decoder. With 4224 logic cells the part absorbs interface protocols that would otherwise need multiple ASICs. The 1.5V nominal core supply keeps overall bus power low, a key constraint on small satellites and deep-space probes.
Recommended
Onboard Sensor Front-End Preprocessing
Imaging and scientific instruments onboard spacecraft use the RTAX250SL-1LG624V to perform real-time sensor preprocessing such as correlated double sampling timing, data deserialization, and lossless compression. The dedicated carry logic accelerates arithmetic in compression engines, while embedded SRAM FIFOs absorb burst data from image sensors before downlink. Because antifuse configuration is immune to SEU-induced reconfiguration, the processing chain remains deterministic throughout the mission. The -55C to +125C range supports instruments mounted on externally exposed platforms that see extreme thermal cycling in eclipse and sunlit operations.
Recommended
Launch Vehicle Avionics
Launch vehicles demand logic that survives extreme vibration, wide temperature, and intense radiation belts during ascent. The RTAX250SL-1LG624V ceramic CGA package withstands mechanical stress better than plastic packages, and its -1 speed grade meets fast flight-control loop timing. Designers implement flight-event sequencing, redundant-voting logic, and bus interfaces in the 2816 available CLBs. Live-at-power-up operation guarantees that flight-critical logic is active from battery application, with no boot sequence. The SL TID enhancement covers trajectories passing through the Van Allen belts.
Recommended
Prototype and Design Verification
Microchip offers RTAX-S/SL prototype units that share the same timing attributes as flight devices but use non-hermetic ceramic packages, allowing design teams to validate RTL, timing closure, and board bring-up before committing to flight-screened RTAX250SL-1LG624V units. Because antifuse devices are one-time programmable, thorough verification on PROTO hardware is essential practice: functional simulation plus real hardware testing on prototypes reduces risk of irrecoverable programming errors on flight units. The Microchip Libero design suite flows from prototype to flight device without design changes.
Recommended
Deep-Space Mission Digital Logic
Deep-space probes experience total ionizing doses far beyond low-earth-orbit levels, making the RTAX250SL-1LG624V's enhanced SL TID performance a decisive selection factor. The antifuse fabric is inherently immune to configuration memory upsets, so mission planners avoid scrubbing controllers and configuration redundancy required by SRAM FPGAs. Its 4224 logic cells implement science-data formatting, autonomy logic, and fault-management state machines within tight power budgets from the 1.5V nominal supply. Multi-year cruise phases benefit from the device's proven flight heritage within the RTAX-S/SL family documented by Microchip.
Recommended
Recommended Products Summary
Engineering reference data for RTAX250SL-1LG624V — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | RTAX250SL-1LG624B | RTAX250S-1LG624V | RTAX250SL-CG624B | RTAX250S-LG624B |
|---|---|---|---|---|---|
| Package | 624-ball ceramic CGA (LG624) | LG624 - same | LG624 - same | LG624 - same | LG624 - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent Gates | 250,000 | 250,000 | 250,000 | 250,000 | 250,000 |
| Logic Cells | 4224 | 4224 | 4224 | 4224 | 4224 |
| Speed Grade | -1 | -1 | -1 | Standard | Standard |
| Radiation Tolerance | Enhanced TID (SL) | Enhanced TID (SL) | Standard TID (S) | Enhanced TID (SL) | Standard TID (S) |
| Core Supply Voltage | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal | 1.5 V nominal |
| Screening Flow Suffix | V | B | V | B | B |
| Configuration Technology | Antifuse (OTP), live at power-up | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) | Antifuse (OTP) |
Key Differentiators
- Enhanced total ionizing dose tolerance (vs RTAX250S-1LG624V)
- Fastest speed grade in the LG624 SL offering (vs RTAX250SL-CG624B)
- Flight screening (V suffix) (vs RTAX250SL-LG624B)
Design Notes
Antifuse FPGAs are one-time programmable: an incorrect programming operation permanently consumes a flight device. Always complete full RTL simulation, static timing analysis, and hardware validation on a PROTO prototype unit (which shares the same timing attributes as flight parts per the Microchip datasheet) before programming RTAX250SL-1LG624V flight stock. Maintain strict configuration control over programming files and programmer settings, and record programming lot data for mission traceability.
The RTAX250SL-1LG624V operates from a nominal 1.5V core supply. Use point-of-load regulation with low-noise LDOs or rad-tolerant DC-DC converters, and follow Microchip power-up sequencing recommendations so all supplies reach operating range in the specified order. Decouple each VCC/VCCA/VCCI domain with a network of ceramic capacitors placed close to the package balls; the 624-ball CGA exposes many supply balls, so plan the power plane stack-up early in layout.
The LG624 ceramic CGA has a 1.270 mm ball pitch, which permits conventional SMT assembly but requires careful pad geometry and solder-joint inspection (X-ray) for space-grade boards. Define fanout escape routing for the 624 balls within the board layer count budget, and honor the -55C to +125C operating envelope in material selection (high-Tg laminate). Follow IPC/JEDEC-compatible CGA mounting practice and Microchip application guidance for thermal cycling reliability in launch and orbit environments.
Compliance Information
Space-grade ceramic hermetic package; RoHS/REACH status should be confirmed via Microchip product pages and certificates for the exact screening suffix.
