RTAX250S-1LG624B - Rad-Tolerant FPGA 250K Gates | Microchip
料号： RTAX250S-1LG624B ✓ 量产中| 数量 | 单价 | 小计 |
|---|---|---|
| 1 | $2500 | $2,500.00 |
| 10 | $2380 | $23,800.00 |
| 100 | $2250 | $225,000.00 |
| 500 | $2130 | $1,065,000.00 |
| 1,000 | $2020 | $2,020,000.00 |
RTAX250S-1LG624B 概述
A radiation-tolerant FPGA is a field-programmable gate array engineered to survive the ionizing radiation environment of space: high total ionizing dose (TID), heavy-ion single-event effects (SEE), and proton exposure. Within the semiconductor hierarchy, the RTAX250S-1LG624B belongs to the RTAX-S family -> radiation-tolerant FPGA -> FPGA -> programmable logic IC, and is the space-flight counterpart of the commercial Axcelerator family from Microsemi.
Key features include single-chip, anti-fuse-based, live-at-power-up operation (no external configuration PROM needed, no configuration bitstream to upset), embedded SRAM blocks with built-in FIFO control logic, segmentable clock conditioning, and chip-wide highway routing. The -1 speed grade supports internal performance up to 649 MHz, and the CMOS 0.15um process with 1.5V core delivers low static power consumption, which is critical for solar- and battery-powered spacecraft.
Architecturally, the RTAX-S fabric combines patented antifuse interconnect with 3-input D-flip-flop-based logic modules, providing 100% routability and immunity to configuration memory upsets that plague SRAM-based FPGAs in orbit. The embedded FIFO control and chip-wide highway routing resources let designers implement high-throughput payload data paths with predictable timing.
Typical applications include satellite telemetry/command interfaces, payload data processing, orbital platform bus controllers, and launch-vehicle avionics, where the LG624 ceramic package provides hermetic, high-reliability mechanical and thermal integration.
Design tip: use the footprint-compatible Axcelerator prototyping flow (adaptor board plus EDIF netlist/pinout converter) to validate designs on commercial parts before committing to flight units.
This page synthesizes distributor inventory signals, drop-in alternatives, and practical design guidance not found in the manufacturer datasheet.
直接替换替代料： RTAX250S-1LG624B ——相同封装，引脚兼容。需要 PCB 改动的不同封装料号已排除。
本系列中的变体
可与以下型号直接替换的同系列型号： RTAX250S-1LG624B （相同外形与封装尺寸） ——差异在于 Package, Configuration, Radiation Tolerance, Family, Equivalent System Gates.
快速对比工具——选择替代料号进行并排对比：
RTAX250SL-LG624B
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$2380 / 个
查看数据手册 →RTAX250SL-CG624B
✅ 直接替换 ⚠️ 规格未核验✓ 有现货
$3950 / 个
查看数据手册 →RTAX250S-1LG624V
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX250S-LG624V
✅ 直接替换✓ 有现货
联系询价
查看数据手册 →RTAX250S-1LG624PROTO
✅ 直接替换📋 参考替代料（不在目录中）
RTAX250S-1LG624B 最大额定值与电气特性
| Family | RTAX-S Radiation-Tolerant FPGA |
| Equivalent System Gates | 250000 gates |
| Logic Cells (Modules) | 2816 cells |
| Registers / Logic Cells Total | 4224 logic cells |
| User I/O | 248 I/O |
| Core Supply Voltage | 1.5 V |
| Maximum System Frequency | 649 MHz |
| Process Technology | 0.15 um CMOS |
| Speed Grade | -1 |
| 封装 | 624-Pin LGA (LG624), ceramic |
| 工作温度 | -55C to +125C |
| Configuration | Anti-fuse, live at power-up (single chip) |
| Embedded Memory | Embedded SRAM with built-in FIFO control logic |
| Radiation Tolerance | Radiation-tolerant (RTAX-S class, per Microchip RTAX-S datasheet) |
| 安装类型 | Surface Mount |
| Program Numbering | B = Military program-level screening |
RTAX250S-1LG624B 624-pin lga (lg624), ceramic 引脚配置指南
RTAX250S-1LG624B（624-pin lga (lg624), ceramic 封装）的引脚配置。 该数字 IC 包含 GPIO、通信接口（UART、SPI、I2C）和电源引脚。请参阅制造商数据手册以了解复用引脚功能和配置选项。对嵌入式系统设计和 PCB 布局至关重要。
暂无详细引脚数据： RTAX250S-1LG624B.
请参阅 数据手册 以查看完整引脚配置。
典型应用
RTAX250S-1LG624B 适用于 6 应用s: Satellite Telemetry and Command (TM/TC) Interface, Payload Data Processing and Formatting, Onboard Bus Controller and Platform Avionics, Launch Vehicle Electronics, Radiation-Hardened Glue Logic Replacement, Space Instrumentation and Sensor Front-End Control.
Satellite Telemetry and Command (TM/TC) Interface
The RTAX250S-1LG624B fits TM/TC controller roles because its anti-fuse configuration is live at power-up and immune to configuration-memory upsets, so the command chain is functional immediately after separation events without relying on an external PROM that could be corrupted in orbit. With 2816 logic cells and 248 user I/O, it implements CCSDS-style frame formatting, command decoders, and redundant UART/MIL-STD-1553-style interfaces simultaneously on one chip. The 1.5V core on a 0.15um process keeps static power low, easing power-budget constraints on eclipse-mode operation. Ceramic LG624 hermetic packaging rated -55C to +125C supports spacecraft thermal-vacuum environments.
推荐
Payload Data Processing and Formatting
For payload data path control, the RTAX250S-1LG624B provides embedded SRAM with built-in FIFO control logic, letting designers implement elastic buffers between high-rate payload sensors and downlink formatters without external FIFO chips. Segmentable clocks and chip-wide highway routing support parallel data streams with predictable timing at speed grade -1 (up to 649 MHz internal performance class). The single-chip anti-fuse architecture eliminates configuration time after power-up, which matters for imaging payloads with short acquisition windows. Its 624-pin ceramic LGA supplies sufficient I/O (248 user pins) for wide data buses while maintaining hermeticity in vacuum.
推荐
Onboard Bus Controller and Platform Avionics
Spacecraft platform avionics need logic that works the moment the bus comes alive. The RTAX250S-1LG624B is live at power-up and requires no configuration sequence, making it ideal for bus arbiters, housekeeping controllers, and watchdog logic that must survive brownout and single-event upsets of other components. Its 250K-gate fabric is large enough to integrate a soft control core plus redundant interface state machines, while 1.5V core operation minimizes quiescent power in cruise mode. Military program-level screening (B suffix) and -55C to +125C ceramic LG624 construction align with platform avionics qualification flows.
推荐
Launch Vehicle Electronics
Launch-environment electronics demand extreme vibration tolerance and deterministic behavior within seconds of ignition. The RTAX250S-1LG624B contributes a hermetic 624-pin ceramic LGA that withstands mechanical stress better than organic-substrate packages, and its anti-fuse interconnect is static - no reconfiguration, scrubbing, or boot latency that could delay readiness. The 649 MHz-class fabric speed and -1 grade handle flight-sequence state machines, safing logic, and instrumentation interfaces. Operation from -55C to +125C covers booster thermal transients. Because it is single-chip, board area and mass are saved versus FPGA-plus-PROM solutions, an advantage on mass-critical stages.
推荐
Radiation-Hardened Glue Logic Replacement
Many space boards replace dozens of rad-hard ASSP glue functions (decoders, buffers, registers) with one RTAX250S-1LG624B. With 2816 logic cells and 248 user I/O, the device integrates address decoding, bus formatting, and sequencing logic while cutting component count, solder joints, and board mass. Anti-fuse configuration means the glue logic is correct at power-up and cannot be corrupted by SEUs in configuration memory - a decisive advantage over SRAM FPGAs in this role. The 1.5V, 0.15um CMOS fabric draws low static current. The LG624 footprint leaves I/O headroom for board-to-board interfaces and future netlist growth.
推荐
Space Instrumentation and Sensor Front-End Control
Scientific instruments - star trackers, spectrometers, particle detectors - need deterministic timing and clean clock segmentation close to the sensor. The RTAX250S-1LG624B provides segmentable clock conditioning and chip-wide highway routing to distribute sampling clocks with skew control, while embedded SRAM FIFOs absorb burst sensor data. Its 649 MHz-class internal fabric speed supports time-to-digital counting and coincidence logic implemented directly in fabric. The hermetic ceramic LG624 package with -55C to +125C rating suits instrument thermal cycles, and low 1.5V-core power reduces self-heating that would add sensor noise on thermally constrained optical benches.
推荐
推荐产品汇总
工程参考数据： RTAX250S-1LG624B ——对比、设计指导和合规信息。
选型指南
与替代料对比
| 参数 | 本产品 | RTAX250SL-LG624B | RTAX250SL-CG624B | RTAX250S-1LG624V | RTAX250S-LG624V | RTAX250S-1LG624PROTO |
|---|---|---|---|---|---|---|
| Package | 624-Pin ceramic LGA (LG624) | 624-Pin ceramic LGA (LG624) - same | 624-Pin ceramic LGA (LG624) - same | 624-Pin ceramic LGA (LG624) - same | 624-Pin ceramic LGA (LG624) - same | 624-Pin ceramic LGA (LG624) - same |
| Brand | Microchip Technology (Actel/Microsemi) | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Equivalent System Gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates | 250000 gates |
| Logic Cells | 2816 cells | 2816 cells | 2816 cells | 2816 cells | 2816 cells | 2816 cells |
| User I/O | 248 I/O | 248 I/O (enhanced I/O features) | 248 I/O (enhanced I/O features) | 248 I/O | 248 I/O | 248 I/O |
| Core Supply Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Screening Flow | B (military program-level) | B (military program-level) | C (program screening) | V | V | PROTO (engineering only, not flight) |
| Operating Temperature | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C | -55C to +125C |
关键差异点
- Single-chip live-at-power-up anti-fuse architecture （对比 RTAX250SL-LG624B)
- Military program-level B screening （对比 RTAX250S-1LG624V)
- Flight-qualified silicon （对比 RTAX250S-1LG624PROTO)
设计说明
The LG624 ceramic LGA requires a carefully specified land pattern and flatness-controlled PCB because ceramic LGA warpage over temperature can stress solder joints. Follow the RTAX-S/SL datasheet (ds2169) land-pattern recommendations for the LG624 footprint, and support inspection via X-ray under the full-array footprint since perimeter optical inspection cannot verify inner-row joints. Plan test access: with 248 user I/O on 624 pads, reserve boundary-scan (JTAG) chains as the primary electrical test strategy, since bed-of-nails probing under an LGA is impractical.
Power the 1.5V core, 2.5V and 3.3V I/O banks with sequenced, low-noise rails and decouple each supply with bulk plus high-frequency ceramic capacitance at the package corners, per the RTAX-S/SL datasheet power guidelines. Although RTAX-S is live at power-up, supply ramp monotonicity still matters for I/O precharge behavior. Estimated: because the antifuse fabric has low static power, most consumption in a 250K-gate design is dynamic and I/O-driven - budget based on your actual toggle rates rather than worst-case gate count.
Use the official footprint-compatible prototyping methodology: prototype on commercial Axcelerator (AX250) silicon via an adaptor board and convert the EDIF netlist and pinout for the RTAX250S target, per the application note 'Prototyping for RTAX-S and RTAX-SL Devices'. Do not assume the PROTO-suffix part (RTAX250S-1LG624PROTO) is flight-eligible - it is an engineering flow device. When substituting SL parts for S parts, re-verify I/O DC/AC parameters and screening documentation against your program's DLA/drawing requirements before release.
合规信息
Space-grade hermetic ceramic LGA part; RoHS/REACH status not stated in provided data - hermetic aerospace parts are typically covered by aerospace/defense exemptions. Request Microchip compliance certificate with order.
